• 한국항공우주학회지
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• 제36권7호
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• pp.666-673
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• 2008

정확도 높은 위성전파항법 시스템의 구축을 위해서는 지상국과 우주궤도 상의 각 전파항법 위성 간의 데이터 통신을 통하여 각 위성 시스템의 상태 모니터링, 궤도 보정, 상호 무결성 판정 작업 등이 필수적이다. 제한된 소수의 지상국 안테나로 다수의 위성을 추적해야 하기 때문에 지상국 안테나의 효율적인 사용을 위한 방위각과 앙각의 시간계획이 필요하다. 중궤도를 돌고 있는 전파항법 위성은 일정한 궤도를 공전하고 있지만 지구가 자전하고 있는 관계로 지구상을 동일한 궤적으로 통과하지 않기 때문에 매 순간 지상국 안테나의 추적 경로계획을 새롭게 짜야한다. 본 연구에서는 다중위성 추적을 위한 지상국 안테나의 최적 방위각 및 앙각 스케쥴을 찾기 위해서 강화학습 기법 중의 하나인 Q 학습 기법과 유전자 기법을 이용하여 최적 알고리즘을 개발하고, 컴퓨터 시뮬레이션을 통하여 알고리즘의 최적성을 검증하는 연구를 수행하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator. removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistancy. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfact Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• 전기학회논문지
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• 제60권7호
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• pp.1417-1426
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• 2011

Radiofrequency ablation through cardiac catheterization is one of minimally invasive intervention procedures used in drug resistant arrhythmia treatment. To facilitate more accurate and precise catheter navigation, systems for robotic cardiac catheter navigation have been developed and commercialized. The authors have been developing a novel robotic catheter navigation system. The system is a network-based master-slave configuration 3-DOF (Degree-Of-Freedom) robotic manipulator for operation with conventional cardiac ablation catheter. The catheter manipulation motion is composed of the translation (forward/backward) and the roll movements of the catheter and knob rotation for the catheter tip articulation. The master manipulator comprises an operator handle compartment for the knob and the roll movement input, and a base platform for the translation movement input. The slave manipulator implements a robotic catheter platform in which conventional cardiac catheter is mounted and the 3-DOF motions of the catheter are controlled. The system software that runs on a realtime OS based PC, implements the master-slave motion synchronization control in the robot system. The master-slave motion synchronization performance tested with step, sinusoidal and arbitrarily varying motion commands showed satisfactory results with acceptable level of steady state error. The developed system will be further improved through evaluation of safety and performance in in vitro and in vivo tests.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 추계학술대회 논문집
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• pp.176-180
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• 2001

There are several factors causing re-work in CMP process such as improper polish time calculation by operator, removal rate decline of the polisher, unstable in-suit pad conditioning, slurry supply module problem and wafer carrier rotation inconsistency. And conclusively those fundimental reason for the re-work rate increasement is mainly from the cycle time delay between wafer polish and post measurement. Therefore, Wafer thickness measurement in wet condition could be able to remove those improper process conditions which may happen during the process in comparison with the conventional dried wafer measurement system and it can be able to reduce the CMP process cycle time. CMP scrap reduction by overpolish, re-work rate reduction, thickness control efficiency also can be easily achieved. CMP Equipment manufacturer also trying to develop integrated system which has multi-head & platen, cleaner, pre & post thickness measure and even control the polish time from the calculated removal rate of each polishing head by software. CMP re-work problem such as over & under polish by target thickness may result in the cycle time delay. By reducing those inefficient factors during the process and establish of the automatic process control, CLC system need to be adopted to maximize the process performance. Wafer to Wafer Polish Time Feed Back Control by measuring the wafer right after the polish shorten the polish time calculation for the next wafer and it lead to the perfect Post CMP target thickness control capability. By Monitoring all of the processed the wafer, CMP process will also be stabilize itself.

