• 한국표면공학회지
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• 제28권1호
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• pp.55-63
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• 1995

Alkaline solutions such as $NH_4$OH, choline and TMAH (($CH_3$)$_4$NOH) have been introduced in semiconductor wet processing of silicon wafers to control ionic and particulate impurities following etching in acidic solutions. These chemicals usually mixed with hydrogen peroxide and/or surfactants to control the etch rate of silicon. The highest etch rate was observed in $NH_4$OH solutions at a pH in alkaline solutions. It indicates that the etch rate depends on the content of $OH^{-}$ as well as cations of alkaline solutions. STM/AFM techniques were used to characterize the effect of alkaline solutions on silicon surface roughness. In SC1 (mixture of $NH_4$OH : $H_2$$O_2$ : $H_2$O) solutions, the reduction of the ammonium hydroxide proportion from 1 to 0.1 decreased the surface roughness ($R_{rms}$) from 6.4 to $0.8\AA$. The addition of $H_2$$O_2$ and surfactants to choline and TMAH reduced the values of $R_{p-v}$ and $R_{rms}$ significantly. $H_2$$_O2$ and surfactants added in alkaline solutions passivate bare silicon surfaces by the oxidation and adsorption, respectively. The passivation of surfaces in alkaline solutions resulted in lower etch rate of silicon thereby provided smoother surfaces.s.ces.s.

• 한국전기전자재료학회논문지
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• 제20권10호
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• pp.839-845
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• 2007

In this paper, a polishing pad has been analyzed in detail, to understand surface phenomena of polishing process. The polishing pad plays a key role in polishing process and is one of the important layer in polishing process, because it is a reaction layer of polishing[1]. Pad surface physical property is also ruled by pad profile. The profile and roughness of pad is controlled by different types of conditioning tool. Conditioning tool add mechanical force to pad, and make some roughness and profile. Formed pad surface will affect on polishing performance such as RR (Removal Rate) and uniformity in CMP Pad surface condition is changed by conditioning tool and dummy run and is stable at final. And this research, we want to reduce break-in and dummy polishing process by analysis of pad surface and artificial machining to make stable pad surface. The surface treatment or machining enables to control the surface of polishing pad. Therefore, this research intends to verify the effect of the buffing process on pad surface through analysis of the removal rate, friction force and temperature. In this research, urethane polishing pad which is named IC pad(Nitta-Haas Inc.) and has micro pore structure, is studied because, this type of pad is most conventional type.

• 한국기계가공학회지
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• 제13권2호
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• pp.41-48
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• 2014

Direct writing(DW) is a method of patterning materials to a substrate directly, without a mask. It can use a variety of materials and be applied to various fields. Among DW systems, the flow-based type, using a syringe pump and nozzle, is simpler than other types. Furthermore, the range of materials is exceptionally wide. In additive processes, a three dimensional structure is made of stacking layer. Each layer is made of several lines. In this regard, good surface roughness of fabricated layers is essential to three dimensional fabrication. The surface roughness of any fabricated layer tends to change with the dispensing pattern. When multiple layers fabricated by a nozzle dispensing system are stacked, control of the nozzle position from the substrate is important in order to avoid interference between the nozzle and the fabricated layer. In this study, a fluid direct writing system for three dimensional structure fabrication was developed. Experimentsto control the position of the nozzle from substrate were conducted in order to examine the characteristics of the material used in this system.

• 한국정밀공학회지
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• 제30권12호
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• pp.1335-1340
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• 2013

Herein the water film was introduced to the hydrophilic area on the line patterned surface to solve the contradiction caused by surface roughness (high different wettability has advantage to control the droplet but high roughness for that high wettability difference causes obstruction of droplet moving). Thus the droplet on the water film could not be hindered to line direction but restricted to orthogonal direction, effectively. In addition, droplet behaviors according to droplet volume and line thickness were studied. Droplet fell off the line with narrowing the interface between the droplet and the water film on the line. When the droplet fell off the line, the plate angle was designated as a critical plate angle and it used as an indicator of surface capability to control the droplet. As a result critical plate angle increases as droplet volume decreases and line thickness increases.

• 화약ㆍ발파
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• 제26권1호
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• pp.57-66
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• 2008

발파에서 특정한 방향으로 균열 성장을 제어하는데 장약공 노치가 유효하다는 연구결과가 발표되어오고 있다. 본 연구에서는 장약공의 노치가 파단면 형성에 미치는 영향을 살펴보기 위하여 일반 장약공과 노치 장약공에 의한 파단면의 표면을 비교하였다. 암석시편에 노치를 형성하기 위하여 노치비트시스템이 적용되었다. 파단면의 표면은 디지털 영상 계측법을 적용하여 DEM 모델로 재구성하고, 표면 거칠기 지수를 사용하여 파단면의 거칠기를 평가하였다.

