• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.5
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• pp.648-655
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• 2020

The firing pin of modern automatic rifles detonates the primer of loaded ammunition via a hammer. During this process, the firing pin receives an impact load and repetitive force throughout the life of the rifle. An endurance test of a rifle showed that the firing pin breaks prematurely at 96.26% of life. Accordingly, a case study was conducted through cause analysis and a reconstruction test. Optical microscopy and scanning electron microscopy of the broken surface of the firing pin showed that a crack began in the circumferential direction of the surface, resulting in a fatigue crack to the core after repeated impact. Crack growth and fatigue destruction occurred at the end due to the repetitive impact and was estimated using a notch. For verification, a sample that produced a 0.03mm circumferential notch was broken at 64.25% of life in the reconstruction test. A test of breakage according to the notch types showed that a 0.3mm and a 0.5mm one-side notch were broken at 66.53% and 50.76%, respectively, and a 0.03mm six-point notch was broken at 85.65%. The endurance life of a sample firing pin with a rough surface and tool mark was examined, but an approximately 381 ㎛ internal crack formed. Through this study, failure for each notch type was considered. These results show that quality control of the notch and surface roughness is essential for ensuring the reliability of a component subjected to repeated impact.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.34 no.4
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• pp.269-274
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• 2008

In this study we successfully altered the structural characteristics of the mica surface and were able to control oil-absorption by using the microwave enhanced etching (MEE) technique, which has originally been used in semiconductor industry. When microwave energy is applied to the mica, the surface of the mica is etched in a few minutes. As the result of etching, oil-absorption of the mica was enhanced and surface whiteness was improved by modifying the silicon dioxide layer. Additionally, the high whiteness was maintained even though the etched mica absorbed the sebum or sweat. The surface modification of mica was performed by microwave irradiation after the treatment of hydrofluoric acid. The degree of etching was regulated by acid concentration, irradiation time, the amount of energy and slurry concentration. The surface morphology of the etched mica appears to be the shape of the 'Moon'. The characteristics of surface area and roughness were examined by Brunauer-Emmett-Teller (BET) surface area analysis, atomic force microscopy (AFM), scanning electron microscopy (SEM), spectrophotometer and goniophotometer.

• Korean Chemical Engineering Research
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• v.43 no.4
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• pp.495-502
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• 2005

Copper was plated on the tungsten substrate by use of a direct copper electroless plating. The optimum deposition conditions were found to be with a concentration of $CuSO_4$ 7.615 g/L, EDTA of 10.258 g/L, and glyoxylic acid of 7 g/L, respectively. The solution temperature was maintained at $60^{\circ}C$. The pH was varied from 11.0 to 12.8. After the deposition, the properties of the copper film were investigated with X-ray diffractometer (XRD), Field emission secondary electron microscope (FESEM), Atomic force microscope (AFM), X-ray photoelectron spectroscope (XPS), and Rutherford backscattering spectroscope (RBS). The best deposition condition was founded to be the solution pH of 11.8. In the case of 10 min deposition at the pH of 11.8, the grain shape was spherical, Cu phase was pure without impurity peak ($Cu_2O$ peak), and the surface root mean square roughness was about 11 nm. The thickness of the film turned out to be 140 nm after deposition for 12 min and the deposition rate was found to be about 12 nm/min. Increase in pH induced a formation of $Cu_2O$ phase with a long rectangular grain shape. The pH control seems to play an important role for the orientation of Cu in electroless deposition. The deposited copper concentration was 99 atomic percent according to RBS. The resulting Cu/W film yielded a good adhesive strength, because Cu/W alloy forms during electroless deposition.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.11a
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• pp.363-363
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• 2008

The development of dry etching process for sapphire wafer with plasma has been key issues for the opto-electric devices. The challenges are increasing control and obtaining low plasma induced-damage because an unwanted scattering of radiation is caused by the spatial disorder of pattern and variation of surface roughness. The plasma-induced damages during plasma etching process can be classified as impurity contamination of residual etch products or bonding disruption in lattice due to charged particle bombardment. Therefor, fine pattern technology with low damaged etching process and high etch rate are urgently needed. Until now, there are a lot of reports on the etching of sapphire wafer with using $Cl_2$/Ar, $BCl_3$/Ar, HBr/Ar and so on [1]. However, the etch behavior of sapphire wafer have investigated with variation of only one parameter while other parameters are fixed. In this study, we investigated the effect of pressure and other parameters on the etch rate and the selectivity. We selected $BCl_3$ as an etch ant because $BCl_3$ plasmas are widely used in etching process of oxide materials. In plasma, the $BCl_3$ molecule can be dissociated into B radical, $B^+$ ion, Cl radical and $Cl^+$ ion. However, the $BCl_3$ molecule can be dissociated into B radical or $B^+$ ion easier than Cl radical or $Cl^+$ ion. First, we evaluated the etch behaviors of sapphire wafer in $BCl_3$/additive gases (Ar, $N_2,Cl_2$) gases. The behavior of etch rate of sapphire substrate was monitored as a function of additive gas ratio to $BCl_3$ based plasma, total flow rate, r.f. power, d.c. bias under different pressures of 5 mTorr, 10 mTorr, 20 mTorr and 30 mTorr. The etch rates of sapphire wafer, $SiO_2$ and PR were measured with using alpha step surface profiler. In order to understand the changes of radicals, volume density of Cl, B radical and BCl molecule were investigated with optical emission spectroscopy (OES). The chemical states of $Al_2O_3$ thin films were studied with energy dispersive X-ray (EDX) and depth profile anlysis of auger electron spectroscopy (AES). The enhancement of sapphire substrate can be explained by the reactive ion etching mechanism with the competition of the formation of volatile $AlCl_3$, $Al_2Cl_6$ or $BOCl_3$ and the sputter effect by energetic ions.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.49-57
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• 2007

