• Journal of Powder Materials
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• v.25 no.5
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• pp.402-407
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• 2018

Molybdenum silicide has gained interest for high temperature structural applications. However, poor fracture toughness at room temperatures and low creep resistance at elevated temperatures have hindered its practical applications. This study uses a novel powder metallurgical approach applied to uniformly mixed molybdenum silicide-based composites with silicon carbide. The degree of powder mixing with different ball milling time is also demonstrated by Voronoi diagrams. Core-shell composite powder with Mo nanoparticles as the shell and ${\beta}-SiC$ as the core is prepared via chemical vapor transport. Using this prepared core-shell composite powder, the molybdenum silicide-based composites with uniformly dispersed ${\beta}-SiC$ are fabricated using pressureless sintering. The relative density of the specimens sintered at $1500^{\circ}C$ for 10 h is 97.1%, which is similar to pressure sintering owing to improved sinterability using Mo nanoparticles.

• Journal of Korea Foundry Society
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• v.37 no.4
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• pp.101-107
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• 2017

This study investigated the effect of Pd on the microstructure, tensile and creep properties of Mg-4Al-2Sn (AT42) alloy at a high temperature for transportation-related industrial applications. AT42-xPd (x = 0, 1 and 2 wt. %) alloys were prepared using a permanent mould casting method. The microstructures of the as-cast alloys were characterized by the presence of the intermetallic phases $Mg_{17}Al_{12}$, $Mg_2Sn$ and $Al_4Pd$. The addition of Pd was found to improve the tensile properties of AT42 at room and at elevated temperatures, and to increase the creep resistance at elevated temperatures. A small amount of Pd could markedly improve the tensile properties of AT42 by means of grain-refinement and the dispersion of secondary phase strengthening. Moreover, the thermally stable phase $Al_4Pd$ effectively improves the creep resistance of AT42 due to the strengthened grain boundaries and the suppressed formation of $Mg_{17}Al_{12}$.

• Bulletin of the Korean Chemical Society
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• v.34 no.8
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• pp.2473-2479
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• 2013

The kinetics of the radical-polar molecule reaction $CH_3+HBr{\rightarrow}CH_4+Br$ has been studied at temperatures between 150 and 1000 K using classical dynamics procedures. Potential energy surfaces constructed using analytical forms of inter- and intramolecular interaction energies show a shallow well and barrier in the entrance channel, which affect the collision dynamics at low temperatures. Different collision models are used to distinguish the reaction occurring at low- and high-temperature regions. The reaction proceeds rapidly via a complex-mode mechanism below room temperature showing strong negative temperature dependence, where the effects of molecular attraction, H-atom tunneling and recrossing of collision complexes are found to be important. The temperature dependence of the rate constant between 400 and 1000 K is positive, the values increasing in accordance with the increase of the mean speed of collision. The rate constant varies from $7.6{\times}10^{-12}$ at 150 K to $3.7{\times}10^{-12}$ at 1000 K via a minimum value of $2.5{\times}10^{-12}\;cm^3\;molecule^{-1}\;s^{-1}$ at 400 K.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.9
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• pp.760-765
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• 2011

Znic sulfide (ZnS) thin films were deposited on glass substrates by radio frequency magnetron sputtering. The substrate temperature varied from room temperature (RT) to $500^{\circ}C$. The structural and optical properties of ZnS films were studied by X-ray diffraction (XRD), field emission scanning electron microscopy (FESEM), energy dispersive analysis of X-ray (EDAX) and UV-visible transmission spectra. The XRD analyses reveal that ZnS films have cubic structures with (111) preferential orientation, whereas the diffraction patterns sharpen with the increase in substrate temperatures. The FESEM images indicate that ZnS films deposited at $400^{\circ}C$ have nano-sized grains with a grain size of ~ 67 nm. Then films exhibit relatively high transmittance of 80% in the visible region, with an energy band gap of 3.71 eV. One obvious result is that the energy band gap of the film increases with increasing the substrate temperatures.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1992.05a
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• pp.46-49
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• 1992

Cadmium sulfide thin films were deposited on glass substrate by Chemical Mist Deposition from solutions containing equimolar (0.1M) cadmium chloride and thiourea [(NH$_2$)$_2$CS] at a mist velocity of 1.6m/sec. Substrate temperatures were ranged between 200$^{\circ}C$ and 400$^{\circ}C$. The microstructure and semiconducting property of the films were investigated using SEM, X-ray diffraction, UV transmittance measurement and four point probe method. All the films have hexagonal structure and diffraction patterns indicate that the intensity of (112) and (101) reflections increase with increasing substrate temperature, whereas (002) reflection substrate temperature, whereas(002) reflection decrease for substrate temperatures between 250$^{\circ}C$ and 350$^{\circ}C$. The films prepared at lower temperature have a significant number of pinholes due probably to entrapped gaseous reaction. Optical transmittance of the films deposited at 350$^{\circ}C$ was about 75%. Optical bandgap of the films were 2.43eV regardless of substrate temperature. The dark resistivity of the films decreased with increasing substrate temperature up to 300$^{\circ}C$ and increased with further increasing substrate temperature. The films were photosensitive and had dark-to-light resistivity ratios of about 10 at room temperature for a white-light photoexcitation intensity of 50mw/$\textrm{cm}^2$.