• Journal of Biosystems Engineering
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• 제34권2호
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• pp.120-126
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• 2009

The purpose of this study was to develop a visibility evaluation system for cabin type combine. Human's field of view was classified into five levels (perceptive, effective, stable gaze, induced, and auxiliary) depending on rotation of human's head and eye. Divider, reaper lever, gearshift, dashboard, and conveying part were considered as major viewpoints of combine. Visibilities of combine was evaluated quantitatively using the viewpoints and the human's field of view levels. The visibility evaluation system for cabin type combine was consisted of a laser pointer, stepping motors to control the direction of view, gyro sensors to measure horizontal and vertical angle, and I/O interface to acquire the signals. Tests were conducted with different postures ('sitting straight', 'sitting with $15^{\circ}$ tilt', 'standing straight', and 'standing with $15^{\circ}$ tilt'). The LSD (least significant difference) multiple comparison tests showed that the visibilities of viewpoints were different significantly as the operator's postures were changed. The results showed that the posture at standing with $15^{\circ}$ tilt provided the best visibility for operators. The divider of the combine was invisible due to blocking with the cabin frame at many postures. The reaper lever showed good visibilities at the postures of sitting or standing with $15^{\circ}$ tilt. The gearshift, the dashboard, and the conveying part had reasonable visibilities at the posture of sitting with $15^{\circ}$ tilt. However, most viewpoints of the combine were out of the stable gaze field of view level. Modifications of the combine design will be required to enhance the visibility during harvesting operation for farmers' safety and convenience.

• 한국압력기기공학회 논문집
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• 제15권1호
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• pp.62-70
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• 2019

The APR1400 reactor may be operated for a long time under high temperature and pressure conditions, causing damage to the stud holes and causing stud bolts and holes to stick. The present practice is to manually remove the anti-sticking agent and foreign matter remaining in the APR1400 reactor stud hole and to visually check the surface condition of the thread to check the damage status of the threads. In the case of the APR1400 reactor stud holes, manually cleaning the threads increases the risk of radiation exposure and operator's fatigue. To avoid this, the autonomous mobile robot is used to automatically clean the reactor stud holes. The purpose of this study is to optimize the cleaning performance of the mobile robot by looking at the behavior of the surface roughness of the stud surface cleaned by the brush attached to the mobile robot due to changes in brush material, thickness of wire, and rotation speed. A microscopic approach to the surface roughness of the flank is needed to investigate the effects of the newly proposed brush of the autonomous mobile robot on the thread holes. According to this experiment, it is reasonable to use STS brush rather than Carbon one. Optimal operating conditions are derived and the safety of APR1400 reactor stud holes maintenance can be improved.

• Maxillofacial Plastic and Reconstructive Surgery
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• 제33권1호
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• pp.55-61
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• 2011

Conventional slinding genioplsty has the risk of mental nerve injury after operation and difficult to correct vertical asymmetry of chin. So, authors propose a new genioplasty to correct asymmetry of chin. Switching genioplasty is a modification method of conventional genioplasty. Between mandibular right and left canine, osteotomy line of triangular shape make until mandibular lower border. In large side, osteotome line of wedge shape is added to reduction. After osteotomy, segment of wedge shape was separated from chin. Distal segment was rotated to reduction side. Because of rotation of distal segment, space is made in opposite side. Seperated segement of wedge shape from large side is switched this space to fill. So, stability of distal segment is achieved. Authors applied to swiching genioplasty the patients who was remained the chin asymmetry after both sagittal split ramus osteotome was done because mandible asymmetry. After operation, patient and operator were satisfied with excellent esthetic results without any other complication. The switching genioplasty is effective surgical technique for chin asymmetry because it has more advantages than conventional sliding genioplasty. First, other donor side does not need for bone graft. Second, the switching genioplasty can reduce infection, bone resroption, dehiscence, capsular contraction after allograft. Third, have little mental nerve damage. Forth, anteroposterior correction is possible. Fifth, operation time is less than other genioplasty for chin asymmetry.

