• Journal of the Korean Home Economics Association
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• v.29 no.2
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• pp.35-46
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• 1991

After adhering theone-sided non-woven adhesive interlining to the polyester/cotton fabrics and making experiments under the various conditions by L27 Orthogonal Array Table, we examined and analyzed the breaking away strength. The rusults are summarized as follows : 1. The best length of the adhering time is 15 secs. 2. As the adehesive interlining for blouse and jacket, B3 is best 3. The pressure for the adhesion is best under the pressure of 6.2Kg. 4. The temperature for the adhesion is best at 140$^{\circ}C$. 5. As for the direction of the adhesion, three directions appear much the same breaking away strength. 6. For the better adhesion power, if the less adhering power, if the less adhering pressure is applied, the adhering time must be extended(15-20 secs), and if much stronger adhering pressure is applied, the time must be shortened(10-15 secs). In general, it is the best way for the adhesion to apply under the pressure of 6.2Kg, for 15 secs long, and at 140$^{\circ}C$ of the adhering temperature.

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2006.07a
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• pp.617-617
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• 2006

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.12
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• pp.2820-2827
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• 2015

HSMS communication system using low-cost micro controller units(MCUs) is an essential technique for online semiconductor equipment system developments. It is intended as an alternative to SEMI E4 (SECS-I) for applications where higher speed communication is needed and the facilitated hardware setup is convenient. In this paper, an HSMS communication system using low-cost MCUS is designed and implemented. Using a MCU with a low price but high-performance as a main board, a module which processes HSMS communication is designed, and a circuit is designed to process BCR independently with a microminiature MCU. To convert tag data which is recognized from BCR into data based on HSMS communication protocol, SECS-II message is designed. Lastly, an HSMS communication system is implemented based on these designs. A low-cost HSMS communication module developed in this study can be applied in realtime monitoring and controlling system for semiconductor processes.

• Proceedings of the Korea Information Processing Society Conference
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• 2017.04a
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• pp.567-570
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• 2017

산업공정에서 공정 정보처리의 극대화를 위하여 PLC, 로봇 등의 여러 프로그램식 단위제어기기가 네트워크로 연결되어 운영되고 있다. 대부분이 RS232C와 고유 장비의 전송절차에 의해 수행되어 왔지만, ISO 등에서는 반도체공정에 적용을 위한 SECS에 대한 프로토콜을 표준화하였다. 본 연구는 반도체 스퍼터 공정에 PLC, 로봇, 반송장치의 연결에 SECS-II를 적용하고, HSMS를 활용하여 TCP/IP와 Host를 연결하여 계층구조의 네트워크를 운영하였다. 전송 메세지 type을 stream과 function으로 나누어 송수신 확인과 데이터 전송절차를 설정하여 공정이 정상적으로 운영됨을 확인하였다.

• 제어로봇시스템학회:학술대회논문집
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• 1989.10a
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• pp.421-426
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• 1989

Many of semiconductor manufacturing companies persuit automation of wafer fabrication to improve the yields and quality of their products. Development of real-time control system for wafer fabrication and wafer/cassette automatic transfer-system is the most important part to achieve the purpose. In this paper, SECS protocol proposed by SEMI is briefly reviewed and an implementation method of real-time monitoring and control system is suggested as one of the possible ways for wafer fabrication automation. The system consists of process equipments supporting SECS.

• Journal of Korea Foundry Society
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• v.12 no.5
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• pp.403-411
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• 1992

The growth characteristics of bainite at early stage in the fast quenched spheroidal graphite cast irons containing 0.06%Mn and 0.45%Mn during austempering process, was investigated with optical and scanning electron microscope. The following results regarding the effects of Mn and isothermal heat treatment on the morphological variation of bainitic ferrite were obtained. The morphology of bainite varies from acicular below 350$^{\circ}C$ to feather shape above 350$^{\circ}C$. The period of isothermal treatment also affects the shape of bainite at the fixed temperature. At 350$^{\circ}C$, bainite is bamboo leaf-like up to 200 secs of isothermal holding time and with further increasing time up to 300 secs, changes to a mixed structure consisting of both feather and bamboo leaf and, finally becomes all feather shape at 900 secs. The morphology of bainitic ferrite formed at early stage of 300$^{\circ}C$ isothermal treatment is similar to that of bainitic ferrite formed at 250$^{\circ}C$ or 350$^{\circ}C$ with unbranched, linear ferrite. However, bainitic ferrite divides into branches with increasing isothermal treatment, which occurs more fast at 400$^{\circ}C$ than at 350$^{\circ}C$. The difference in adding amount of Mn influences the morphology of bainitic ferrite in upper bainite. The bainitic ferrite with 0.45%Mn is observed to be more stable than that with 0.06%Mn, remaining unbranched for a longer period at the same temperature.

• Proceedings of the Korea Society of Information Technology Applications Conference
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• 2001.11a
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• pp.45-46
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• 2001

• Proceedings of the KAIS Fall Conference
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• 2000.04a
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• pp.29.2-29
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• 2000

• Journal of the Korea Society of Computer and Information
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• v.8 no.2
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• pp.106-111
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• 2003

In this Paper, an improved protocol is proposed by supplementing a control station for transmission cycle management and slot-extension function. This protocol is proposed to complement the shortcomings of the conventional L-Expressnet protocol which is used for round robin process in bus topology. We analyzed the improved protocol in channel utilization viewpoint and compared the result with that of the conventional Protocol. From this result, we showed that the channel utilization of the improved protocol is superior to that of the conventional protocol when a maximum normalized propagation delay is increased.

• Journal of the Semiconductor & Display Technology
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• v.12 no.2
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• pp.39-43
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• 2013

The semiconductor equipments generate necessary data through communication networks for the effective manufacturing processes and automation of semiconductor equipments. For transferring data between semiconductor equipments and sending data to monitor equipments, several standards for communication protocols have been proposed. Communication networks in semiconductor manufacturing systems will transmit a lot of data traffic, which can be vulnerable in data delay and network failure. Therefore, it is required that data traffic need to be distributed. To accomplish this objective, we recommend the use of a redundant and valuable communication path which is constructed by a wireless sensor network. In this paper, the directed diffusion method for wireless sensor networking is suggested for networking semiconductor equipments. It is shown that how the directed diffusion is employed to connect semiconductor equipments. Also, we show how to implement the SECS of semiconductor equipments communication protocols based on the directed diffusion.