• Journal of the Microelectronics and Packaging Society
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• v.20 no.4
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• pp.81-85
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• 2013

Wafer stacking technology becomes more important for the next generation IC technology. It requires new process development such as TSV, wafer bonding, and wafer thinning and also needs to resolve wafer warpage, power delivery, and thermo-mechanical reliability for high volume manufacturing. In this study, Cu CMP which is the key process for wafer bonding has been studied using Cu CMP and oxide CMP processes. Wafer samples were fabricated on 8" Si wafer using a damascene process. Cu dishing after Cu CMP and oxide CMP was $180{\AA}$ in average and the total height from wafer surface to bump surface was approximately $2000{\AA}$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.5
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• pp.3183-3191
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• 2014

It is essential to effectively manage facilities because operating and maintenance cost for them accounts for more than 83% of lifecycle cost. This study developed BIM Object-based classification list to manage information required to operating and maintenance phase of them from design and construction phase. In order to develop this classification list, Construction Information Classification System, Design Criteria for Architectural Electrical Installations, commodity list classification of PPS(Public Procurement Service) were analyzed. and problems for consisting of object classification list were drawn. And each materials is classified that drawings discipline code (KSF 1540:2010 (Principle and criteria for CAD Drawing) was classified as level 1 to cover main areas and construction information classification system was classified as level 2 to cover elements also UNSPSC was classified as level 3 to cover objects for devices and equipments. this classification criteria was given code. This study is expected to be useful to exchange and share information in operating and maintenance phase by offering object point of view classification in design and construction phase. besides, it is looking forward to effective operating and maintenance of facilities by enabling management of devices and equipments by function, space, use.

• Journal of the Korean Society of Industry Convergence
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• v.8 no.2
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• pp.69-76
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• 2005

This study for Customer Satisfaction(Customer Focus) by Profit security' in the field Process improvement activity and man-power upgrade by DAS(DATA Acquisition System) in the Plant that is fusion Off Line and On Line(IT), Especially the basic of the most foundation in the beginning Step of Toyota system is 3-jeong(a standard instrument; right volume, right box, right position), 5S(Seiri, Seiton, Seisoh, Seiketsu, Sitsuke ; KAISEN, KANBNA System(for Logistic), Further more KPC has established the digital environment such as CIM ; Computer Integrated Manufacturing), IMS ; Intelligent Manufacturing System ERP ; Enterprise Resource Planning, DAS; Data Acquisition System, Autonomous QC & SPC etc,.) in order to realize the intelligent informatization, which is core base for obtaining the competitive power and for responding to the various 21C management environment in flexibility. In this digital management environment, continuously and powerfully they would advance for becoming the best of the world. For strategic changes to take place in industry 3 key important factors need to be included ; Integration of tasks function and process, Decentralization of information, Responsibility, Finally simplification of products and product structures.

• Journal of Korea Society of Digital Industry and Information Management
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• v.7 no.2
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• pp.101-113
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• 2011

As information and communication technology advances driving the rapid evolution of e-commerce and e-business becomes on effective marketing means for both business and institutions, the industry deals with these changes and has a profound, positive impact on production and operations management. But the construction industry falls behind compared with other industries in productivity, informationalization, automatization and globalization. Especially even though the informationalization is inevitable in any developing society, a number of construction industries can hardly cope with it properly. As the construction industry gets informationalized and advanced, the introduction of PMIS (Project Management Information System) is making progress actively for the effective construction project control and productivity improvement in construction. With the government officials' political promotion and the rising desire for construction informationalization of enterprises, many are attempting to develop integrated systems or to replace a previous system with a more advanced alternative. Construction Industry, however, has the peculiar properties that the period for the completion of construction is limited and on top of that, most of its data processing systems are seen as being an early stage in the design of management information systems. As a result, there are extremely few applications in the construction industry. In this paper, we propose the PMIS system based on new model 4CM that improves on previous models.

• KIEE International Transactions on Electrophysics and Applications
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• v.5C no.4
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• pp.176-179
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• 2005

The increasing demand for high density packaging technologies and the evolution to mixed digital and analogue devices has been the con-set of increasing research in thin film multi-layer technologies such as the passive components integration technology. In this paper, Cu and TaO thin film with RF sputtering was deposited for spiral inductor and MOM capacitor on the $SiO_2$/Si(100) substrate. MOM capacitor and spiral inductor were fabricated for L-C band pass filter by sputtering and lift-off. We are analyzed and designed thin films L-C passive components for band pass filter at 900 MHz and 1.8 GHz, important devices for mobile communication system. Based on the high-Q values of passive components, MOM capacitor and spiral inductors for L-C band pass filter, a low insertion loss of L-C passive components can be realized with a minimized chip area. The insertion loss was 3 dB for a 1.8 GHz filter, and 5 dB for a 900 MHz filter. This paper also discusses a analysis and practical design to thin-film L-C band pass filter.

