• Transactions of the Korean Society of Mechanical Engineers A
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• v.26 no.11
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• pp.2409-2414
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• 2002

The surfaces of prototypes become rough due to the stair-stepping which is the inevitable phenomenon in the Rapid Prototypes are not used only for the verification of feature. The grinding, coating, or the composition of them is a main operation in post-processing in which lots of costs and long build time are needed. The solution is proposed to increase the efficiency of rapid prototyping by minimizing or removing the composition of them is a main operation in post-processing in which lots of costs and long build time are needed. the solution is proposed to increase the efficiency of rapid prototyping by minimizing or removing the regions for post-processing. the factors to cause the surface roughness and their effects are analyzed through the experiments. Software modules are developed to predict the surface roughness of each face in the prototyping with the result. An experimental compensation method is developed to apply the modules to various RP equipments, materials and build styles. The build direction is searched with use of genetic algorithm to maximize the total areas of the surface of which roughness is better than the user-defined value.

• Transactions of Materials Processing
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• v.28 no.5
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• pp.239-246
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• 2019

Various surface texturing techniques have been studied because of the effective applicability of micro or nano scale surface patterns. Particularly, the most promising types of patterns include the hierarchical patterns, which consists of micro/nano structures. Different processes such as MEMS, laser machining, micro cutting and micro grinding have been applied in the production of hierarchical patterns on various material surfaces. This study demonstrates the process of hot imprinting to induce the hierarchical patterns on the Al alloy surfaces. Wire electrical discharge machining (WEDM) process was used to imprint molds with micro scale sinusoidal pattern. In addition, the sinusoidal pattern with rough surface morphology was obtained as a result of the discharge craters. Consequently, the hierarchical patterns consisting of the sinusoidal pattern and the discharge craters were prepared on the imprinting mold surface. Hot imprinting process for the Al plates was conducted on the prepared mold, and the replication performance was analyzed. As a result, it was confirmed that the hierarchical patterns of the mold were effectively duplicated on the surface of Al plate.

• Journal of Periodontal and Implant Science
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• v.35 no.3
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• pp.525-536
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• 2005

여러 연구들을 통해 많은 학자들이 임프란트 안정성(stability)은 표면의 특징에 달려있다고 생각하게 되었다. 표면의 구조, 에너지, 산화물(oxide) 두께와 표면성상(topography)등 임프란트의 표면의 특징은 임프란트와 골조직의 반응에서 중요한 역할을 하는 것이 알려짐에 따라 티타뮨 임프란트의 표면의 처리 방법에 큰 관심을 가지게 되었다. 그 중에서 티타늄 임프란트 표면의 산화피막화(anodization)가 한 방법으로 대두되었다. 이 방법은 전기화학적 방식으로 임프란트 표면에 거칠고(rough)두꺼우며(thick), 기공(pore)을 가지는 산화물 막을 형성하는 것으로 산화물의 두께는 coronal 부분(l-2 ${\mu}m$)으로부터 apical부분(7-10 ${\mu}m$)까지 증가하게 된다. 산화피막의 표면에는 다양한 크기의 수많은 기공이 주로 1-2 ${\mu}m$ 두께로 임프란트의 apical 부분에서 존재하며, 임프란트 표면의 거칠기는 conical 위부분에서 apical 부분까지 계속 증가한다(평균 Ra value=1.2 ${\mu}m$). 또 다른 표면 처리 방법으로는 blasting 후에 etching을 한 SLA 표면이 있다. 이 연구의 목적은 일반적으로 많이 이용되고 있는 anodized 표면과 SLA 표면의 조직학적 반응을 비교 분석하는 것이다. 24개 임프란트를(anodized surfaced implant-12개 , SLA-12개, 8mm ${\times}\;{\Phi}$ 4.3) 6마리 토끼의 오른쪽과 왼쪽 femur에 식립하였다. 12주후에 동물들을 희생하여 EXACT cutting-grinding system을 이용하여 샘플을 절단하고 800, 1200 및 4000 번 연마제(abrasive) paper로 20-50 ${\mu}m$ 까지 grinding하였다. 샘플은 Multiple staining 용액으로 염색하여 SLA 임프란트 군과 비교하였다. 골과 임프란트 사이에 연결을 TDI 프로그램을 이용하여 %로 측정하였다. SLA 임프란트 군 경우에는 골과 임프란트 사이의 연결이 $74{\pm}19%$ 이고, 양극 산화한 임프란트 군 경우에는 $77{\pm}9%$이었다. 양극 산화한 티타늄 임프란트의 골 접촉률이 SLA 표면 임프란트 경우과 통계학적으로 유의한 차이는 보이지 않았다.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.89-93
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• 2020

Complex warpage behavior of the electronic packages causes internal stress so many kinds of mechanical failure occur such as delamination or crack. Efforts to predict the warpage behavior accurately in order to prevent the decrease in yield have been approached from various aspects. For warpage prediction, silicon is generally treated as a homogeneous material, therefore it is described as showing no warpage behavior due to thermal loading. However, it was reported that warpage is actually caused by residual stress accumulated during grinding and polishing in order to make silicon wafer thinner, which make silicon wafer inhomogeneous through thickness direction. In this paper, warpage behavior of the single-side polished wafer at solder reflow temperature, the highest temperature in packaging processes, was measured using 3D digital image correlation (DIC) method. Mechanism was verified by measuring coefficient of thermal expansion (CTE) of both mirror-polished surface and rough surface.

• Maxillofacial Plastic and Reconstructive Surgery
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• v.28 no.5
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• pp.434-444
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• 2006

This study was performed to evaluate the effects of three different implant surface treatments to the bone formation during osseous healing period under unloading conditions. Machined, double-acid etched and anodic oxidized implants were inserted into tibia of 3.0 - 3.5 kg NZ white male rabbits and 2 animals of each group were sacrificed at 2, 4 and 8 weeks. The specimens containing implant was dehydrated and embedded into hard methylmethacrylate plastic. After grinding to $50{\mu}m$, the specimens were stained with Villanueva bone stain. From each specimen, histomorphometric evaluation and the bone implant contact rate were analysed with optical microscope. The results were as follows; 1. In the scanning electronic microscopic examination, machined surface implant had several shallow and paralleled scratches on plain surface, double acid-etched implant had lots of minute wrinkles, rough valley and also irregularly located craters that looked like waves, anodic oxidized surface implant had porosity that minute holes were wholly distributed on the surface. 2. After 2 weeks of implantation, the percentages of bone-to-implant contact in the machined implant, double acid-etched implant and anodic oxidized implant were 26.85%, 62.64% and 59.82%, after 4 weeks of implantation they were 64.29%, 77.85% and 75.23%, and after 8 weeks they were 82.66%, 85.34% and 86.39%. 3. After 2 weeks of implantation, the percentages of bone area between threads in the machined implant, double acid-etched implant and anodic oxidized implant were 21.55%, 42.81%, and 40.33%, after 4 weeks of implantation they were 49.32%, 62.60% and 75.56%, and after 8 weeks they were 71.62%, 87.73% and 83.94%. In summary, percentages of implant surface contacted to bone trabeculae and bone formation area inside threads in double acid-etched implants and anodic oxidized implants were greater than machined implants in early healing stage. These results suggest that double acid-etched and anodic oxidized surface implants could reduce the healing period for osseointegration and may enable to do early function.