• Journal of the Microelectronics and Packaging Society
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• v.28 no.4
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• pp.57-61
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• 2021

A formation process of indium bump arrays on micro-pillar structures is proposed. The space to form indium bump on the narrow structures can be secured applying the benzocyclobutene (BCB) planarization and its etch-back process. We exhibit a detailed overview of the process steps involved in the fabrication of 320×256 hybrid camera sensor for short-wavelength infrared (SWIR) detection. The shear strength of the BCB, which has undergone the different processes, is extracted by quartz crystal microbalance measurement. The shear strength of the BCB is three orders of magnitude higher than that of the indium bump itself. The measured dark current distribution of the fabricated SWIR camera sensor indicates the suggested process of indium bumps can be useful for embodying highly sensitive infared camera sensors.

• Journal of the Korean Society of Industry Convergence
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• v.26 no.6_2
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• pp.1073-1082
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• 2023

Thermal sensors, also called thermal infrared wavelength sensors, measure temperature based on the intensity of infrared signals that reach the sensor. The infrared signals recognized by the sensor include infrared wavelength(0.7~3.0㎛) and radiant infrared wavelength(3.0~100㎛). Infrared(IR) wavelengths are divided into five bands: near infrared(NIR), shortwave infrared(SWIR), midwave infrared(MWIR), longwave infrared(LWIR), and far infrared(FIR). Most thermal sensors use the LWIR to capture images. Thermal sensors measure the temperature of the target in a non-contact manner, and the data can be affected by the sensor's viewing angle between the target and the sensor, the amount of atmospheric water vapor (humidity), air temperature, and ground conditions. In this study, the characteristics of three thermal imaging sensor models that are widely used for observation using unmanned aerial vehicles were evaluated, and the optimal application field was determined.