• Journal of the Korean Institute of Telematics and Electronics A
• /
• v.28A no.11
• /
• pp.910-914
• /
• 1991

This paper describes the improvement of frequency characteristic of crystal oscillator I.C using Ti-Salicide. The characteristics of transistor(drive current) using Ti-Salicide process are better than Poly-Si process, because the mobility. To know frequency characteristic of oscillator I.C, the simulation is performed using inverter buffer chain of Fan-out 10 TTL. Its result shows at once the generation of normal clock pulse in input signal and the improvement of rising and falling time.

• Proceedings of the Korean Ceranic Society Conference
• /
• 2003.10a
• /
• pp.206.1-206
• /
• 2003

• Journal of the Korean Vacuum Society
• /
• v.1 no.1
• /
• pp.168-175
• /
• 1992

The surface and interface morphology as well as the sheet resistance, and uniformity of TiSiz film are significantly improved and the lateral titanium silicide growth over the oxide spacer is minimized by the use of ion beam mixing and rapid thermal annealing in nitrogen ambient. In addition, TiSiz film formations on TiISi and TiISiOz system were also studied.

• Journal of the Korean Vacuum Society
• /
• v.7 no.3
• /
• pp.208-213
• /
• 1998

Silicidation of the Co/Ti/Si bilayer system in which Ti is used as epitaxy promoter for $CoSi_2$has recently received much attention. The Co/Ti bilayer on the spacer oxide of gate electrode must be thermally stable at high temperatures for a salicide transistor to be fabricated successfully. In the $SiO_2$substrate was rapid-thermal annealed. The Sheet resistances of the Co/Ti bilayer increased substantially after annealing at $600^{\circ}C$, which is due to the agglomeration of the Co layer to reduce the interface energy between the Co layer and the $SiO_2$substrate. In the bilayer system insulating Ti oxide stoichiometric Ti oxide and silicide were not found after annealing.

• Proceedings of the KIEE Conference
• /
• 1991.07a
• /
• pp.178-182
• /
• 1991

Contact resistance and contact leakage current of the $Al/TiSi_2/Si$ system are investigated for $N^+\;and\;P^+$ junctions. Titanium disilicide is one of the most common silicides because of its thermal stability, ability, to form selective formation and low resistivity. In this paper, the effect of RTA temperature and Junction implant dose are characterized. The $TiSi_2$ contact resistance to $N^+$ silicon is lower than that of Al to $N^+$ silicon, but $TiSi_2$ of contact resistance to $P^+$ silicon is higher than that of Al to $P^+$ silicon. The $TiSi_2$ of contact leakage current to $N^+\;and\;P^+$ silicon is similar to that of Al contact.

• Proceedings of the IEEK Conference
• /
• 2003.07b
• /
• pp.671-674
• /
• 2003

본 논문에서는 Cobalt interlayer 와 Titanium Nitride(TiN) capping layer를 Ni SALICIDE의 단점인 열 안정성과 sheet resistance 와 series 저항을 감소시키는데 적용하여 0.lum 급 CMOS 소자의 특성을 연구하였다. 첫째로, Ni/Si 의 interface 에 Co interlayer 를 증착하여 Nickel Silicide의 단점인 열 안정성 평가인 700℃, 30min의 furnace annealing 후에 낮은 sheet resistance와 누설전류를 줄일 수 있었다. 두번째로, TiN caping layer를 적용하여 실리사이드 형성시 산소와의 반응을 막아 실리사이드의 표면특성을 향상시켜 누설전류의 특성을 개선하였다. 결과적으로 소자의 구동전류 향상, 누설전류 저하, 낮은 면저항으로 소자의 특성을 개선하였다.

• Journal of the Korean institute of surface engineering
• /
• v.35 no.6
• /
• pp.377-382
• /
• 2002

We investigated the appropriate wet cleaning process for Co-Ti-Si compounds formed on top of cobalt disilicide made from Co/Ti deposition and two rapid thermal annealing (RTA). We employed three wet cleaning processes, WP1 ($H_2$SO$_4$ etchant), WP2 ($NH_4$OH etchant), and WP3 which execute sequentially WP1 and WP2 after the first RTA. All samples were cleaned with BOE etchant after the second RTA. We characterized the sheet resistance with process steps by a four-point probe, the microstructure evolution by a cross detail sectional transmission electron microscope, a Auger depth profiler, and a X-ray diffractometer (XRD). We confirmed WP3 wet cleaning process were the most suitable to remove CoTiSi layer selectively.

• Korean Journal of Materials Research
• /
• v.13 no.5
• /
• pp.279-284
• /
• 2003

The $CoSi_2$ process is widely employed in a salicide as well as an ohmic layer process. In this experiment, we investigated the characteristics of $CoSi_2$ films by combinations of I-type (TiN 100$\AA$/Co 150$\AA$), II-type(TiN 100$\AA$/Co 150$\AA$/Ti 50$\AA$), III-type(Ti 100$\AA$/Co 150$\AA$/Ti 50$\AA$), and IV-type(Ti 100$\AA$/Co 150$\AA$/Ti 100$\AA$). Sheet resistances of $CoSi_2$ show the lowest resistance with 2.9 $\Omega$/sq. in a TiN/Co condition and much higher resistances in conditions simultaneously applying Ti capping layers and Ti interlayers. Though we couldn't observe a $CoSi_2$roughness dependence on the film stacks from RMS values, Ti capping layers turned into 78∼94$\AA$ thick TiN layers of (200) preferred orientation at $N_2$ambient. In addition, Ti interlayers helped to form the epitaxial $CoSi_2$with (200) preferred orientation and ternary compounds of Co-Ti-Si. We propose that film structures of II-type and III-type may be appropriate in the salicide process and the ohmic layer process from the viewpoint of Co diffusion kinetics and the CoSi$_2$epitaxy.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.20 no.4
• /
• pp.308-317
• /
• 2007

We fabricated thermally-evaporated 10 nm-Ni/(poly)Si and 10 nm-$Ni_{0.5}Co_{0.5}$/(Poly)Si structures to investigate the microstructure of nickel silicides at the elevated temperatures required lot annealing. Silicides underwent rapid annealing at the temperatures of $600{\sim}1100^{\circ}C$ for 40 seconds. Silicides suitable for the salicide process formed on top of both the single crystal silicon actives and the polycrystalline silicon gates. A four-point tester was used to investigate the sheet resistances. A transmission electron microscope and an Auger depth profilescope were employed for the determination of vortical microstructure and thickness. Nickel silicides with cobalt on single crystal silicon actives and polycrystalline silicon gates showed low resistance up to $1100^{\circ}C$ and $900^{\circ}C$, respectively, while the conventional nickle monosilicide showed low resistance below $700^{\circ}C$. Through TEM analysis, we confirmed that a uniform, $10{\sim}15 nm$-thick silicide layer formed on the single-crystal silicon substrate for the Co-alloyed case while a non-uniform, agglomerated layer was observed for the conventional nickel silicide. On the polycrystalline silicon substrate, we confirmed that the conventional nickel silicide showed a unique silicon-silicide mixing at the high silicidation temperature of $1000^{\circ}C$. Auger depth profile analysis also supports the presence of this mixed microstructure. Our result implies that our newly proposed NiCo-alloy composite silicide process may widen the thermal process window for the salicide process and be suitable for nano-thick silicides.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2007.11a
• /
• pp.52.2-52.2
• /
• 2007