• Title/Summary/Keyword: Sawing machine

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A study on the characteristics of intelligent sawing system for band saw (띠톱기계의 스마트 톱 절삭 시스템의 특성에 관한연구)

  • LUO, luPing;DING, zelin;DING, shengxia;JIANG, Ping;FAN, li;XIAO, leihua;PAN, bosong;An, Boyoung;Eum, Younseal;Han, Changsoo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.21 no.2
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    • pp.195-204
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    • 2020
  • To help solve the problems of how to set the optimal sawing force and the optimal controller parameters for different sawing conditions, a mathematical model of a proposed sawing system was established according to the principle of sawing force control. The conventional PID control method was then used for further research of the closed-loop control of the sawing force. Finally, through simulation and experimental research, the influence rule of the controller parameters and sawing load on the control performance and the relationships between the sawing width and controller parameters (proportion coefficient) and the sawing force setting value were obtained, from which a system scheme for intelligent sawing control of a band sawing machine was proposed. The research shows that the sawing efficiency of the intelligent sawing system was 18.1 (48%) higher than that of the original sawing system when sawing a grooved section sawing material, which verifies the good control effect of the proposed scheme.

The Mechanical Modeling and design of saw frame in band sawing machine (띠톱기계 톱대의 역학적 모델링 및 설계)

  • LUO, luPing;DING, zelin;DING, shengxia;JIANG, Ping;FAN, li;XIAO, leihua;PAN, bosong;An, Boyoung;No, Joonkkyu;Li, Wenqi;Han, Changsoo
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.20 no.12
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    • pp.390-397
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    • 2019
  • A mechanical model of band sawing saw frame was established according to an analysis of a commonly used saw-frame structure diagram to overcome the problems of low service life, substandard cutting precision and efficiency, and high manufacturing cost caused by the unreasonable design of saw frame. Taking a particular type of sawing machine as an example, stress cycle analysis of the saw blade was carried out according to the mechanical model of the saw frame, and the fatigue analysis model of the most dangerous cross-section point that was most prone to fatigue failure of the saw blade was then established. The fatigue analysis result was used as the basis for the improved design of the saw frame, and the improved detailed saw-frame design parameters were obtained. The results suggested that the saw frame system is much more compact and the saw blade force met the fatigue strength requirements through the improved design. In addition, the service life of the saw blade and the cutting precision were increased. The established mechanical model of the saw frame in this paper is used widely and has high practical application values.

A Study on the used Commutator of Sawing Machine (정류자를 이용한 절삭기계 개발에 관한 연구)

  • Choi, Jae-Hyok;Lee, Jong-Hyung;Lee, Chang-Heon;Byun, Jae-Hyuk;Lee, Jae-Yul;Ro, Seung-Hoon
    • Journal of the Korean Society of Industry Convergence
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    • v.11 no.3
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    • pp.121-125
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    • 2008
  • Commutator which plays the major role in switching electric currents from AC to DC is composed of copper and molding compound. The longevity of the DC motors are mostly hampered by the improper machining of the parts. Smooth surface will be mandatory to create the proper air gap of the commutator. In this thesis the selection of the proper materials and tools, the design and analysis of machine structure and the final test procedures have been investigated to achieve the smooth cut surface of the commutators. The performance and the product of the newly manufactured machine has been compared with those of the existing one. And the test result shows the new sawing machine has better overall efficiency and durability.

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A Study on Cutting Force during Multi Wire Sawing of Silicon Wafers for Solar Cells (태양전지용 실리콘 웨이퍼의 멀티 와이어 쏘잉 시 절삭저항력에 관한 연구)

  • Hwang, In-Hwan;Park, Sang-Hyun;An, Kuk-Jin;Kwun, Geon-Dae;Lee, Chan-Jong
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.15 no.3
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    • pp.66-71
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    • 2016
  • Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

A Mechanistic Model for the Prediction of Cutting Forces in Band Sawing (톱기계에서 절삭력 예측을 위한 역학모델)

  • Jung, Hoon;Ko, Tae-Jo;Kim, Hee-Sool
    • Journal of the Korean Society for Precision Engineering
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    • v.15 no.5
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    • pp.145-152
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    • 1998
  • In this research, in order to predict the cutting force using a mechanistic model, specific cutting force was firstly obtained through the cutting experiments. Band sawing process is similar to a milling, that is multi-point cutting. Therefore it is not easy matter to evaluate specific cutting force. Thus, the thickness of workpiec was made smaller than one pitch of the saw in terms of fly cutting in the face milling process. Then the cutting force was predicted by analyzing the geometric shape of a saw tooth The tooth shape used in the research was raker set style that was generally used in band sawing. And a set of teeth is comprised of three teeth, those are ranked as left, straight and right. The mechanistic model was developed in this study considered those shapes of each tooth. From the validation experiments, the predicted cutting forces coincided well with the measured ones. Therefore the predicted cutting forces can be used for the adaptive control of saw engaging feed rate in the band sawing.

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Design of the Supporting Structure of a Wire Saw for the Solar Cell Wafer (태양전지 웨이퍼용 Wire Saw안정화를 위한 지지구조 개선)

  • Yi, Il Hwan;Ro, Seung Hoon;Kim, Dong Wook;Park, In Kyu;Kil, Sa Geun;Kim, Young Jo
    • Journal of the Semiconductor & Display Technology
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    • v.17 no.3
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    • pp.59-64
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    • 2018
  • In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

Performance Evaluation of Dicing Sawing of High-densified Al2O3 Bulk using Diamond Electroplated Band-saw Machine (다이아몬드전착 밴드쏘우장비를 이용한 고치밀도 알루미나소결체의 다이싱가공 성능평가)

  • Lee, Yong-Moon;Park, Young-Chan;Kim, Dong-Hyun;Lee, Man-Young;Kang, Myung Chang
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.16 no.6
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    • pp.1-6
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    • 2017
  • Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

Estimation of cutting forces in band sawing (톱절삭에서의 절삭력 예측)

  • Jung, Hoon;Baek, Dae-Kyun;Ko, Tae-Jo;Kim, Hee-Sool
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1996.11a
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    • pp.31-35
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    • 1996
  • The cross section of the circular rod type workpiece to be cut in the band saw machine is variable at every moment in the sawing process. When the cutting feed rate is fixed to the constant speed, the cutting edges of the band saw teeth are also variabl eat any moment, so this causes the wear of the land saw teeth and the deterioration of the quality in the surface roughness. In this study, to work out this kind of problem basically, the mean cutting force of a tooth in the band saw was estimated by using the workpiece which was smaller than the interval of each tooth, i.e. band saw pitch, in the thickness. Then the static cutting forces were predicted by appling the mean cutting forces referred above to the mechanistic cutting force model which were analyzed through the geometric profile of a band saw tooth.

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PC 기반의 다이싱 공정 자동화 시스템 개발

  • 김형태;양해정;송창섭
    • Journal of the Korean Society for Precision Engineering
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    • v.17 no.3
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    • pp.47-57
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    • 2000
  • In this study, PC-based dicing machine and driving software were constructed for the purpose of automation of wafer cutting process. To automate the machine, hard automation including vision, loading, and software were considered in the development. Auto loading device and vision system were adopted for the increase of productivity, GUI software programmed for the expedient operation. The dicing machine is operated by the control algorithm and some parameters. It is verified that this kind of PC based automation has a great potential compared with the conventional dicing machine when applied to manufacturing some kinds of wafers as a test purpose.

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