• 대한치과보철학회지
• /
• 제45권4호
• /
• pp.546-554
• /
• 2007

Statement of problem: Die materials require abrasion resistance, dimensional stability with time, and high surface wettability for adequate material properties. Wear of gypsum materials is a significant problem in the fabrication of accurately fitting cast prosthetic devices. So It has been recommended that the use of die hardener before carving or burnishing of the wax pattern. Purpose: The purpose of this study was to compare the abrasion resistance and surface microhardness(Knoop) with 3 commonly used gypsum die materials(MG Crystal Rock, Super plumstone, GC $FUJIROCK^{(R)}$ EP) with and without the application of 2 die hardeners. Material and methods: Three die materials were evaluated for abrasion resistance and surface microhardness after application of 2 die hardeners(Die hardener and Stone die & plaster hardener). Thirty specimens of each gypsum material were fabricated using an impression of resin die(Pattern resin; GC Corporation, Japan) with 1-mm high ridges, sloped 90 degrees. Gypsum materials were mixed according to manufacturer's recommendations and allowed to set 24 hours before coating. Specimens were arbitrary assigned to 1 of 3 treatment subgroups (n=10/subgroup): no treatment(control), coated with Die hardener, and coated with Stone die & plaster hardener. Abrasion resistance(measured by weight loss) was evaluated using device in 50g mass perpendicular to the ridges. Knoop hardness was determined by loading each specimen face 5 times for 15 seconds with a force of 50g. A scanning electron microscope was used to evaluate the surface of specimens in each treatment subgroup. Conclusions: The obtained results were as follows: 1. 3 types of die stone evaluated in this study did not show significant differences in surface hardness and abrasive resistance(P<.05). 2. In the abrasive resistance test, there were no significant differences between GC $FUJIROCK^{(R)}$ EP and MG Crystal Rock with or without 2 die hardener(P<.05). 3. Super plumstone treated with Stone die & plaster hardener showed increased wear loss(P<.05) 4. Die hardener coatings used in this study decreased the surface hardness of the gypsum material(P<.05).

• 대한치과보철학회지
• /
• 제38권2호
• /
• pp.200-213
• /
• 2000

Lasers have given dentistry a new rapid, economic, and accurate technique for metal joining. Although laser welding has been recommended as an accurate technique, there are some limitations with this technique. For example, the two joining surfaces must have a tight-fitting contact, which may be difficult to achieve in some situations. The tensile samples used for this study were made from a custom-made pure titanium and type III gold alloy plates. 27 of 33 specimens were sectioned perpendicular to their long axis with a carborundum disk and water coolant. Six specimens remained and served as the control group. A group of 6 specimens was posed as butt joints in custom parallel positioning device with a feeler gauge at each of three gaps : 0.00, 0.25. and 0.50mm. All specimens were then machined to produce a uniform cross-sectional dimension, none of the specimens was subjected to any subsequent form of heat treatment. Scanning electron microscopy was performed on representative tested specimens at fractured surfaces in both the parent metal and the weld. Vickers hardness was measured at the center of the welds with a micropenetrometer using a force of 300gm for 15 seconds. Measurement was made at approximately $200{\mu}m\;and\;500{\mu}m$ deep from each surface. One-way analysis of variance (ANOVA) and Scheffe's test was calculated to detect differences between groups. The purpose of this study is to compare the strength and properties of the joint achieved at various butt Joint gaps by the laser welding of type III gold alloy and pure titanium tensile specimens in an argon atmosphere. The results of this study were as follows : 1. When indexing and welding pure titanium, there was no decrease in ultimate tensile strength as compared with the unsectioned alloys for indexing gaps of 0.00 to 0.50mm, although with increasing gap size may come increased distortion (p>0.05). 2. When indexing and welding type III gold alloy, there were significant differences in ultimate tensile strength among groups with weld gaps of 0.00mm, 0.25 and 0.50mm, and the control group. Group with butt contact without weld gap demonstrated a significant higher ultimate tensile strength than groups with weld gaps of 0.25 and 0.50mm (p<0.05). 3. When indexing and welding the different metal combination of type III gold alloy and pure titanium, there were significant differences in ultimate tensile strength between groups with weld gaps of 0.00, 0.25, and 0.50mm. However, the mechanical properties of the welded joint would become too brittle to be acceptable clinically (p<0.05). 4. The presence of large pores in the laser welded joint appears to be the most important factor in controlling the tensile strength of the weld in both pure titanium and type III gold alloy.