• Proceedings of the Korean Vacuum Society Conference
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• 2000.02a
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• pp.25-25
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• 2000

In this talk we discuss the dynamics of hydrogen on the Si(100)-2xl surface. At room temperature the sticking coefficient for molecular hydrogen on this surface is less than 10sup-12. However, hydrogen molecules desorbing from the surface do not have an excess of energy, suggesting at best a small barrier on the exit channel. These observations have led to speculation about the validity of detailed balance in this system. Here we show that this discrepancy can be explained by considering both the surface-molecule co-ordinate and that associated with the Si-Si dimer bond tiltangle. By preparing the surface dimers with a specific tiltangle we demonstrate that the barrier to adsorption is a function of this angle and that the sticking coefficient dramatically increase for certain angles. The adsorption-desopption dynamics can then be described in terms of a common potential energy hypersurface involving both of these co-ordinates. The implications of these observations are also discussed. The dynamics of adsorbed hydrogen atoms on the Si(100) surface is also described. Paired dangling bonds produced following recombinative hydrogen desorption are mobile at elevated temperatures. Pairs of dangling bonds are observed to dissociate, diffuse, and ultimately recombine. At sufficiently elevated temperatures dangling bond exchange reactions are observed. These data are analyzed in terms of an attractive zone and an effective binding interaction between dangling bonds. Insights that this provides into the nature of surface defects and the localized chemistry that occurs on this surface, are also discussed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2008.05a
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• pp.374-377
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• 2008

Magnesium alloy sheets are usually formed at temperatures between $150^{\circ}C$and $300^{\circ}C$ because of their poor formability at room temperature. In the present study, the formability of AZ31B magnesium alloy sheets was investigated by the analytical and experimental approaches. First, tensile tests and the limit dome height test were carried out at elevated temperatures to get the mechanical properties and forming limit diagram, respectively. And then deep drawing of cross shaped die was tried to get the minimum corner radius and forming limit at specific temperature. Blank shape, punch velocity, minimum corner radius, fillet size, etc, were determined by finite element analysis physical try-outs. Especially, optimum punch and die temperature were suggested through the temperature-deformation analysis using Pam-stamp.

• Korean Journal of Metals and Materials
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• v.46 no.1
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• pp.1-5
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• 2008

This study has been investigated the deformation behavior of a hot-extruded Mg-Zn-RE (RE: rare earth elements) alloy containing $Mg_{12}$(RE) particles at the elevated temperatures. The particles are intrinsically produced by breaking the eutectic structure of the alloy during the hot-extrusion process. The grain size of the extruded Mg-Zn-RE alloy developed via dynamic recrystallization is around $10{\mu}m$. Under the heat treatment at 200o C up to 48 hr, no change has been observed on the microstructure and mechanical properties due to the pinning effect of the thermally stable particles. Under the tensile test condition in the initial strain-rate range of $1\times10^{-3}s^{-1}$ and the temperature range up to $200^{\circ}C$, the alloy shows yield strength of 270 MPa and elongation to failure around 9% at room temperature and yield strength of 135 MPa at $200^{\circ}C$. Furthermore, although the alloy contains large amount of the second phase particles around 15%, it shows excellent hot-workability possibly due to the presence of the thermally stable interface between the particles and the matrix.

• Transactions of the Korean Society of Pressure Vessels and Piping
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• v.20 no.1
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• pp.66-74
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• 2024

This study investigates the effects of temperatures and strain rates on the strength and ductility of Gr.91 (ASME Grade 91) steel which is widely being used as a heat-resistant material in Generation IV nuclear and super critical thermal power plants. The tensile behavior of modified 9Cr-1Mo (Gr.91) steel was studied for the three strain rates of 6.67×10^-5/s, 6.67×10^-4/s and 6.67×10-3/s over the temperature range from room temperature (RT) to 650℃. Experimental results showed that at specific combinations of temperatures (300~400℃) and strain rates, serrations appeared in the stress-strain curves. Concurrently, abnormal behaviors such as a plateau in yield strength and tensile strength, a minimum in ductility and negative strain rate sensitivity were observed. These phenomena were analyzed as significant characteristics of dynamic strain aging (DSA). Since this abnormal behavior in Gr.91 steel affects the material strength, it is judged that a correlation analysis between DSA and material strength should be crucial in the design and integrity evaluation of Gr. 91 steel pressure vessel and piping subjected to high-temperature loading.

• Progress in Superconductivity and Cryogenics
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• v.26 no.2
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• pp.19-23
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• 2024

3D printing has the advantage of being able to process various types of parts by layering materials. In addition to these advantages, 3D printing technology allows models to be processed quickly without any special work that can be used in different fields to produce workpieces for various purposes and shapes. This paper deals to not only increase the utilization of 3D printing technology, but also to revitalize 3D printing technology in applications that require similar cryogenic environments. The goal of this study is to identify the mechanical properties of polylactic acid and photopolymer resin processed by Fused Deposition Modeling (FDM) and Digital Light Processing (DLP) respectively. The entire process is meticulously examined, starting from getting the thermal contraction using an extensometer. A uniaxial tensile test is employed, which enables to obtain the mechanical properties of the samples at both room temperature (RT) and cryogenic temperature of 77 K. As the results, photopolymer resin exhibited higher tensile properties than polylactic acid at RT. However, at cryogenic temperatures (77 K), the photopolymer resin became brittle and failure occurred due to thermal contraction, while polylactic acid demonstrated superior tensile properties. Therefore, polylactic acid is more suitable for lower temperatures.