• Transactions of the Korean Society of Mechanical Engineers A
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• v.29 no.11 s.242
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• pp.1503-1508
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• 2005

Scanning Thermal Microscope (STU) has been known for its superior resolution for local temperature and thermal property measurement. However, commercially available STU probe which is the key component of SThM does not provide resolution enough to explore nanoscale thermal phenomena. Here, we developed a SThM probe fabrication process that can achieve spatial resolution around 50 m. The batch-fabricated probe has a thermocouple junction located at the end of the tip. The size of the thermocouple junction is around 200 m and the distance of the junction from the very end of the tip is 150 m. The probe is currently being used for nanoscale thermal probing of nano-material and nano device.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.463-467
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• 2014

In this paper, the thermal behaviors of expanded graphite(EG)/erythritol composites with different contents of EG were studied. The surface and structure properties of the composites were determined by using scanning electron microscope (SEM), transmission electron microscope (TEM), and X-ray diffraction (XRD), respectively. The thermal properties were investigated by differential scanning calorimetry (DSC) and thermal conductivity (TC). As experimental results, the thermal conductivity of the composites increased with increasing the EG content. However, the latent heat was somewhat decreased in the presence of EG. We could concluded that EG was highly promising materials for improving the heat transfer enhancement and energy storage capacity of phase change materials (PCMs).

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.7
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• pp.829-836
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• 2003

Understanding of heat generation in semiconductor devices is important in the thermal management of integrated circuits and in the analysis of the device physics. Scanning thermal microscope was used to measure the temperature and the electric potential distribution on the cross-section of an operating metal-oxide-semiconductor field-effect transistor (MOSFET). The temperature distributions were measured both in DC and AC modes in order to take account of the leakage current. The measurement results showed that as the drain bias was increased the hot spot moved to the drain. The density of the iso-potential lines near the drain increased with the increase in the drain bias.

• Proceedings of the Korean Institute of Building Construction Conference
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• 2021.11a
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• pp.17-18
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• 2021

In the present study, Al-Zn coating was deposited by Arc thermal (AT) and plasma arc thermal (PAT) spray processes, and their corrosion characteristics were studied in 3.5% NaCl through electrochemical impedance spectroscopy (EIS), scanning electron microscope (SEM) and mechanical tests. The bond adhesion result showed that plasma arc sprayed coating had a higher value attributed to compact, dense, and less porous coating compared to arc thermal spray coating which contains defects/pores and uneven morphology as revealed by scanning electron microscope analysis. Electrochemical results revealed that the plasma arc sprayed coating had a high polarization resistance at early stage of immersion, suggesting its excellent corrosion protection performance.

• 제어로봇시스템학회:학술대회논문집
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• 2005.06a
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• pp.1115-1117
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• 2005

This paper describes the three dimension model and simulation results of a thermal actuator based on polyMUMPs process, known as thermal multimorph actuator. The device has potential application in micro-transducers such as atomic force microscope (AFM) tip and scanning tunneling microscope (STM) tip. This device made of a multi-layer materials stack together with consisted of polysilicon, $SiO_2$ and gold. A mask layout design, three dimension model and simulation results are reported and discussed.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.10
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• pp.800-809
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• 2008

Scanning Thermal Microscope (SThM) is the tool that can map out temperature or the thermal property distribution with the highest spatial resolution. Since the local temperature or the thermal property of samples is measured from the extremely small heat transferred through the nanoscale tip-sample contact, improving the sensitivity of SThM probe has always been the key issue. In this study, we develop a new design and fabrication process of SThM probe to improve the sensitivity. The fabrication process is optimized so that cantilevers and tips are made of thermally grown silicon dioxide, which has the lowest thermal conductivity among the materials used in MEMS. The new design allows much higher tip so that heat transfer through the air gap between the sample-probe is reduced further. The position of a reflector is located as far away as possible to minimize the thermal perturbation due to the laser. These full $SiO_2$ SThM probes have much higher sensitivity than that of previous ones.

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.21.2-21.2
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• 2005

• Journal of the Korean Society for Heat Treatment
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• v.32 no.3
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• pp.118-123
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• 2019

The aim of this study investigates the feasibility of scanning acoustic microscope (SAM) with high frequency transducer for material degradation. The test specimen was prepared by artificial heat treatment of Co-base superalloy. The high frequency 200 MHz acoustic lens was used to generate the leaky surface acoustic wave (LSAW) on the test specimens. The matrix precipitates coarsened with thermal aging time, and then grow up to several tens of micrometers. The velocity of LSAW decreased with increasing aging time. Also, it has a good correlation between LSAW and hardness. Consequently, V(z) curve methods of SAM using high frequency transducer is useful tool to evaluate the heat treatment effects on microstructure.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.49 no.1
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• pp.8-12
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• 2000

The properties variation by deterioration of the 600V grade heat-resistant polyvinyl chloride insulated wire(HIV) was analyzed. The weight variation of the thermal deteriorated HIV was about 42% at 80$0^{\circ}C$ and over. From the analysis result of the metallurgical microscope photographs it shows that the sorface of normal wire showed the elongated structures. However the elongated structures did not appear at $900^{\circ} and over and we could observe that particles were grown. The grown oxidized substances in the thermally deteriorated electric wire were observed by SEM. The CuL, CuK, $CuK_b$, OK and CIK spectra of the thermally deteriorated HIV at $300^{\circ}C$ were uniform regardless of the scanning length, but the spectra of CIK could not found at above $700^{\circ}. At the DTA analysis, the endothermic reactions were occurred around $3006{\circ}C\; and\; 400^{\circ}C$ and the exothermic reactions were occurred around $470^{\circ}, respectively.

• Korean Journal of Materials Research
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• v.18 no.1
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• pp.5-11
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• 2008

Thermally evaporated 10 nm-Ni/1 nm-Au/(30 nm-poly)Si structures were fabricated in order to investigate the thermal stability of Au-inserted nickel silicide. The silicide samples underwent rapid thermal annealing at $300{\sim}1100^{\circ}C$ for 40 seconds. The sheet resistance was measured using a four-point probe. A scanning electron microscope and a transmission electron microscope were used to determine the cross-sectional structure and surface image. High-resolution X-ray diffraction and a scanning probe microscope were employed for the phase and surface roughness. According to sheet resistance and XRD analyses, nickel silicide with Au had no effect on widening the NiSi stabilization temperature region. Au-inserted nickel silicide on a single crystal silicon substrate showed nano-dots due to the preferred growth and a self-arranged agglomerate nano phase due to agglomeration. It was possible to tune the characteristic size of the agglomerate phase with silicidation temperatures. The nano-thick Au-insertion was shown to lead to self-arranged microstructures of nickel silicide.