Au-Sn solder alloy were deposited in multilayer and co-sputtered film by rf-magnetron sputter and the composition control and analysis were studied. For the alloy deposition condition, each components of Au or Sn were deposited separately. On the basis of pure Sn and Au deposition, the deposition condition for Au-Sn solder alloy were set up. As variables, the substrate temperature, the rf-power, and the thickness ratio were used for the optimum composition. For multilayer solder alloy, the roughness and the composition of solder alloy were controlled more accurately at the higher substrate temperature. In contrast, for co-sputtered solder, the substrate temperature influenced little to the composition, but the composition could be controlled easily by rf-power. In addition, the co-sputtered solder film mostly consisted of intermetallic compound, which formed during deposition. The compound were confirmed by XRD. Without flux during bonding of solder alloy film on leadframe, the adhesion strength were measured. The maximum shear stress was $330(N/mm^2)$ for multilayer solder with Au 10wt% and $460(N/mm^2)$ for co-sputtered solder with Au 5wt%.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.33 no.4
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• pp.1665-1673
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• 2013

Recently, the interest and demand on free formed structure providing aesthetic value as well as functionality has been increasing. Formwork has numerous advantages such as high strength, convenience, accuracy and good quality of surface roughness. Nevertheless, it increases construction cost and period to build complex shapes. For these purpose, deposition construction systems such as Contour Crafting and Concrete Printing have been developed with active collaboration between university and industry by applying the rapid prototyping technology to the construction industry in USA and England. Since there has been no related research in Korea, the possibility of spin-off technology and its fusion cannot be expected. In this paper, design elements including mechanical system and control system related to automatic deposition construction system prototype for constructing a free curved structure without mold are described. As for an appropriate material for the system, fiber reinforced mortar was selected by experiments on compressive strength, fluidity, viscosity and setting time. By performing transfer and extrusion experiments, the possibility of the development of deposition construction system was demonstrated. Based on this research results, it is required to keep the automatic deposition construction system improve and extend it into the new application area in construction industry.

• Journal of dental hygiene science
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• v.11 no.5
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• pp.397-404
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• 2011

The aims of this study were to evaluate the effect of native acidity upon dental hard tissues by measuring pH in mouth-rinse, which is on the market, and to evaluate even influence of dental stain caused by mouse-rinse given using for a long time. The experimental group was used Garglin, Nextcare, Listerine, and Hexamedin. The control group was used sterile distilled water. As a result, pH was indicated to be low in Nextcare(4.70) and Listerine(4.16). In a change of color tone, $b^*$ value of indicating Yellow-blue showed the lower value than the early color tone in all groups. There was statistical significance in Nextcare and Listerine. ${\Delta}L^*$ value of indicating light -dark gets darker after using Nextcare, Listerine and Hexamedine. A change(VHN) in surface hardness of enamel showed reduction in surface hardness after 14 days in Nexcare and Listerine. As a result of confirming a change in enamel surface by using Scanning Electron Microscopy, the erosion aspect on the enamel surface could be confirmed in groups of Nexcare and Listerine. Ra value in surface roughness of enamel could be observed the enamel surface, which got rougher compared to other experimental groups.

• International Journal of Highway Engineering
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• v.4 no.3 s.13
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• pp.43-49
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• 2002

Asphalt pavements have to perform under the conditions of heavily-loaded vehicles due to the industrialization and large temperature variance between the summer and the winter. Due to these factors, a characteristics change of early permanent deformation becomes a big issue, and to remedy this problem many research to use modified asphalt are being widely conducted. However, most of the modified asphalt is being paved after milling the surface course and applying tackcoating, and it is being used mostly for the repair and maintenance purpose rather than pavement of new national road. The purpose of this investigation is to obtain some fundamental data for the evaluation of the performance and long-term performance of the construction material mixtures by the laboratory test and field experiments. For the field experiment, 200m of two-lanes national road, that is being paved for the new national road under the direction of Pusan Regional Construction Management Office, was paved with SBS PMA and PSMA asphalt mixtures, which are an modified asphalt mixtures used for the surface course, on top of the base course paved with other modified asphalt mixtures. The remaining section of the new national road was paved with dense grade mixture. The laboratory tests assessed and analyzed the mixture characteristics by Marshall's stability test, strength tests and wheel-tracking test. On the basis of the evaluation result of the temperature control and roughness of the newly constructed road at the field experiment site, it is desired to evaluate and identify the most economic modified asphalt mixtures by long-term performance evaluation and LCC(Life Cycle Cost) analysis in order to apply the test result to the design of new road construction in the future.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.40 no.5
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• pp.60-69
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• 2008

