• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2005.09a
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• pp.23-34
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• 2005

Electronic interconnection and packaging is mainly performed in a planar, 2D design style. Further miniaturization and performance enhancement of electronic systems will more and more require the use of 3D interconnection schemes. Key technologies for realizing true 3D interconnect schemes are the realization of vertical connections, either through the Si-die or through the multilayer interconnect with embedded die. Different applications require different complexities of 3D-interconnectivity. Therefore, different technologies may be used. These can be categorized as a more traditional packaging approach, a wafer-level-packaging, WLP ('above' passivation), approach and a foundry level ('below' passivation) approach. We define these technologies as respectively 3D-SIP, 3D-WLP and 3D-SIC. In this paper, these technologies are discussed in more detail.

• 한국공간정보시스템학회:학술대회논문집
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• 2007.06a
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• pp.363-368
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• 2007

인터넷의 빠른 확산과 정보기술 패러다임의 변화로 사용자가 다양한 종류의 온라인 매체를 이용하여 콘텐츠 및 커뮤니티 제작 등에 능동적으로 참여하고, 이를 공유하는 양상이 사회 전반적으로 확대되고 있다. 이는 국가계획수립 부문에서도 예외는 아니어서 계획 주체와 국민간의 교류를 증진시키기 위해 등장한 개방형 계획패러다임과 맞물려 다양한 분야에서 PPGIS(Public Participation GIS)를 구현하기 위한 사업이 추진 중이다. 그러나 이러한 방법은 국가 주도의 단방향적인 참여기회 제공으로 단순한 의견수렴 수준에 머물고 있어 국민의 의견과 수요가 충분히 계획에 반영되지 못하며, 특정 계획분야에 국한되어 있는 실정이다. 그러므로 제공수단과 참여대상을 확대할 수 있도록 지리정보를 활용한 국민참여 기회를 제공하고, 이러한 결과가 GIS 활용분야 의사결정 과정에 적용될 수 있는 국가차원의 기반 마련이 요구된다. 따라서 이 연구는 정보기술 패러다임의 변화를 반영하여 사용자가 지리정보를 수단으로 자유롭게 의사를 개진하고, 정부가 이를 반영하여 계획을 수립할 수 있는 통합형 PPGIS 모델을 통한 G2C 상호작용 제고방안을 마련하고자 한다.

• Journal of the Korean Vacuum Society
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• v.8 no.4B
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• pp.536-540
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• 1999

We have developed a refractory WNx self-aligned gate GaAs metal-semiconductor field-effect transistor(MESFET) using $SiO_2$ side-wall process. The MESFET hasa fully ion-implanted, planar, symmetric self-alignment structure, and it is quite suitable for integration. The uniform trans-conductance of 354nS/mm up to Vgs=+0.6V and the saturation current of 171mA/mm were obtained. As high as 43GHz of cut-off frequency hs been realized without any de-embedding of parasitic effects. The refractory WNx self-aligned gate GaAs MESFET technology is one of the most promising candidates for realizing linear power amplifier ICs and multifunction monolithic ICs for use in the digital mobile communication systems such as hand-held phone(HHP), personal communication system (PCS) and wireless local loop(WLL).

• The Journal of Information Technology and Database
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• v.8 no.2
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• pp.61-69
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• 2001

System Integration Projects, especially in public sector, have a tendency of growing in size and duration. Under such environment the effects of IT personnel turnover becomes a serious problem. In addition a high rate of turnover hinders shill accumulation and competitiveness obtainment. In this research we explored the reasons of turnover by way of tracing IT personnel who have involved in large-scale SI projects and moved or quit before the completion of the projects. Based on previous research we identified three dimensions of variables that affected turnover : task-related dimension, human relations dimension, treatment-related dimension. We used these dimensions as a guideline for the interview and questioning exploration. Implications from the research for improving IT Personnel management are also elaborated.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.29 no.3
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• pp.33-42
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• 2006

From middle of 90's, SCM had emphasized the importance of connection of all companies which participate to a market, and outsourcing has emphasizes the slim structure of companies for pursing cost reduction and service improvement. But outsourcing as '2-1=1' and integration as '1+1=2' not adapt to the advanced market but return to the former state. Besides, it is impossible of subcontractors and logistics companies to execute these strategies which are win-win strategy and outsourcing. So many logistics companies have sharp competition in price recently. Therefore logistics companies have increased the need for a profitable business model and strategy. This paper researches the limitations of logistics market and redefines the role of logistics through the evolution of logistics. Also this paper proposes new role(Logister) and structure(Velcro structure) for not maker-oriented logistics but market-oriented logistics. The introductory case study will help to understand 2 terms(logister and velcro structure).