• Archives of Plastic Surgery
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• 제35권5호
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• pp.611-614
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• 2008

Purpose: Infection, foreign body reaction and decreased volume of implant are common complications after augmentation rhinoplasty with $Gore-tex^{(R)}$ implant. The author experienced two cases of recurrent foreign body granuloma in the patients who underwent $Gore-tex^{(R)}$ removal because of infection after augmentation rhinoplasty. and treated them with complete removal of$Gore-tex^{(R)}$. Methods: Case 1: A 49 year-old female visited our clinic for recurrent foreign body reaction on nasal dorsum and tip area. The patient underwent augmentation rhinoplasty with $Gore-tex^{(R)}$ 3 years ago and implant was removed due to infection 9 months ago. Excision of the granuloma was performed and a piece of foreign body suspicious to be a $Gore-tex^{(R)}$ implant debris was detected under the subcutaneous pocket. The implant fragments were removed and nasalis muscle rotation flap was performed to cover the lesion. The specimen was proved to be $Gore-tex^{(R)}$ in histological study. Case 2: A 31 year-old-male with recurrent foreign body granuloma on the nasal tip area visited our clinic. 10 years ago, the patient had augmentation rhinoplasty with silicone implant and then, he underwent revisional rhinoplasty five times including nasal implant removal, which was performed 9 months ago. The authors excised the granuloma and found a small sized foreign body suspicious to be a $Gore-tex^{(R)}$ implant debris under the granuloma. The foreign body was excised and identified to be $Gore-tex^{(R)}$ in histological study. Results: In both cases, the lesions were healed without any complications and there were no evidences of recurrence up to 6 months of follow-up. Conclusion: The $Gore-tex^{(R)}$ is known to be weak against mechanical force. These properties of $Gore-tex^{(R)}$ make it difficult to remove the implant completely. In the patient who have infection after augmentation rhinoplasty with $Gore-tex^{(R)}$, the operator should take care to perform the complete removal without remaining fragment of the implant.

• 한국주조공학회지
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• 제41권6호
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• pp.550-557
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• 2021

4차 산업혁명의 도래에 따라 주물공장에서도 사물인터넷(Internet of things, IoT) 기반의 공정 스마트화에 대한 관심이 높아지고 있다. 주물공장에서 자동 수집 되고 있는 공정데이터들도 일부 있으나 노후된 생산설비의 제한된 기능, 작업자 노하우 기반의 공정 설계 등의 이유로 여전히 많은 공정데이터가 수기로 관리되고 있다. 특히, 공정데이터의 빅데이터화에 대한 중요도를 인지함에도 불구하고 시스템 구축 비용 부담으로 인해 선뜻 도입을 어려워하는 기업들이 많다. 본 연구에서는 IoT 기반 디바이스를 제작하고 원심주조공정 현장에 직접 적용함으로써 제작 디바이스의 현장 활용성을 살펴보았다. 원심주조공정에 대해 취득하고자 하는 공정 인자로 작업현장의 온도 및 습도, 용탕 온도, 금형 회전속도를 선정하였다. 데이터 취득 인자별로 요구되는 상세 제품규격과 비용을 고려하여 센서를 선정하였으며, IoT 기반 디바이스 제작을 위해 무선통신이 가능한 NodeMCU 보드를 활용하여 회로를 구성하였다. 구성한 회로는 PCB 기판으로 제작하여 각 공정 인자별 디바이스의 설치 환경을 고려하여 작업 현장에 설치하였으며, 현장 실증을 통해 적용 가능성을 확인하였다. 현장 적용 이후, 작업자의 안전에 대한 만족도가 상승하였으며, 공정 관리 측면에서 효율성이 증가했음이 확인되었다. 더불어 지속적으로 데이터를 수집하면 추후 공정데이터-품질데이터의 연계가 가능할 것으로 기대된다. 본 연구에서 제작한 IoT 디바이스는 데이터 수집에 대한 적절한 신뢰도를 확보하면서도 비용이 저렴하여, 주물공장별로 현장 상황을 고려하여 도입 여부를 검토해볼 수 있을 것으로 생각된다.