The principal reasons for applying a pigment coating to paper are to improve appearance and printability. The pigment coating provides a surface that is more uniform and more receptive to printing ink than are the uncoated fibers and, in turn, both facilitates the printing process and enhances the graphic reproduction. The improvement in print quality is readily apparent, especially in image areas or when multiple colors are involved. Although pigment coating of paper is to improve the printability, coated paper is not completely free from printing defects. Actually there are a number printing defects that are observed only with the coated papers. Among the printing defects that are commonly observed for coated papers, print mottle during multi-color offset printing is one of the most concerned defects, and it appears not only on solid tone area but also half dot print area. There are four main causes of print mottle ranging from printing inks, dampening solution, paper, and printing press or its operation. These indicates that almost every factors associated with lithographic printing can cause print mottle. Among these variation of paper quality influences most significantly on print mottle problems in multicolor offset printing, and this indicates that paper is most often to be blamed for its product deficiency as far as print mottle problems are concerned. Furthermore, most of the print mottle problems associated with paper is observed when coated papers are printed. Uncoated papers rarely show mottling problems. This indicates that print mottle is the most serious quality problems of coated paper products. Overcoming the print mottle is becoming more difficult because the operating speeds of coating and printing machines are increasing, coating weights are decreasing, and the demands on high-quality printing are increasing. Print mottle in offset printing is caused by (a) nonuniform back trap of ink caused by a nonuniform rate of ink drying, referred as "back trap mottle, and (b) nonuniform absorption of the dampening solution. Furthermore, both forms of print mottle have some relationship to the structure of the coated layer. The surest way of eliminating ink mottling is to eliminate unevenness in the base paper. Coating solutions, often easier to put into practice, should, however, be considered. In this paper the principal factors influencing print mottle of coated papers will be discussed. Especially the importance of base paper roughness, binder migration, even consolidation of coating layers, control of the drying rate, types of binders, etc. will be described.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.288-289
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• 2011

Indium Tin Oxide (ITO) is a typical highly Transparent Conductive Oxide (TCO) currently used as a transparent electrode material. Most widely used deposition method is the sputtering process for ITO film deposition because it has a high deposition rate, allows accurate control of the film thickness and easy deposition process and high electrical/optical properties. However, to apply high quality ITO thin film in a flexible microelectronic device using a plastic substrate, conventional DC magnetron sputtering (DMS) processed ITO thin film is not suitable because it needs a high temperature thermal annealing process to obtain high optical transmittance and low resistivity, while the generally plastic substrates has low glass transition temperatures. In the room temperature sputtering process, the electrical property degradation of ITO thin film is caused by negative oxygen ions effect. This high energy negative oxygen ions(about over 100eV) can be critical physical bombardment damages against the formation of the ITO thin film, and this damage does not recover in the room temperature process that does not offer thermal annealing. Hence new ITO deposition process that can provide the high electrical/optical properties of the ITO film at room temperature is needed. To solve these limitations we develop the Magnetic Field Shielded Sputtering (MFSS) system. The MFSS is based on DMS and it has the plasma limiter, which compose the permanent magnet array (Fig.1). During the ITO thin film deposition in the MFSS process, the electrons in the plasma are trapped by the magnetic field at the plasma limiters. The plasma limiter, which has a negative potential in the MFSS process, prevents to the damage by negative oxygen ions bombardment, and increases the heat(-) up effect by the Ar ions in the bulk plasma. Fig. 2. shows the electrical properties of the MFSS ITO thin film and DMS ITO thin film at room temperature. With the increase of the sputtering pressure, the resistivity of DMS ITO increases. On the other hand, the resistivity of the MFSS ITO slightly increases and becomes lower than that of the DMS ITO at all sputtering pressures. The lowest resistivity of the DMS ITO is $1.0{\times}10-3{\Omega}{\cdot}cm$ and that of the MFSS ITO is $4.5{\times}10-4{\Omega}{\cdot}cm$. This resistivity difference is caused by the carrier mobility. The carrier mobility of the MFSS ITO is 40 $cm^2/V{\cdot}s$, which is significantly higher than that of the DMS ITO (10 $cm^2/V{\cdot}s$). The low resistivity and high carrier mobility of the MFSS ITO are due to the magnetic field shielded effect. In addition, although not shown in this paper, the roughness of the MFSS ITO thin film is lower than that of the DMS ITO thin film, and TEM, XRD and XPS analysis of the MFSS ITO show the nano-crystalline structure. As a result, the MFSS process can effectively prevent to the high energy negative oxygen ions bombardment and supply activation energies by accelerating Ar ions in the plasma; therefore, high quality ITO can be deposited at room temperature.