• 대한소아치과학회지
• /
• 제47권1호
• /
• pp.70-77
• /
• 2020

이 연구의 목적은 악궁 전반적으로 조사가 가능한 미백 LED를 이용하여 우식원성 Streptococcus mutans에 대한 광역동 치료의 효과를 알아보기 위한 in vitro 연구이다. S. mutans를 각각 두가지 다른 단계의 상태로 배양하였다. Planktonic 상태와 Hydroxyapatite disk와 CDC biofilm reactor를 5일간 사용하여 동적인 바이오필름 상태를 형성하였다. 20 μM 로 희석한 erythrosine을 5분간 전처리한후 가정용 미백기와 진료실 미백기를 사용하여 각 15분씩 광조사를 시행하였다. 실험 종료 후 각 실험군의 Colony Forming Unit를 측정하였으며 공초점 레이저 현미경를 이용하여 각 조건에 따른 광역동 치료 효과를 비교하였다. 실험 결과 S. mutans에 대한 aPDT효과는 control군과 비교시에 각각 플랑크토닉상태와 동적인 바이오필름 상태에서 모두 통계적으로 유의한 광역동 치료 효과가 나타났다(각각 p = 0.001, p = 0.002). 하지만 동적인 바이오필름 상태에서는 플랑크토닉 상태보다 광역동치료에 내성을 지녀 항미생물 효과가 떨어지는 양상이 관찰되었다. 진료실용 미백 LED와 가정용 미백LED는 유사한 항미생물 효과를 나타냈다. 구강악궁 전반적 조사가 가능한 미백용 LED는 우식의 원인이 되는 S. mutans 바이오필름에 유의한 광역동 치료의 효과를 나타냈으며, 이러한 결과는 치아 우식 예방으로의 광역동 치료의 임상적 적용 가능성을 제시한다.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.463-463
• /
• 2014

Dye-sensitized solar cells (DSSCs) have generated a strong interest in the development of solid-state devices owing to their low cost and simple preparation procedures. Effort has been devoted to the study of electrolytes that allow light-to-electrical power conversion for DSSC applications. Several attempts have been made to substitute the liquid electrolyte in the original solar cells by using (2,2',7,7'-tetrakis (N,N-di-p-methoxyphenylamine)-9-9'-spirobi-fluorene (spiro-OMeTAD) that act as hole conductor [1]. Although efficiencies above 3% have been reached by several groups, here the major challenging is limited photoelectrode thickness ($2{\mu}m$), which is very low due to electron diffusion length (Ln) for spiro-OMeTAD ($4.4{\mu}m$) [2]. In principle, the $TiO_2$ layer can be thicker than had been thought previously. This has important implications for the design of high-efficiency solid-state DSSCs. In the present study, we have fabricated 3-D Transparent Conducting Oxide (TCO) by growing tin-doped indium oxide (ITO) nanowire (NWs) arrays via a vapor transport method [3] and mesoporous $TiO_2$ nanoparticle (NP)-based photoelectrodes were prepared using doctor blade method. Finally optimized light-harvesting solid-state DSSCs is made using 3-D TCO where electron life time is controlled the recombination rate through fast charge collection and also ITO NWs length can be controlled in the range of over $2{\mu}m$ and has been characterized using field emission scanning electron microscopy (FE-SEM). Structural analyses by high-resolution transmission electron microscopy (HRTEM) and X-Ray diffraction (XRD) results reveal that the ITO NWs formed single crystal oriented [100] direction. Also to compare the charge collection properties of conventional NPs based solid-state DSSCs with ITO NWs based solid-state DSSCs, we have studied intensity modulated photovoltage spectroscopy (IMVS), intensity modulated photocurrent spectroscopy (IMPS) and transient open circuit voltages. As a result, above $4{\mu}m$ thick ITO NWs based photoelectrodes with Z907 dye shown the best performing device, exhibiting a short-circuit current density of 7.21 mA cm-2 under simulated solar emission of 100 mW cm-2 associated with an overall power conversion efficiency of 2.80 %. Finally, we achieved the efficiency of 7.5% by applying a CH3NH3PbI3 perovskite sensitizer.

