• The Journal of the Korea institute of electronic communication sciences
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• v.9 no.11
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• pp.1291-1296
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• 2014

The thermoelectric cooler is receiving great interest because of advantages such as the precise temperature control capability, the compact and lightweight cooler, and the mechanical vibrationless structure which enhances the reliability compared with the existing vapor compression cooler. However, it is not easy to design the optimal thermoelectric cooler which appropriate to the application because the thermal analysis should be necessary required. Accordingly, this paper studies the methodology of the modelling, sizing and thermal analysis of the thermoelectric cooler using SINDA/FLUINT analysis tool.