• 한국산학기술학회논문지
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• 제21권2호
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• pp.195-204
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• 2020

본 연구에서는 띠톱기계의 서로 다른 톱 절삭 상태에서, 최적의 톱 절삭력 및 최적의 컨트롤러 파라미터가 어떻게 설정 되는지에 대한 문제를 해결하기 위한 연구를 진행하였다. 이를 위해 띠톱 기계의 톱 절삭 시스템의 수학적 모형을 수립하고, 전통적인 PID 제어 방법과 톱 절삭력의 폐회로(closed-loop)제어에 대하여 병행하여 깊게 연구함으로써, 주 모터의 동력, 띠톱기계의 동적특성 및 톱날 강도 등의 컨트롤러 파라미터 및 톱 절삭 부하가 제어 성능에 대한 규칙을 발견하여, 톱 절삭 너비와 컨트롤러 파라미터(비례계수 K_p)의 관계, 톱 절삭력의 설정값의 관계를 얻어, 일종의 띠톱 기계의 스마트 톱 절삭 제어를 갖는 시스템 방안을 제기하였다. 연구 결과에 따르면 홈 절단면의 절삭 재료를 톱 절삭 시 스마트 톱 절삭 시스템의 톱 절삭 효율이 기존 톱 절삭 시스템보다 18.1㎠/min(48%) 향상 되였으며, 이 방안이 뛰어난 제어 효과를 가지고 있음을 보여 주었다.

• 한국산학기술학회논문지
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• 제20권12호
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• pp.390-397
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• 2019

현대 제조 공업이 고효율, 고정밀도와 경제적인 방향으로 발전 하면서 금속을 절단하는 띠톱 기계는 이미 철강, 기계, 자동차, 조선, 석유, 광산, 항공 우주 등 다양한 영역에서 광범위 하게 활용 되고 있다. 하지만 기존의 띠톱 기계들은 경험적으로 설계 되어져 왔으며 따라서 낮은 수명, 톱질 동작 상태에서 낮은 정밀도 및 저효율을 문제와 높은 제조원가 문제를 가지고 있다. 본 논문에서는 띠톱의 역학적 해석을 통해 띠톱 톱대의 설계 파라미터를 개선하는 방법을 제시 하였다. 실제로 빈번하게 사용 되고 있는 띠톱 기계를 모델링 하여 응력 분석, 피로해석을 시행 하였으며 이에 따라 톱대의 상세한 설계 파라미터를 도출 하였다. 그 결과 피로 강도가 피로 요구 사항을 만족 시키고 띠톱 기계의 정밀도와 효율이 크게 향상 되는 것을 확인할 수 있었다.

• 한국산업융합학회 논문집
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• 제11권3호
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• pp.121-125
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• 2008

Commutator which plays the major role in switching electric currents from AC to DC is composed of copper and molding compound. The longevity of the DC motors are mostly hampered by the improper machining of the parts. Smooth surface will be mandatory to create the proper air gap of the commutator. In this thesis the selection of the proper materials and tools, the design and analysis of machine structure and the final test procedures have been investigated to achieve the smooth cut surface of the commutators. The performance and the product of the newly manufactured machine has been compared with those of the existing one. And the test result shows the new sawing machine has better overall efficiency and durability.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 추계학술대회 논문집
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• pp.303-304
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• 2010

• 한국기계가공학회지
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• 제15권3호
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• pp.66-71
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• 2016

Reducing the wafer breakage rate and sawing thinner wafers will decrease the cost of solar cells. This study was carried out in order to identify ways to achieve this goal. In this study, the cutting force characteristics using an ingot tilting-type diamond multi wire-sawing machine were analyzed. The cutting force was analyzed while varying the tilting angles and wire speed. The obtained data were analyzed by classifying the tangential cutting force and the normal cutting force. In this cutting force experiment, the difference between the forces was confirmed; it was found that it rises with increasing the tilting angles and decreases when the wire speed elevates. The resulting value can be utilized as basic data for the determination of an ideal cutting recipe.

