• 제목/요약/키워드: SPFM

검색결과 5건 처리시간 0.024초

연어 frame 유래 근육을 이용한 연어 패티의 제조 및 특성 (Preparation and Characterization of Salmon Patty using Muscle from Salmon Frame)

  • 허민수;김진수
    • 한국수산과학회지
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    • 제42권3호
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    • pp.183-189
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    • 2009
  • This study was conducted to prepare salmon patty using muscle separated from salmon frame (SPFM) and to investigate the food component characterization. When compared to salmon patty with fillet muscle (SPM), SPFM was lower in the moisture content, while it was higher in crude lipid content. However, no differences in the ash and protein contents between SPFM and SPM were found. Compared to SPM, the Hunter color value in cross section of cooked SPFM was higher in a and $\Delta$E values, while the color was lower in Land b values. Trichloroacetic acid soluble-N content of SPFM was 279 mg/100 g, which was insignificantly different (P>0.05) compared to those of SPM and commercial patty. The hardness of SPFM was 0.44 kg/$cm^2$, which was insignificantly different (P>0.05) compared to that of SPM, while was higher than that of commercial patty. The major fatty acids of SPFM were 16:0 (16.5%), 18:1n-9 (29.2%) and 18:2n-6 (26.1%). The 20:5n-3 and 22:6n-3 were also detected in high composition. The total amino acid content of SPFM was 16.6 g/100 g, which was similar to that of SPM. However, the total amino acid of SPFM was 14% higher than that of commercial patty. From the results of the mineral content, SPFM was higher than that of SPM in Fe and Ca, while the K in SPFM was lower. According to the result of sensory evaluation on the color, flavor and taste, no significant differences in all sensory items between SPFM and SPM were found.

Synchronous Periodic Frequency Modulation Based on Interleaving Technique to Reduce PWM Vibration Noise

  • Zhang, Wentao;Xu, Yongxiang;Ren, Jingwei;Su, Jianyong;Zou, Jibin
    • Journal of Power Electronics
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    • 제19권6호
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    • pp.1515-1526
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    • 2019
  • Ear-piercing high-frequency noise from electromagnetic vibrations in motors has become unacceptable in sensitive environments, due to the application of pulse width modulation (PWM) and in consideration of switching losses. This paper proposed a synchronous periodic frequency modulation (SPFM) method based on the interleaving technique for paralleled three-phase voltage source inverters (VSIs) to eliminate PWM vibration noise. The proposed SPFM technique is able to effectively remove unpleasant high-frequency vibration noise as well as acoustic noise more effectively than the conventional periodic carrier frequency modulation (PCFM) and interleaving technique. It completely eliminates the vibration noise near odd-order carrier frequencies and reduces the PWM vibration noise near even-order carrier frequencies depending on the switching frequency variation range. Furthermore, the SPFM method is simple to implement and does not employ additional circuits in the drive system. Finally, the effectiveness of the proposed method has been confirmed by detailed experimental results.

삼차원집적공정에서 원자현미경을 활용한 Wafer Bonding Strength 측정 방법의 신뢰성에 관한 연구 (Reliable Measurement Methodology of Wafer Bonding Strength in 3D Integration Process Using Atomic Force Microscopy)

  • 최은미;표성규
    • 마이크로전자및패키징학회지
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    • 제20권2호
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    • pp.11-15
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    • 2013
  • The wafer bonding process becomes a flexible approach to material and device integration. The bonding strength in 3-dimensional process is crucial factor in various interface bonding process such as silicon to silicon, silicon to metals such as oxides to adhesive intermediates. A measurement method of bonding strength was proposed by utilizing AFM applied CNT probe tip which indicated the relative simplicity in preparation of sample and to have merit capable to measure regardless type of films. Also, New Tool was utilized to measure of tip radius. The cleaned $SiO_2$-Si bonding strength of SPFM indicated 0.089 $J/m^2$, and the cleaning result by RCA 1($NH_4OH:H_2O:H_2O_2$) measured 0.044 $J/m^2$, indicated negligible tolerance which verified the possibility capable to measure accurate bonding strength. And it could be confirmed the effective bonding is possible through SPFM cleaning.

차량 내 네트워크 통신의 기능안전성을 위한 하드웨어 기본 설계 (Basic Design of ECU Hardware for the Functional Safety of In-Vehicle Network Communication)

  • 곽현철;안현식
    • 전기학회논문지
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    • 제66권9호
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    • pp.1373-1378
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    • 2017
  • This paper presents a basic ECU(Electronic Control Unit) hardware development procedure for the functional safety of in-vehicle network systems. We consider complete hardware redundancy as a safety mechanism for in-vehicle communication network under the assumption of the wired network failure such as disconnection of a CAN bus. An ESC (Electronic Stability Control) system is selected as an item and the required ASIL(Automotive Safety Integrity Level) for this item is assigned by performing the HARA(Hazard Analysis and Risk Assessment). The basic hardware architecture of the ESC system is designed with a microcontroller, passive components, and communication transceivers. The required ASIL for ESC system is shown to be satisfied with the designed safety mechanism by calculation of hardware architecture metrics such as the SPFM(Single Point Fault Metric) and the LFM(Latent Fault Metric).

ISO 26262에 부합한 능동형 안전벨트 제어 시스템의 하드웨어 아키텍처 설계 및 검증 (Design and Verification of the Hardware Architecture for the Active Seat Belt Control System Compliant to ISO 26262)

  • 이준혁;곽현철;이경중;안현식
    • 전기학회논문지
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    • 제65권12호
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    • pp.2030-2036
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    • 2016
  • This paper presents a hardware development procedure of the ASB(Active Seat Belt) control system to comply with ISO 26262. The ASIL(Automotive Safety Integrity Level) of an ASB system is determined through the HARA(Hazard Analysis and Risk Assessment) and the safety mechanism is applied to meet the reqired ASIL. The hardware architecture of the controller consists of a microcontroller, H-bridge circuits, passive components, and current sensors which are used for the input comparison. The required ASIL for the control systems is shown to be satisfied with the safety mechanism by calculation of the SPFM(Single Point Fault Metric) and the LFM(Latent Fault Metric) for the design circuits.