• 한국표면공학회지
• /
• 제38권4호
• /
• pp.144-149
• /
• 2005

ZnO박막을 R.F. sputtering방법으로 R.F Power와 기판온도를 공정변수로 하여 Si(100)과 $Al_2O_3(0001)$ 기판에 증착하였다. 공정변수에 따른 박막의 미세구조와 잔류응력 및 광학적 특성 등을 평가하였다. 전반적으로 R.F. Power증가에 따른 박막의 미세구조와 잔류응력 및 광학적 특성 등을 평가하였다. 전반적으로 R.F. Power증가에 따른 박막의 미세구조는 결정립이 커지면서 더 거칠어지는 것으로 나타났다. 기판온도 $800^{\cric}C$에서 증착된 박막의 경우, Si기판에 증착한 것보다 $Al_2O_3$기판에 증착된 박막의 막질이 우수한 것으로 나타났다. 박막의 잔류 응류변화는 R.F. Power 보다는 기판온도에 더 의존하는 것으로 나타났다. 대부분의 시편의 잔류응력이 공정변수인 기판온도가 증가할수록 작아지는 것으로 측정되었다. ZnO박막의 열안정성을 평가하기위해 열싸이클링을 실시하였다. 열싸이클링 결과 $Al_2O_3$(0001)기판에 증착된 박막이 Si(100)기판에 증착된 것보다 열안정성이 우수한 것으로 나타났다. PL측정의 경우, $Al_2O_3$기판에 증착된 ZnO박막이 Si기판에 증착된 것보다 UV영역의 발광이 크고 가시광선영역의 발광이 작은것으로 나타났다. 이것은 박막안의 결함이 작아서 낮은 잔류응력을 갖고 있기 때문인 것으로 생각된다.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2018년도 춘계학술대회 논문집
• /
• pp.102-102
• /
• 2018

Electronic industry had required the finer size and the higher performance of the device. Therefore, 3-D die stacking technology such as TSV (through silicon via) and micro-bump had been used. Moreover, by the development of the 3-D die stacking technology, 3-D structure such as chip to chip (c2c) and chip to wafer (c2w) had become practicable. These technologies led to the appearance of HBM (high bandwidth memory). HBM was type of the memory, which is composed of several stacked layers of the memory chips. Each memory chips were connected by TSV and micro-bump. Thus, HBM had lower RC delay and higher performance of data processing than the conventional memory. Moreover, due to the development of the IT industry such as, AI (artificial intelligence), IOT (internet of things), and VR (virtual reality), the lower pitch size and the higher density were required to micro-electronics. Particularly, to obtain the fine pitch, some of the method such as copper pillar, nickel diffusion barrier, and tin-silver or tin-silver-copper based bump had been utillized. TCB (thermal compression bonding) and reflow process (thermal aging) were conventional method to bond between tin-silver or tin-silver-copper caps in the temperature range of 200 to 300 degrees. However, because of tin overflow which caused by higher operating temperature than melting point of Tin ($232^{\circ}C$), there would be the danger of bump bridge failure in fine-pitch bonding. Furthermore, regulating the phase of IMC (intermetallic compound) which was located between nickel diffusion barrier and bump, had a lot of problems. For example, an excess of kirkendall void which provides site of brittle fracture occurs at IMC layer after reflow process. The essential solution to reduce the difficulty of bump bonding process is copper to copper direct bonding below $300^{\circ}C$. In this study, in order to improve the problem of bump bonding process, copper to copper direct bonding was performed below $300^{\circ}C$. The driving force of bonding was the self-annealing properties of electrodeposited Cu with high defect density. The self-annealing property originated in high defect density and non-equilibrium grain boundaries at the triple junction. The electrodeposited Cu at high current density and low bath temperature was fabricated by electroplating on copper deposited silicon wafer. The copper-copper bonding experiments was conducted using thermal pressing machine. The condition of investigation such as thermal parameter and pressure parameter were varied to acquire proper bonded specimens. The bonded interface was characterized by SEM (scanning electron microscope) and OM (optical microscope). The density of grain boundary and defects were examined by TEM (transmission electron microscopy).

• 마이크로전자및패키징학회지
• /
• 제8권3호
• /
• pp.49-53
• /
• 2001

유도결합형 플라즈마 (ICP-RIE) 장치를 이용하여 SBT ($SrBi_2Ta_2O_9$)/Si의 수직식각 실험을 하였다. 이와 같은 실험의 목적은 수직 단면구조의 강유전체 gate구조 및 capacitor 제조에 있어서 유효면적을 확보하고 parasitic effect를 최소화 하는 기술이 우수한 소자 특성을 얻기 위해 매우 중요한 기술이기 때문이다. $Ar/C1_2$를 반응가스로 사용하였으며 $Ar/C1_2$유량비를 각각 1, 0.8, 0.6, 0.4로 바꾸어 가면서 각 유량비에 대해 RF power를 700, 600, 500W로 변화시키는 동안 DC power를 각각 200, 150, 100, 50 W로 변화시키면서 식각 실험을 하였다. 식각조건 변화에 따른 수직 및 수평 식각율, 선택식각율, 감광막의 보호성, 리소그라피 조건에 따른 식각율 및 식각단면 구조의 특성, 식각율 변화에 따른 패턴 크기의 변화, SBT의 식각 단면 특성 등을 조사하였다. $Ar/C1_2$유량비가 0.8, RF power 700 W, DC power 200 W 일 때 식각속도는 1050 A/min으로 최적의 식각율을 확인하였다. 그리고 주사전자현미경의 관찰 결과 수 적도는 $82^{\circ}C$ 정도로 매우 양호함을 알 수 있었다.

