• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.319-319
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• 2013

Even though the fabrication methods of metal oxide based thin film capacitor have been well established such as RF sputtering, Sol-gel, metal organic chemical vapor deposition (MOCVD), ion beam assisted deposition (IBAD) and pulsed laser deposition (PLD), an applicable capacitor of printed circuit board (PCB) has not realized yet by these methods. Barium Strontium Titanate (BST) and other high-k ceramic oxides are important materials used in integrated passive devices, multi-chip modules (MCM), high-density interconnect, and chip-scale packaging. Thin film multi-layer technology is strongly demanded for having high capacitance (120 nF/$mm^2$). In this study, we suggest novel multi-layer thin film capacitor design and fabrication technology utilized by plasma assisted deposition and photolithography processes. Ba0.6Sr0.4TiO3 (BST) was used for the dielectric material since it has high dielectric constant and low dielectric loss. 5-layered BST and Pt thin films with multi-layer sandwich structures were formed on Pt/Ti/$SiO_2$/Si substrate by RF-magnetron sputtering and DC-sputtering. Pt electrodes and BST layers were patterned to reveal internal electrodes by photolithography. SiO2 passivation layer was deposited by plasma-enhanced chemical vapor deposition (PE-CVD). The passivation layer plays an important role to prevent short connection between the electrodes. It was patterned to create holes for the connection between internal electrodes and external electrodes by reactive-ion etching (RIE). External contact pads were formed by Pt electrodes. The microstructure and dielectric characteristics of the capacitors were investigated by scanning electron microscopy (SEM) and impedance analyzer, respectively. In conclusion, the 0402 sized thin film multi-layer capacitors have been demonstrated, which have capacitance of 10 nF. They are expected to be used for decoupling purpose and have been fabricated with high yield.

• 열처리공학회지
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• 제29권3호
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• pp.109-112
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• 2016

We have considered the influence of electron irradiation on the optical and electrical properties of $SnO_2$ thin films deposited with reactive RF magnetron sputtering. After deposition, the films electron irradiated at 300 eV shows a lower sheet resistance of $277{\Omega}/{\square}$ and the optical transmittance in a visible wave length region also influenced with the electron irradiation energy. The film that electron irradiated at 400 eV shows a higher optical transmittance of 82.6% in this study. By comparison of figure of merit, it is concluded that the post-deposition electron irradiation at 300 eV is the optimum condition for the enhancement of opto-electrcal performance of $SnO_2$ thin film in this study.

• 한국재료학회지
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• 제26권4호
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• pp.222-227
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• 2016

Tin oxides have been studied for various applications such as gas detecting materials, transparent electrodes, transparent devices, and solar cells. p-type SnO is a promising transparent oxide semiconductor because of its high optical transparency and excellent electrical properties. In this study, we fabricated p-type SnO thin film using rf magnetron sputtering with an SnO/Sn composite target; we examined the effects of various oxygen flow rates on the SnO thin films. We fundamentally investigated the structural, optical, and electrical properties of the p-type SnO thin films utilizing X-ray diffraction (XRD), X-ray photoelectron spectroscopy (XPS), UV/Vis spectrometry, and Hall Effect measurement. A p-type SnO thin film of $P_{O2}=3%$ was obtained with > 80% transmittance, carrier concentration of $1.12{\times}10^{18}cm^{-3}$, and mobility of $1.18cm^2V^{-1}s^{-1}$. With increasing of the oxygen partial pressure, electrical conductivity transition from p-type to n-type was observed in the SnO crystal structure.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.247-248
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• 2006

Carbon nitride films were evaluated that they had many advantages for miniature micro-humidity-sensors using the standard CMOS technology humidity sensing properties and CV characteristics of the carbon nitride films have been investigated for fabricating one chip HUSFET(Humidity Sensitive Field Effect Transistor) humidity sensors Carbon nitride films were deposited on silicon substrate with meshed electrodes by reactive RF magnetron sputtering system. The capacitor-type humidity sensor revealed good humidity-impedance characteristics with a wide range of relative humidity changes, decreasing $254k{\Omega}$ to $16k{\Omega}$ according to increase of relative humidity between 5% ~ 95% and the films were very stable on the Si wafer. These results reveal that $CN_x$ thin films can be used for Si based or HUSFET structure one chip micro-humidity sensors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.2
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• pp.872-875
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• 2003

Carbon nitride($CN_x$) thin films were deposited on quartz substrates using reactive RF magnetron sputtering system at uarious deposition conditions and investigated dielectric characteristics. Samples for capacitance measurements were of the MIM(Metal-Insulator-Metal) type devices. Aluminum film electrodes were prepared by a vacuum thermal evaporation method before and after the deposition of carbon nitride films. Capacitances were measured by a FLUKE PM6306 RCL Meter at room temperature. Current-voltage(I-V) characteristics and resistivity were measured by a CATS CA-EDA semiconductor test and analyzer. The carbon nitride films showed ${\alpha}-C_3N_4$ and ${\beta}-C_3N_4$ etc. peaks through Raman and FTIR. Observed surface of film and side structure using SEM(Scanning Electron Microscope), and measured thickness of film by ${\alpha}-step$. We can find that the dielectric constant was the lowest value in 50% nitrogen ratio and the resistivity was the highest value in 70% nitrogen ratio.

