• Journal of the Korea Academia-Industrial cooperation Society
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• v.21 no.11
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• pp.788-794
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• 2020

This study was measured and analyzed from January to November 2019 to confirm the effect that Abietic acid, an asthma-causing substance, which can be exposed to workers in the electronics industry, is removed by plasma treatment. The experiment was carried out using a solder wire and natural rosin. Air at temperatures of 250℃, 300℃, and 350℃ was collected with a glass fiber filter paper using an air sampler for 10 minutes at a flow rate of 2ℓ/min. An analysis of the collected samples was performed by pretreatment with methyl alcohol and quantitative analysis by high performance liquid chromatography (HPLC). This procedure confirmed that abietic acid was generated in both natural rosin and solder wires, and the quantum of abietic acid increased as the treatment temperature increased. The amount of abietic acid was higher in natural rosin than solder wire. As a result of plasma treatment, a removal efficiency of about 92% or more was confirmed in natural rosin. A peak of abietic acid was not detected in the solder wire. Therefore, a removal efficiency of 100% was confirmed. This study, confirmed that abietic acid, an asthma-trigger can be generated in solder wire and natural rosin, and can be removed by plasma treatment.

• Analytical Science and Technology
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• v.6 no.5
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• pp.521-530
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• 1993

According to the Montreal Protocol, CFC 113, one of the ozone-depleting substances, will be prohibited to use as a cleaning solvent essentially in the electronic industry. Therefore, the development of the alternative cleaning solvents to CFC 113 is being accelerated. A number of the alternative cleaning solvents are avialable on the market. The alternatives of Axarel 32(DuPont), Cleanthru 750H(KAO Chemical), and EC-Ultra(Petroferm) are chosen for the comparison of cleaning performance with CFC 113. The test methods for measuring the cleaning performance were composed of the measurement of the physical properties, the experiments on the material compatibility with cleaning solvents, the measurement of the evaporation rate, and finally the experiments of the removal efficiency. Normally the basic physical properties of the alternatives had higher boiling points, viscosity and surface tension, which were quite different to those of CFC 113. In terms of solubility of rosin-based flux, the solubilities of abietic acid (nonpolar organic) were similar, but those of the activator (polar organic) in the alternatives were better than CFC 113. The evaporation of the alternatives was very slow, compared to CFC 113, which had much lower boiling point. All the cleaning solvents showed the good material compatibility with FR4 and Cu-coated PCB. The better removal efficiencies of abietic acid were obtained when using the ultrasonic mechanical energy over the dipping method. The experiments also indicated the very slow-eavaporating solvent was not desirable with the dipping cleaning method, and the differences in the removal efficiency of the alternatives with the ultrasonic cleaning method were negligible. Among the alternatives, the overall cleaning performances were obsorved as almost similar. Before selecting the ultimate cleaning solvent, the application of cleaning machine, environmental issues, and economics are simultaneously considered with the cleaning performance.