• Title/Summary/Keyword: Sandwich structure

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Cyanide-bridged Trinuclear and Ethylenediamine-bridged One-dimensional Cobalt(III)-Manganese(II) Complexes: Synthesis, Crystal Structures and Magnetic Properties

  • Zhang, Daopeng;Zhang, Lifang;Zhao, Zengdian;Ni, Zhonghai
    • Bulletin of the Korean Chemical Society
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    • v.32 no.8
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    • pp.2544-2548
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    • 2011
  • Two pyridinecarboxamide cobalt dicyanide building blocks and Mn(III) compounds have been employed to assemble cyanide-bridged heterometallic complexes, resulting in three trinuclear cyanide-bridged $Co^{III}-Mn^{II}$ complexes: $\{[Mn(MeOH)_4][Co(bpb)(CN)_2]_2\}{\cdot}2MeOH{\cdot}2H_2O$ (1), $\{[Mn(MeOH)_4][Co(bpmb)(CN)_2]_2\}{\cdot}2MeOH{\cdot}2H_2O$ (2) and $\{[Mn(DMF)_2(en)_2][Co(bpb)(CN)_2]_2\}{\cdot}2DMF{\cdot}H_2O$ (3) ($bpb^{2-}$ = 1,2-bis(pyridine-2-carboxamido)benzenate, $bpmb^{2-}$ = 1,2-bis(pyridine-2-carboxamido)-4-methyl-benzenate, en = ethylenediamine). Single crystal X-ray diffraction analysis shows their similar sandwich-like structures, in which the two cyanide-containing building blocks act as monodentate ligands through one of their two cyanide groups to coordinate the Mn(II) center. For complex 3, it was further linked into one-dimensional structure by ethylenediamine acting as bridges. Investigation of the magnetic properties of complex 3 reveals weak antiferromagnetic coupling between the neighboring Mn(II) centers through the bridging ethylenediamine molecule. A best-fit to the magnetic susceptibilities of complex 3 gave the magnetic coupling constant J = -0.073(2) $cm^{-1}$.

A numerical and theoretical investigation on composite pipe-in-pipe structure under impact

  • Wang, Yu;Qian, Xudong;Liew, J.Y. Richard;Zhang, Min-Hong
    • Steel and Composite Structures
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    • v.22 no.5
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    • pp.1085-1114
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    • 2016
  • This paper investigates the transverse impact response for ultra lightweight cement composite (ULCC) filled pipe-in-pipe structures through a parametric study using both a validated finite element procedure and a validated theoretical model. The parametric study explores the effect of the impact loading conditions (including the impact velocity and the indenter shape), the geometric properties (including the pipe length and the dimensions of the three material layers) as well as the material properties (including the material properties of the steel pipes and the filler materials) on the impact response of the pipe-in-pipe composite structures. The global impact responses predicted by the FE procedure and by the theoretical model agree with each other closely. The parametric study using the theoretical approach indicates the close relationships among the global impact responses (including the maximum impact force and the maximum global displacement) in specimens with the equivalent thicknesses, proposed in the theoretical model, for the pipe-in-pipe composite structures. In the pipe-in-pipe composite structure, the inner steel pipe, together with the outer steel pipe, imposes a strong confinement on the infilled cement composite and enhances significantly the composite action, leading to improved impact resistance, small global and local deformations.

Fabrication of Nickel Oxide Film Microbolometer Using Amorphous Silicon Sacrificial Layer (비정질 실리콘 희생층을 이용한 니켈산화막 볼로미터 제작)

  • Kim, Ji-Hyun;Bang, Jin-Bae;Lee, Jung-Hee;Lee, Yong Soo
    • Journal of Sensor Science and Technology
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    • v.24 no.6
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    • pp.379-384
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    • 2015
  • An infrared image sensor is a core device in a thermal imaging system. The fabrication method of a focal plane array (FPA) is a key technology for a high resolution infrared image sensor. Each pixels in the FPA have $Si_3N_4/SiO_2$ membranes including legs to deposit bolometric materials and electrodes on Si readout circuits (ROIC). Instead of polyimide used to form a sacrificial layer, the feasibility of an amorphous silicon (${\alpha}-Si$) was verified experimentally in a $8{\times}8$ micro-bolometer array with a $50{\mu}m$ pitch. The elimination of the polyimide sacrificial layer hardened by a following plasma assisted deposition process is sometimes far from perfect, and thus requires longer plasma ashing times leading to the deformation of the membrane and leg. Since the amorphous Si could be removed in $XeF_2$ gas at room temperature, however, the fabricated micro-bolomertic structure was not damaged seriously. A radio frequency (RF) sputtered nickel oxide film was grown on a $Si_3N_4/SiO_2$ membrane fabricated using a low stress silicon nitride (LSSiN) technology with a LPCVD system. The deformation of the membrane was effectively reduced by a combining the ${\alpha}-Si$ and LSSiN process for a nickel oxide micro-bolometer.

