• Title, Summary, Keyword: SAICAS

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Analysis on Adhesion Properties of Composite Electrodes for Lithium Secondary Batteries using SAICAS (SAICAS를 이용한 리튬이차전지용 복합전극 결착특성 분석)

  • Byun, Seoungwoo;Roh, Youngjoon;Jin, Dahee;Ryou, Myung-Hyun;Lee, Yong Min
    • Journal of the Korean Electrochemical Society
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    • v.21 no.2
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    • pp.28-38
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    • 2018
  • Although the adhesion properties of composite electrodes are important for securing long-term reliability and realizing high energy density of lithium secondary batteries, related research has not been carried out extensively due to the limitation of measurement technology. However, surface and interfacial cutting analysis system(SAICAS), which can measure the adhesion properties while cutting and peeling a coating layer of $1{\sim}1000{\mu}m$ thickness, has been developed and applied for analyzing the adhesion properties of composite electrodes for lithium secondary batteries. Thus, this review presents not only the principle and measurement method of SAICAS but also comparison results between SAICAS and conventional peel test. In addition, application examples of SAICAS are introduced in the study of electrode design optimization, new binder derivation study, and binder distribution in composite electrode. This suggests that SAICAS is an analytical method that can be easily applied to investigate the adhesion properties of composite electrodes for lithium secondary batteries.

Effects of Sputtering Conditions of TiW Under Bump Metallurgy on Adhesion Strength of Au Bump Formed on Al and SiN Films (Al 및 SiN 박막 위에 형성된 TiW Under Bump Metallurgy의 스퍼터링 조건에 따른 Au Bump의 접착력 특성)

  • Jo, Yang-Geun;Lee, Sang-Hee;Kim, Ji-Mook;Kim, Hyun-Sik;Chang, Ho-Jung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.19-23
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    • 2015
  • In this study, two types of Au/TiW bump samples were fabricated by the electroplating process onto Al/Si and SiN/Si wafers for the COG (Chip On Glass) packaging. TiW was used as the UBM (Under Bump Metallurgy) material of the Au bump and it was deposited by a sputtering method under the sputtering powers ranges from 500 to 5000 Watt. We investigated the delamination phenomenas for the prepared samples as a function of the input sputtering powers. The stable interfacial adhesion condition was found to be 1500 Watt in sputtering power. In addition, the SAICAS (Surface And Interfacial Cutting Analysis System) measurement was used to find the adhesion strength of Au bumps for the prepared samples. TiW UBM films were deposited at the 1500 Watt sputtering power. As a results, there was a similar adhesion strengths between TiW/Au interfacial films on Al/Si and SiN/Si wafers. However, the adhesion strength of TiW UBM sputtering films on Al and SiN under films were 2.2 times differences, indicating 0.475 kN/m for Al/Si wafer and 0.093 kN/m for SiN/Si wafer, respectively.

Soluble Polyimide Binder for Silicon Electrodes in Lithium Secondary Batteries (리튬이차전지 실리콘 전극용 용해성 폴리이미드 바인더)

  • Song, Danoh;Lee, Seung Hyun;Kim, Kyuman;Ryou, Myung-Hyun;Park, Won Ho;Lee, Yong Min
    • Applied Chemistry for Engineering
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    • v.26 no.6
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    • pp.674-680
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    • 2015
  • A solvent-soluble polyimide (PI) polymeric binder was synthesized by a two-step reaction for silicon (Si) anodes for lithium-ion batteries. Polyamic acid was first prepared through ring opening between two monomers, bicyclo[2,2,2]oct-7-ene-2,3,5,6-tetracarboxylic dianhydride (BCDA) and 4,4-oxydianiline (ODA), followed by condensation reaction. Using the synthesized PI polymeric binder (molecular weight = ~10,945), the coating slurry was then prepared and Si anode was fabricated. For the control system, Si anode based on polyvinylidene fluoride (PVDF, molecular weight = ~350,000) having the same constituent ratio was prepared. During precycling, PI polymeric binder revealed much improved discharge capacity ($2,167mAh\;g^{-1}$) compared to that of using PVDF polymeric binder ($1,740mAh\;g^{-1}$), while the Coulombic efficiency of two systems were similar. PI polymeric binder improved the cycle retention ability during cycles compared to that of using PVDF, which is attributed to an improved adhesion property inside Si anode diminishing the dimensional stress during Si volume changes. The adhesion property of each polymeric binder in Si anode was confirmed by surface and interfacial cutting analysis system (SAICAS) (Si anode based on PI polymeric binder = $0.217kN\;m^{-1}$ and Si anode based on PVDF polymeric binder = $0.185kN\;m^{-1}$).

Adhesive Strength and Electrochemical Properties of Li(Ni0.5Co0.2Mn0.3)O2Electrodes with Lean Binder Composition (바인더 함량에 따른 Li(Ni0.5Co0.2Mn0.3)O2 전극의 접착력 및 전기화학 성능에 관한 연구)

  • Roh, Youngjoon;Byun, Seoungwoo;Ryou, Myung-Hyun;Lee, Yong Min
    • Journal of the Korean Electrochemical Society
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    • v.21 no.3
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    • pp.47-54
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    • 2018
  • To maximize the areal capacity($mAh\;cm^{-2}$) of $LiNi_{0.5}Co_{0.2}Mn_{0.3}O_2$(NCM523) electrode with the same loading level of $15mg\;cm^{-2}$, three NCM523 electrodes with 4, 2, and 1 wt% poly(vinylidene fluoride)(PVdF) binder content are fabricated. Due to the delamination issue of electrode composite at the edge during punching process, the 1 wt% electrode is excluded for further evaluation. When the PVdF binder content decreases from 4 to 2 wt%, both adhesion strength and shear stress decrease from 0.4846 to $0.2627kN\;m^{-1}$ by -46% and from 3.847 to 2.013 MPa by -48%, respectively. Regardless of these substantial decline of mechanical properties, their initial electrochemical properties such as initial coulombic efficiency and voltage profile are almost the same. However, owing to high loading level, the 2 wt% electrode not only exhibits worse cycle performance than the 4 wt% electrode, but also cannot maintain its mechanical integrity only after 80 cycles. Therefore, if the binder content is reduced to increase the area capacity, the mechanical properties as well as the cycle performance must be carefully evaluated.