• 한국정밀공학회지
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• 제15권5호
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• pp.145-152
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• 1998

In this research, in order to predict the cutting force using a mechanistic model, specific cutting force was firstly obtained through the cutting experiments. Band sawing process is similar to a milling, that is multi-point cutting. Therefore it is not easy matter to evaluate specific cutting force. Thus, the thickness of workpiec was made smaller than one pitch of the saw in terms of fly cutting in the face milling process. Then the cutting force was predicted by analyzing the geometric shape of a saw tooth The tooth shape used in the research was raker set style that was generally used in band sawing. And a set of teeth is comprised of three teeth, those are ranked as left, straight and right. The mechanistic model was developed in this study considered those shapes of each tooth. From the validation experiments, the predicted cutting forces coincided well with the measured ones. Therefore the predicted cutting forces can be used for the adaptive control of saw engaging feed rate in the band sawing.

• 반도체디스플레이기술학회지
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• 제17권3호
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• pp.59-64
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• 2018

In recent years, the solar cell market has steadily grown with the demand for new energies. And wire sawing is one of the most critical processes in manufacturing solar cell wafer which is supposed to affect the breakage of wafers most during the process and afterwards. Generally, the defects of the wafers are generated from the structural vibrations of the machine. In the sawing process, the vibrations cause unnecessary normal stress on the cut surface of wafers, and eventually create the surface damage or leave the residual stress. In this study, the dynamic properties of a wire saw have been analyzed through the frequency response test and the computer simulation. And the effects of the design alterations have been investigated to stabilize the machine structure and further to reduce the vibrations. The result shows that relatively simple design alterations of supporting structure without any change of major parts of the machine can suppress the vibrations of the machine effectively.

• 한국기계가공학회지
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• 제16권6호
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• pp.1-6
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• 2017

Recently, the brittle materials such as ceramics, glass, sapphire and textile material have been widely used in semiconductors, aerospace and automobile owing to high functional characteristics. On the other hand, it has the characteristics of difficult-to-cut material relative to all materials. In this study, diamond electro-deposited band-saw machine was developed to operate stably using water-coolant type through relative motion between band-saw tool and $Al_2O_3$ material. High densified $Al_2O_3$ material was manufactured by spark plasma sintering method. The bulk density was observed by the Archimedes law and the theoretical density was estimated to be $3.88g/cm^3$ and its hardness 14.7 MPa. From the dicing sawing test of $Al_2O_3$ specimen, behavior of surface roughness and band-saw wear are dominantly affected by the increase of the band-saw linear velocity. Additionally, an continuous pattern type of diamond band-saw was a very effective due to entry impact as a one-off for brittle material.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 1996년도 추계학술대회 논문집
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• pp.31-35
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• 1996

The cross section of the circular rod type workpiece to be cut in the band saw machine is variable at every moment in the sawing process. When the cutting feed rate is fixed to the constant speed, the cutting edges of the band saw teeth are also variabl eat any moment, so this causes the wear of the land saw teeth and the deterioration of the quality in the surface roughness. In this study, to work out this kind of problem basically, the mean cutting force of a tooth in the band saw was estimated by using the workpiece which was smaller than the interval of each tooth, i.e. band saw pitch, in the thickness. Then the static cutting forces were predicted by appling the mean cutting forces referred above to the mechanistic cutting force model which were analyzed through the geometric profile of a band saw tooth.

• 한국정밀공학회지
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• 제17권3호
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• pp.47-57
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• 2000

In this study, PC-based dicing machine and driving software were constructed for the purpose of automation of wafer cutting process. To automate the machine, hard automation including vision, loading, and software were considered in the development. Auto loading device and vision system were adopted for the increase of productivity, GUI software programmed for the expedient operation. The dicing machine is operated by the control algorithm and some parameters. It is verified that this kind of PC based automation has a great potential compared with the conventional dicing machine when applied to manufacturing some kinds of wafers as a test purpose.