The Development of Structural Test Facility for the Strength Assessment of CFRP Marine Leisure Boat (탄소섬유강화플라스틱 재료 레저선박의 구조강도 평가를 위한 시험설비 구축과 운용에 관한 연구)

  • Jeong, Han Koo;Zhang, Yang;Yum, Deuk Joon
    • Journal of the Society of Naval Architects of Korea
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    • v.54 no.4
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    • pp.312-320
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    • 2017
  • This paper deals with the development of structural test facility for the strength assessment of marine leisure boat built from carbon fiber reinforced plastics (CFRP) materials. The structural test facility consists of test jig, load application and control system, and data acquisition system. Test jig, and load application and control system are designed to accommodate various size and short span to depth ratios of single skin, top-hat stiffened and sandwich constructions in plated structural format such as square and rectangular shapes. A lateral pressure load, typical and important applied load condition to the plates of the hull structure for marine leisure boat, is simulated by employing a number of hydraulic cylinders operated automatically and manually. To examine and operate the structural test facility, five carbon/epoxy based FRP square plates having the test section area of $1m^2$, which are part of CFRP marine leisure boat hull, are prepared and they are subjected to monotonically increasing lateral pressure loads. In the test preparation, considering the symmetry of the plates geometry, various strain gauges and linear variable displacement transformer are used in conjunction with data acquisition system utilizing LabVIEW. From the test observation, the responses of the CFRP hull structure of marine leisure boat are understood by obtaining load to deflection and strain to load curves.

A Improvement Plan for Fire Fighting Activity of Rack- Type Warehouse Based on Case Study and Field Interview (사례분석과 현장인터뷰를 통한 적층형 대형창고 소방활동 개선방안 연구)

  • Kim, Woon Hyung;Seo, Dong Hun;Ham, Eun Gu
    • Journal of the Society of Disaster Information
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    • v.15 no.1
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    • pp.67-75
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    • 2019
  • Purpose: The purpose of this study is to suggest a systematic improvement plan for strengthening fire fighting ability of domestic rack- type warehouse buildings. Method: A fire case of small warehouse with sandwich panel structure and four design review of large warehouse with fire endurance structure were analyzed. Also, interviewed a group of 11 fire fighters who had 20 years field experience. Results: A provision of mobile equipment for initial fire fighting, accessibility of more than three sides, installation of internal entrance windows, proper placement of outdoor fire fighting equipment, image processing of fire site informations, and provide more incentives on the field commander are main factors of improvement plan. Conclusion: Effective standard operation procedures (SOP) and safety standards should be established and applied for each stage of the dispatch and on-site response considering the fire characteristics and risk factors of each warehouse by scale.

A Study on the Strength and Stiffness of Multi-Stage Cubic Truss Unit Structures (복합 입체형 정육면체 트러스 단위구조체의 강도 및 강성에 대한 해석 연구)

  • Choi, Jeongho
    • Journal of the Korea Convergence Society
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    • v.10 no.4
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    • pp.139-145
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    • 2019
  • This paper investigated the strength and stiffness of composite truss unit structures. The model used is a core-filled model combining the Kagome model and the cube truss model. The material properties used for the analysis are 304 stainless steel with elastic modulus of 193 GPa and yield stress of 215 MPa. The theoretical equation is derived from the relative elasticity relation of Gibson - Ashby ratio, the analysis was performed using Deform 3D, a commercial tool. In conclusion, the relative elasticity for this unit model correlates with 1.25 times the relative density and constant coefficient, elasticity is inversely proportional to pore size. The relative compressive strength has a correlation with relative density of 1.25 times. Proof of this is a real experiment, the derived theoretical relationship should further consider mechanical behavior such as bending and buckling. In the future, it is hoped that the research on the elasticity and the stress according to the structure of the three-dimensional space will be continued.

