• Journal of the Korea institute for structural maintenance and inspection
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• v.5 no.2
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• pp.163-174
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• 2001

This paper is to study the characteristics of axial force behavior that operates to the part of turnout when it makes the turnout and the continuous welded rail unifying. The study is to model by using the 50kgN rail No. 15 turnout used in the domestic national railway and the UIC60 rail No. 18 turnout used in the rapid transit railway as the finite elements for analyzing the axial force behavior of the turnout by the continuous welded rail. It is to analyze the characteristics of behavior according to the change of creep resistance, ballast resistance and the change of parameter valuables of heel joint by the axial force simulation in making the continuous welded rail and then, it is to present the result. As the result of research on the parameter valuables through the analysis, it shows that the maximum axial force of turnout by the continuous welded rail are largely subordinated to the maximum resistance of heel joint and the fitting devices than the ballast resistance. Also it shows that the maximum axial force produced changes a lot according to the characteristics of creep resistance of the fitting part and the ballast resistance.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.16 no.5
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• pp.151-156
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• 2007

In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of $100^{\circ}C$ and $130^{\circ}C$ under the load of 15$\sim$20% of average pull strength in solder joints. The creep characteristics of each solder joints were compared using the creep strain-time curve and creep strain rate-stress curves. Through the comparison, the Sn-3Ag-0.5Cu solder joints have higher creep resistance than that of Sn-0.3Sb-0.4Ag-37.4Pb. Also, the grain boundary sliding in the fracture surface and the necking of solder joint were observed by FE-SEM.