• 한국자동차공학회논문집
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• 제14권2호
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• pp.57-66
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• 2006

AA5182-polypropylene sandwich sheet was manufactured, and the mechanical properties evaluation was executed in order to identify $L{\ddot{u}}ders$ band that causes fabrication process problem and especially surface roughness. To identify formability, deformation behavior, plastic strain ratio (R-value) and pole figure were measured, and texture analysis was performed. In the case of sandwich sheet, the unstable deformation behavior has decreased. As well, for sandwich sheet, A1 skin could manage the most of load, and the elongation has improved about 45% more than that of A1 skin. The plastic strain ratio of A1 skin and sandwich panel, which indicates serration behavior, was obtained from instantaneous plastic strain ratio evaluation. Also, the planar anisotropy of sandwich sheet has decreased more than that of A1 skin. According to these results, the sandwich sheet produced lightening effect and could control unstable deformation characteristic, that is, surface roughness caused by $L{\ddot{u}}ders$ band. Furthermore, it was proved that the texture control of the rolling attachment of A1 skin is necessary to improve the formability of the sandwich panel.

• 한국전기전자재료학회논문지
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• 제28권9호
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• pp.607-614
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• 2015

To provide the clear images from the direct light on electrical board and display devices, anti glare treatment of display cover glass is needed. In this study, the effects of surface treatment temperature, concentration, and etching solution coating thickness of the gel phase on optical elements control such as gloss, haze of reflected light and transmittance, were investigated. Cover glasses were treated at different coating thickness and additive concentration. The optical properties were examined using spectrophotometer, gloss and haze meter. The surface morphology and roughness were measured by the optical microscope and Ra measuring instrument. The etching rate and surface morphologies were dramatically affected by the concentration of acid additive in the viscous gel because of re-crystallization of components in the etching solution, hydrogel formation and coagulant after coating on glass substrate. In our experimental range, cover glass which is surface-treated with various optical properties as well as the morphology uniformity was obtained; in particular, optical properties could be controlled by etching solution coating thickness of the gel phase and the concentration of additive. The gloss was depended on the surface roughness and it showed the linear relationship between optical transmittance and haze of reflected light, respectively.

• 한국가시화정보학회지
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• 제17권2호
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• pp.73-82
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• 2019

The subsurface vortex - which occurs inside the cylindrical sump - was visualized through Computational Fluid Dynamics (CFD) and experiment. The analysis of subsurface vortex inside the cylindrical sump was already carried out using CFD techniques by the first author. To understand the subsurface vortex more clearly, an experimental analysis was carried out with a 1/5th scale model; and the flow rate was calculated according to the similarity law. The experimental results of vortex visualization matches well with the CFD results. The surface roughness model and Anti Vortex Device (AVD) model have been investigated to control the subsurface vortex. For the case of average surface roughness of 1mm and 5mm, the subsurface vortex appears and the vorticity is higher when compared to that of a smooth surface condition. However, for the AVD model, the subsurface vortex is completely removed and the internal flow is stabilized.

• 한국항만학회지
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• 제12권1호
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• pp.95-104
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• 1998

Water pollution in a semi-enclosed sea area such as a bay due to stagnancy of water has been a serious water environmental problem. Recently, some kinds of new methods to activate the tidal exchange between an inner bay and an outer sea area by control of a tidal residual current have been proposed. However, these methods have several problems, that is, I). deterioration in a natural view due to building of huge structures, II). increase of risk of navigation in case of a submerged structure, III). limition of sea area where a tidal current can be controlled and IV). difficulty in removing those structures in case of occurrence of an unexpected impact on water environment. In this paper, a new method is proposed, which can solve all the above problems, to purify water quality in a semi-enclosed bay by creation and control of a pattern of a tidal residual current. The tidal residual current is controlled by unsymmetric structures, which change the properties of resistance according to the direction of flow, arranged on the sea bottom. In this study, several numerical and hydraulic experiments of tidal current and particle-tracking for various arrangements of bottom roughness in a semi-enclosed model bay were carried out. As a result of experiments, it becomes clear that it is possible to generate a new tidal residual current and to activate a tidal exchange by only operation of bottom roughness arrangement.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2004년도 학술대회지
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• pp.628-635
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• 2004

The characteristic of thin film resistor with low TCR( temperature coefficient of resistance ) and high precision are studied. The thin film resistor for 1/4W was fabricated and characteristic of these resistors was investigated. The fabricated device had the thickness of $2.48{\leqq}$ and the resistivity of $0.27{\omega}mm$. The electrical characteristic was evaluated by HP 4339B and 4284A instruments with HP l6339A. The profile of trimmed structure was also measured by non contact interferometer. The change of resistance and TCR increased with increasing roughness and resistance. To reduce the effect of stress annealing treatment was performed in the range of 563 to 623 K after trimming. The characteristic was improved after annealing. It is expected the fabricated device can be useful for high precision and low TCR. Fabricated thin film resistor has average deviation of resistance less than $0.35{\%}$ and TCR within 60.60ppm/K.