Flip Chip Process by Using the Cu-Sn-Cu Sandwich Joint Structure of the Cu Pillar Bumps (Cu pillar 범프의 Cu-Sn-Cu 샌드위치 접속구조를 이용한 플립칩 공정)

  • Choi, Jung-Yeol;Oh, Tae-Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.16 no.4
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    • pp.9-15
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    • 2009
  • Compared to the flip-chip process using solder bumps, Cu pillar bump technology can accomplish much finer pitch without compromising stand-off height. Flip-chip process with Cu pillar bumps can also be utilized in radio-frequency packages where large gap between a chip and a substrate as well as fine pitch interconnection is required. In this study, Cu pillars with and without Sn caps were electrodeposited and flip-chip-bonded together to form the Cu-Sn-Cu sandwiched joints. Contact resistances and die shear forces of the Cu-Sn-Cu sandwiched joints were evaluated with variation of the height of the Sn cap electrodeposited on the Cu pillar bump. The Cu-Sn-Cu sandwiched joints, formed with Cu pillar bumps of $25-{\mu}m$ diameter and $20-{\mu}m$ height, exhibited the gap distance of $44{\mu}m$ between the chip and the substrate and the average contact resistance of $14\;m{\Omega}$/bump without depending on the Sn cap height between 10 to $25\;{\mu}m$.

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Investigation of Properties of Structural Foam with Different Conformation and via Thermal Aging Condition (구조용 폼의 조성 및 열 노화에 따른 변형특성 관찰)

  • Choe, Jin-Yeong;Kwon, Il-Jun;Park, Sung-Min;Kwon, Dong-Jun
    • Composites Research
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    • v.31 no.4
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    • pp.122-127
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    • 2018
  • Sandwich composites of carbon fiber reinforced plastic(CFRP) and polymer foam will be used to automobile and aerospace industry according to increasing importance of light weight. In this study, mechanical and heat resistance properties of sandwich composites were compared with type of polymer foam (polyethylene terephthalate(PET), polyvinylchloride(PVC), epoxy and polyurethane). All types of polymer foams were degraded to 30, 60, 120, 180 minutes in $180^{\circ}C$. After heat degradation, the polymer foams were observed using optical microscope and compressive test was performed using universal testing machine(UTM). Epoxy foam had the highest compressive property to 2.6 MPa and after thermal degradation, the mechanical property and structure of foam were less changed than others. Epoxy foam had better mechanical properties than other polymer foams under high temperature. Because the epoxy foam was post cured under high temperature. As the results, Epoxy foam was optimal materials to apply to structures that thermal energy was loaded constantly.

A Study on Applicability of Low-Density Surface Film Copper Mesh for Aircraft (저밀도 표면필름 구리망의 비행체 적용 가능성 연구)

  • Hyun, Se-Young;Kim, Yong-Tae;Kim, Sang-Yong;Kim, Bong-Gyu
    • Journal of the Korean Society for Aeronautical & Space Sciences
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    • v.49 no.10
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    • pp.841-847
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    • 2021
  • In this paper, the applicability of the low-density surface film copper mesh for aircraft applications have been analyzed. Recently, low-density surface film copper mesh is developed to reduce weight and cost compared with traditional surface film copper mesh. In order to apply low-density surface film copper mesh to aircraft, it is needed to analyze its electromagnetic effects as well as structural integrity with sandwich panels to prevent pinholes. The structural integrity and electromagnetic characteristics have been analyzed for 2 samples of low-density surface film copper mesh and 1 sample of surface film copper mesh. To review the applicability of the low-density surface film, it is combined with sandwich composite panel to confirm pinhole effects. The low-density surface film has been modeled as a periodic structure and analyzed with 3D electromagnetic simulation tool. The simulation results has been verified through measured electromagnetic transmission results using free space measurements. From the results, it will be possible to use these results for the analysis and the applicability of low-density surface film copper mesh for aircraft.

Nanostructured energy harvesting devices and their applications for IoT sensor networks (나노구조체 에너지 하베스팅 소자와 IoT 센서 네트워크의 융합 연구)

  • Yoon, Chongsei;Jeon, Buil;Yoon, Giwan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.25 no.5
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    • pp.719-730
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    • 2021
  • We have demonstrated a sandwich-type ZnO-based piezoelectric energy harvesting nanogenerator, namely ZCZ-NG device, composed of symmetrically stacked layers of ZnO/carbon tape/ZnO structure. Especially, we have adopted a conductive double-sided adhesive carbon tape in an effort to fabricate a high-quality ZCZ-NG device, leading to its superior output performance in terms of the peak-to-peak output voltage. Effects of the device size, ZnO layer thickness, and bending strain rate on the device performance have been investigated by measuring the output voltage. Moreover, to evaluate the effectiveness of the fabricated ZCZ-NG devices, we have experimentally implemented a sensor network testbed which can utilize the output voltages of ZCZ-NG devices. This sensor network testbed consists of several components such as Arduino-based transmitter and receiver nodes, wirelessly transmitting the sensed information of each node. We hope that this research combining the ZnO-based energy harvesting devices and IoT sensor networks will contribute to the development of more advanced energy harvester-driven IoT sensor networks in the future.