• 한국자기학회지
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• 제5권5호
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• pp.641-644
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• 1995

We have studied the effect of the nitrogen on the microstructure, thermomagnetic properties and corrosion resistance of Fe-Hf-C-N nanocrystalline thin films with high permeability and high saturation magnetization. These films were fabricated by reactive sputtering in $Ar+N_{2}$ plasma using an rf magnetron sputtering apparatus. As $P_{N2}$ increases, the microstructure changes from amorphous to crystalline $\alpha$-Fe phase and again returns to amorphous one. Spin wave stiffness constant increases with $P_{N2}$ until 5% $P_{N2}$, and then decreases with the further increase. This trend corresponds well with that of the microstructure with increasing $P_{N2}$. The Fe-Hf-C-N films with over 3% $P_{N2}$ show higher corrosion resistance than the N-free Fe-Hf-C films. The Fe-Hf-C-N films are considered to have high potentials for the head core materials suitable for high density recording systems, owing to their excellent soft magnetic properties and corrosion resistance.

• 한국재료학회지
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• 제11권7호
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• pp.580-584
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• 2001

Ti과 Si의 비가 서로 다른 종류의 타 을 $Ar/N_2$의 혼합기체를 사용하여 rf magnetron sputtering방법으로 증착된 Ti-Si-N박막의 증착특성에 대해 연구하였다. Ti-Si-N박막의 조성과 증착률은 각 타 Ti/Si의 비율과 증착시의 질소기체의 유량에 따라 크게 변하였다. 이것은 Ti과 Si의 nitriding 정도의 차이로 인한 서로 다른 sputter yield에 의한 것으로 나타났다. Si이 비교적 적게 포함된 Ti-Si-N박막은 증착시부터 박막내 TiN의 결정화가 일어났으며, 낮은 비저항을 나타내었다. N의 함량의 증가는 박막의 밀도와 압축응력을 증가시켜 Ti-Si-N박막의 확산방지 능력에 큰 영향을 미치는 인자로 나타났다. 본 연구에서 $N_2$의 유략과 타 의 Ti/Si비율을 조절함으로써 효율적인 확산방지막인 Ti-Si-N 박막의 공정조건을 확립할 수 있었다. 박막의 공정조건을 확립할 수 있었다.

• 한국진공학회지
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• 제7권3호
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• pp.237-241
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• 1998

In-situ X-선 산란 방법을 이용하여 R.F. 스퍼터링 방법에 의하여 성장시킨 AIN/Si(111)박막의 우선성장과 표면 거칠기의 성장 시간에 따른 변화를 연구하였다. 대부분 의 성장 조건하에서 초기의 AIN박막은 <001> 우선 성장 방위를 가지고 성장하였다. 하지 만 박막의 두께가 증가함에 따라 우선 성장 방위가 많이 바뀌었는데 이 현상은 높은 기판 온도와 높은 R.F. power에서 더욱 뚜렷이 나타났다. 이러한 현상은 <001> 성장 방위를 선 호하는 표면 에너지와 우선 성장 방위의 무질서도를 증가하게 하는 응력(strain)에너지에 관 련된 것으로 해석된다. 이 실험에서는 X-선 반사율을 측정하여 성장 도중의 표면 현상 또 는 연구하였다.

• 한국세라믹학회지
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• 제40권6호
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• pp.547-552
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• 2003

RF 마그네트론 스퍼터링법을 이용하여 유리기판위에 인가전력 100 W, 1.33Pa, Ar/O2=50 : 50, 20$0^{\circ}C$ 그리고 타겟과 기판사이의 거리 4 cm의 조건으로 ZnO 압전 박막을 성장시켰다. 증착된 박막의 결정성, 표면형상, 화학적 결합비와 전기적 특성을 XRD, SEM, AFM, RBS와 electrometer를 이용하여 측정 분석하였다 제조된 박막은 우수한 c축 우선 배향성을 보였고 또한 화학 양론적인 결합비를 나타내었다. 전극 구조가 single 및 double IDT를 갖는 ZnO/1DT/glass SAW 필터를 제작하여 특성을 분석한 결과, 전파속도는 각각 2,589 m/sec, 2,533 m/sec이었고, 삽입손실은 -11 dB과 -21 dB 값을 나타내어 박막형 SAW 필터로 응용이 기대된다.

• 한국재료학회지
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• 제7권6호
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• pp.510-516
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• 1997

반응성RF 마그네트론 스퍼터링 법으로 상온에서 c-축으로 우선 배향된 AIN 박막을 여러 기판 위에 증착하였다. SiO$_{2}$/Si, Si$_{3}$N $_{4}$Si, Si(100), Si(111)그리고 $\alpha$-AI$_{2}$O$_{3}$(0001) 기판에서 AIN(0002)로킹커브 피크의 표준편차는 각각 2.6˚, 3.1˚2.6˚, 2.5˚ 그리고 2.1˚ 의 값을 나타내었다. $\alpha$-AI$_{2}$O$_{3}$(0001) 기판에 증착된 AIN박막은 epitaxial 성장을 나타내었다. Si기판에 증착된 AIN박막에서 측정된 비저항과 1MHz 주파수에서 측정된 유전상수의 값은 각각 $10^{11}$Ωcm와 9.5였다. IDT/AIN/$\alpha$-AI$_{2}$O$_{3}$(0001)구저를 갖는 지연선 소자의 표면 탄성과 특성을 측정하였다. 상 속도, 전기기계 결합계수 그리고 전파손실은 H/λ가 0.17-0.5 범위에서 각각 5448-5640m/s, 0.13-0.17% 그리고 0.41-0.64dB/λ의 값을 나타내었다.다.