• 한국전산구조공학회논문집
• /
• 제31권5호
• /
• pp.227-234
• /
• 2018

슬로싱과 같은 액체의 동적 거동을 측정하고 제어하는 연구가 다양한 공학분야에서 활발히 진행중이다. 건축공학분야에서도 건축물의 풍진동을 저감시키는 동조액체감쇠기의 연구에 액제 진동이 측정되고 있다. 본 논문에서는 기존 파고 측정 센서의 한계를 극복하기 위하여 레이저 장비 중 LDV와 스캐닝 장비 중 갈바노미터스캐너를 이용하여 동조액체감쇠기 내의 액체 진동을 측정하는 방법을 제안하고 검증하였다. LDV가 속도와 변위를 측정하는 원리를 기술하였고 갈바노미터스캐너의 구동 원리에 따라 LDV의 단일 포인트로 다점측정이 가능한 시스템을 구성하였다. 동조 액체감쇠기의 4점 액체 진동을 측정하여 각 점의 시간 영역 데이터를 기존에 사용하던 비디오 센싱 데이터와 비교하였고 파형 분석을 통해 진행파와 정상파를 구별할 수 있음을 확인하였다. 또한 측정 딜레이가 있는 데이터를 상호 상관을 취하여 특이값 분해를 하고 이론 및 비디오 센싱 결과와 일치하는 고유진동수와 모드형상을 도출하였다.

• 대한간호학회지
• /
• 제47권6호
• /
• pp.794-805
• /
• 2017

Purpose: Interface pressure is a factor that contributes to the occurrence of pressure injuries. This study aimed to investigate interface pressure at common sites of pressure injury (occipital, gluteal and peritrochanteric areas), to explore the relationships among risk factors, skin condition and interface pressure, and to identify risk factors influencing interface pressure. Methods: A total of 100 patients admitted to the intensive care unit were enrolled at a tertiary teaching hospital in Korea. Interface pressure was recorded by a scanning aid device (PalmQ). Patient data regarding age, pulmonary disease, Braden Scale score, body mass index, serum albumin, hemoglobin, mean blood pressure, body temperature, and oxygen saturation were included as risk factors. Data collected from July to September 2016 were analyzed using binary logistic regression. Results: The mean interface pressure of the occipital, gluteal, and right and left peritrochanteric areas were 37.96 (${\pm}14.90$), 41.15 (${\pm}16.04$), 53.44(${\pm}24.67$), and 54.33 (${\pm}22.80$) mmHg, respectively. Predictive factors for pressure injuries in the occipital area were age ${\geq}70$ years (OR 3.45, 95% confidence interval [CI]: 1.19~9.98), serum albumin deficit (OR 2.88, 95% CI: 1.00~8.26) and body temperature ${\geq}36.5^{\circ}C$ (OR 3.12, 95% CI: 1.17~8.17); age ${\geq}70$ years (OR 2.81, 95% CI: 1.10~7.15) in the right peritrochanteric area; and body temperature ${\geq}36.5^{\circ}C$ (OR 2.86, 95% CI: 1.17~6.98) in the left peritrochanteric area. Conclusion: Our findings suggest that old age, hypoalbuminemia, and high body temperature may be contributory factors to increasing interface pressure; therefore, careful assessment and nursing care of these patients are needed to prevent pressure injury. Further studies are needed to establish cutoff values of interface pressure for patients with pressure ulcers.

• 한국결정성장학회지
• /
• 제30권3호
• /
• pp.96-102
• /
• 2020

본 논문에서는 6H-SiC (0001) 기판 위에 AlN 에피층을 혼합 소스 수소화물 기상 에피택시 방법에 의해 성장하였다. 시간당 5 nm의 성장률로 0.5 ㎛ 두께의 AlN 에피층을 얻었다. FE-SEM과 EDS 결과를 통해 6H-SiC (0001) 기판 위에 성장된 AlN 에피층 표면을 조사하였다. HR-XRD와 계산식을 통해 전위 밀도를 예측하였다. 1.4 × 10⁹ cm^-2의 나사 전위 밀도와 3.8 × 10⁹ cm^-2의 칼날 전위 밀도를 가지는 우수한 결정질의 AlN 에피층을 확인하였다. 혼합소스 HVP E 방법에 의해 성장된 6H-SiC 기판 위의 AlN 에피층은 전력소자 등에 응용이 가능할 것으로 판단된다.