• Journal of the Korean Magnetics Society
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• v.27 no.1
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• pp.35-40
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• 2017

Kerr microscopy was assembled to observe magnetic domain image of ultra thin 3 %Si-Fe by using parts of an optical microscope. Digital images were obtained from CCD camera attached to the microscopy. A method was suggested to decide a boundary between magnetic domain regions in this study. The method was using some operations such as subtraction, integration and least mean square approximation for pixel values in the digital image. The method has a strong point that high priced image processor is not needed in the Kerr microscopy system. From the results that three different domain walls were observed and magnetic flux density of 0.085 [T], this method could be applied in the magnetic domain regions having a straight $180^{\circ}$ domain wall.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.151-151
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• 2010

In this paper, the electrically properties of nonvolatile memory (NVM) using multi-stacks gate insulators of oxide-nitride-oxynitride (ONOn) and active layer of the low temperature polycrystalline silicon (LTPS) were investigated. From hydrogenated amorphous silicon (a-Si:H), the LTPS thin films with high crystalline fraction of 96% and low surface's roughness of 1.28 nm were fabricated by the metal induced crystallization (MIC) with annealing conditions of $650^{\circ}C$ for 5 hours on glass substrates. The LTPS thin film transistor (TFT) or the NVM obtains a field effect mobility of ($\mu_{FE}$) $10\;cm^2/V{\cdot}s$, threshold voltage ($V_{TH}$) of -3.5V. The results demonstrated that the NVM has a memory window of 1.6 V with a programming and erasing (P/E) voltage of -14 V and 14 V in 1 ms. Moreover, retention properties of the memory was determined exceed 80% after 10 years. Therefore, the LTPS fabricated by the MIC became a potential material for NVM application which employed for the system integration of the panel display.

• Knowledge Management Research
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• v.22 no.1
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• pp.1-19
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• 2021

Large-scaled hospital information system projects are often delayed than originally planned. Regarding project management, it is necessary to examine main factors triggering the schedule delay and to analyze the causality of such delay. This study tries to find the delay factors and causal relationship between them based on the case of the hospital information system development project by using the grounded theory method. It turned out that 'unrealistic scheduling' affects overall schedule delays like domino phenomenon, and 'poor analysis of existing systems' leads to poor quality of work analysis while 'poor subsystem integrated interface' triggers poor design quality. This study found out the factors affecting the delay of a project, analyzing cause-and-effect relationships between them in the academic side. From the practical view, it shows a solution to minimize delays in the project schedule for each of SI companies, hospitals and project managers.

• Journal of the Korean Society for Aviation and Aeronautics
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• v.25 no.3
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• pp.115-122
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• 2017

To achieve designed quality and reliability from R&D to force integration, an establishment of precise and distinct specifications and standards are required. However, the recent process of R&D standardization on defense acquisition system, has brought plenty of corrections on specifications and standards that may cause not only difficulties to production line and retardation to the military forces, but also a degradation of provided weapon systems. Therefore, a technical review should be performed by the developer, the producer, and the client, establishing the standard that include mass production requirements as well as clients' requirements. This paper propose a specified solution on process of R&D standardization, by applying a substantial FCA(Functional Configuration Audit) and PCA(Physical Configuration Audit) which implies participation of related agencies. By the improved PCA, 2,023 corrections on 74 types of QAR(Quality Assurance Requirement)s and 12,715 corrections on drawings are identified.

• JSTS:Journal of Semiconductor Technology and Science
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• v.17 no.2
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• pp.210-215
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• 2017

We have developed the neuromorphic system that can work with the four-terminal Si-based synaptic devices and verified the operation of the system using simulation tool and printed-circuit-board (PCB). The symmetrical current mirrors connected to the n-channel and p-channel synaptic devices constitute the synaptic integration part to express the excitation and the inhibition mechanism of neurons, respectively. The number and the weight of the synaptic devices affect the amount of the current reproduced from the current mirror. The double-stage inverters controlling delay time and the NMOS with large threshold voltage ($V_T$) constitute the action-potential generation part. The generated action-potential is transmitted to next neuron and simultaneously returned to the back gate of the synaptic device for changing its weight based on spike-timing-dependent-plasticity (STDP).