• Journal of Information Technology Services
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• v.12 no.2
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• pp.13-29
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• 2013

Offshore software development by Korean companies is mainly led by big SI (System Integration) companies. They open Offshore Development Centers (ODC) in developing countries such as India, China, and Vietnam to source software development for their mother companies. Firms with ODC consider transferring knowledge such as business and cultural knowledge as the most complicated yet essential process for the success of offshore development. This study investigates whether the selection of a governance mechanism is related with knowledge transfer and thus the success of offshore development. The results of this study indicate that a hierarchical governance mechanism is appropriate for transferring company-specific, sensitive, complex knowledge in offshore software development.

• Information Systems Review
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• v.12 no.1
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• pp.165-188
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• 2010

Recently public and finance SI (system integration) industry is called as 4D (difficult, dangerous, dirty, dreamless) industry because of low profit, overtime works and poor motivation of employees. Even some people think at SI industry to be a labor intensive industry instead of a high technology industry. The current study considers outside environmental change of SI industry as well as inside capability enhancement of SI companies. The study adopted action research method with the author's expertise and experiences as a head of a major SI company in Korea. The current research framework suggests 5 areas of profitability enhancement that offers propositions and implications. 5 areas of profitability enhancement are (1) policy improvement, (2) business portfolio innovation (3) sales capability reinforcement, (4) delivery capability reinforcement, and (5) cost management innovation. The five areas include 11 propositional factors and 21 implementation plans which were chosen from the profitability perspectives of SI companies.In order to successfully execute propositions and implementation plans of the framework, 3 years is needed and after 3 years profitability are expected to increase 10% higher than the current level. The framework, propositions and suggestions in this study are expected to offer a real contribution for SI companies that want to enhance competitiveness and profitability. Future extension of the current study to benchmarking the competitiveness and profitability between local companies and global companieswill bring a solid attention from industry and academics.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.361.1-361.1
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• 2016

Due to their high sensitivity, fast response, small energy consumption and ease of integration, nanoelectromechanical systems (NEMS) have attracted much interest in various applications such as high speed memory devices, energy harvesting devices, frequency tunable RF receivers, and ultra sensitive mass sensors. Since the device performance of NEMS is closely related with the mechanical and flexural properties of the material in NEMS, analysis of the mechanical and flexural properties such as intrinsic tensile stress and Young's modulus is a crucial factor for designing the NEMS structures. In the present work, the intrinsic mechanical properties of highly stressed silicon nitride (SiN) beams are investigated as a function of the beam length using two different techniques: (i) dynamic flexural measurement using optical interferometry and (ii) quasi-static flexural measurement using atomic force microscopy. The reliability of the results is analysed by comparing the results from the two different measurement techniques. In addition, the mass density, Young's modulus and internal stress of the SiN beams are estimated by combining the techniques, and the prospect of SiN based NEMS for application in high sensitive mass sensors is discussed.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of the Korean institute of surface engineering
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• v.55 no.6
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• pp.353-362
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• 2022

Recently, transmittance of photomasks for ultra-violet (UV) region is getting more important, as the light source wavelength of an exposure process is shortened due to the demand for technologies about high integration and miniaturization of devices. Meanwhile, such problems can occur as damages or the reduction of yield of photomask as electrostatic damage (ESD) occurs in the weak parts due to the accumulation of static electricity and the electric charge on chromium metal layers which are light shielding layers, caused by the repeated contacts and the peeling off between the photomask and the substrate during the exposure process. Accordingly, there have been studies to improve transmittance and antistatic performance through various functional coatings on the photomask surface. In the present study, we manufactured antireflection films of Nb₂O₅, | SiO₂ structure and antistatic films of ITO designed on 100 × 100 × 3 mmt sodalime glass by DC magnetron sputtering system so that photomask can maintain high transmittance at I-line (365 nm). ITO thin film deposited using In/Sn (10 wt.%) on sodalime glass was optimized to be 10 nm-thick, 3.0 × 103 𝛺/☐ sheet resistance, and about 80% transmittance, which was relatively low transmittance because of the absorption properties of ITO thin film. High average transmittance of 91.45% was obtained from a double side antireflection and antistatic thin films structure of Nb₂O₅ 64 nm | SiO₂ 41 nm | sodalime glass | ITO 10 nm | Nb₂O₅ 64 nm | SiO₂ 41 nm.