• Journal of Microbiology and Biotechnology
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• 제22권11호
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• pp.1532-1539
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• 2012

The ${\alpha}$-galactosidase-coding gene agaAJB13 was cloned from Sphingomonas sp. JB13 showing 16S rDNA (1,343 bp) identities of ${\leq}97.2%$ with other identified Sphingomonas strains. agaAJB13 (2,217 bp; 64.9% GC content) encodes a 738-residue polypeptide (AgaAJB13) with a calculated mass of 82.3 kDa. AgaAJB13 showed the highest identity of 61.4% with the putative glycosyl hydrolase family 36 ${\alpha}$-galactosidase from Granulicella mallensis MP5ACTX8 (EFI56085). AgaAJB13 also showed <37% identities with reported protease-resistant or Sphingomonas ${\alpha}$-galactosidases. A sequence analysis revealed different catalytic motifs between reported Sphingomonas ${\alpha}$-galactosidases (KXD and RXXXD) and AgaAJB13 (KWD and SDXXDXXXR). Recombinant AgaAJB13 (rAgaAJB13) was expressed in Escherichia coli BL21 (DE3). The purified rAgaAJB13 was characterized using p-nitrophenyl-${\alpha}$-D-galactopyranoside as the substrate and showed an apparent optimum at pH 5.0 and $60^{\circ}C$ and strong resistance to trypsin and proteinase K digestion. Compared with reported proteaseresistant ${\alpha}$-galactosidases showing thermolability at $50^{\circ}C$ or $60^{\circ}C$ and specific activities of <71 U/mg with or without protease treatments, rAgaAJB13 exhibited a better thermal stability (half-life of >60 min at $60^{\circ}C$) and higher specific activities (225.0-256.5 U/mg). These sequence and enzymatic properties suggest AgaAJB13 is the first identified and characterized Sphingomonas ${\alpha}$-galactosidase, and shows novel protease resistance with a potential value for basic research and industrial applications.

• Korean Chemical Engineering Research
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• 제50권3호
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• pp.449-454
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• 2012

본 연구에서는 석탄의 연화온도보다 낮은 온도에서의 무회분 석탄 제조공정인 온순조건 용매추출 공정의 경제성을 분석하였다. 이를 위해 인도네시아 석탄 산지에 6,000 톤/일 규모의 온순조건 용매추출 플랜트를 건설하는 것으로 가정하였으며, 이 설비에 대하여 $96백만의 투자비용과, 내용년수 15년에 대한 IRR, B/C ratio, NPV, DPP를 계산하였다. 계산 결과 이 플랜트의 IRR은 31%, NPV는 $87백만, B/C ratio는 1.08, DPP는 3.9년인 것으로 계산되었으며, 이를 통해 석탄의 온순조건 용매추출 플랜트는 충분한 경제성이 있는 것으로 판단하였다. 민감도 분석 결과 무회분 석탄의 판매가격보다는 원료탄의 구입가격과 고품위 잔탄의 판매가격이 온순조건 용매추출 플랜트의 경제성을 크게 좌우하였다.

• 방사성폐기물학회지
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• 제11권2호
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• pp.85-93
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• 2013

본 연구는 우라늄 변환시설 운전 중에 발생된 우라늄 함유 슬러지를 가열 처리하여 분말 형태로 저장 중인 우라늄 함유 슬러지의 열분해 고체폐기물 (Thermal Decomposed Solid Waste of uranium-bearing sludge : TDSW)을 대상으로 TDSW의 용해, TDSW 질산 용해액의 알카리화에 의한 불순물 제거 및 탄산염 알카리화 용액의 산성화에 의한 U 선택적 제거/회수 특성 등을 규명하였다. TDSW의 용해는 질산용해가 탄산염 산화용해 보다 효과적이었다. 1M 질산에서 TDSW의 약 30wt%가 고체 잔류물로 불용해되었고, TDSW 내 함유 U은 99% 이상이 용해되었다. TDSW의 질산 용해액의 알카리화는 탄산염에 의한 알카리화가 불순물 제거 측면에서 보다 효과적이며, 탄산염 알카리화 (pH 약 9)에서 U과 공용해된 Ca, Al, Zn 및 Fe 등의 $98{\pm}1%$가 제거되었다. 그리고 불순물이 거의 제거된 알카리화 용액 (0.5 M $H_2O_2$ 첨가)의 산성화 (pH 약 3) 에서 U의 99% 이상을 회수할 수 있어 TDSW로부터 U을 선택적으로 제거/회수할 수 있었다.

• 한국해양환경ㆍ에너지학회지
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• 제12권1호
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• pp.23-28
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• 2009

폐FRP 선박을 재활용하는 기술은 많은 발전을 이루어 왔으며 최근에는 가장 재활용도가 적은 부분인 유리섬유의 고부가치화 재활용이 특히 주목받고 있다. 폐FRP 선박의 재처리 과정에서 추출된 유리섬유는 피막된 수지 성분의 내화학성으로 인하여 섬유보강재로서 사용 가능하다는 것이 보고되었다. 그러나 섬유보강재(laminated glass fiber reinforced material)를 추출하는 공정의 효율성과 경제성의 재고는 개선되어여할 과제이다. 본 연구는 다층구조인 FRP로부터 면포층(roving cloth layer)을 보다 효과적으로 박리할 수 있는 방법을 제시하여 추출공정의 최적화를 도모하고자한다. 새로운 추출공정에서 생산된 섬유보강재를 활용한 섬유강화콘크리트(Fiber Reinforced Concrete, FRC)의 강성은 매우 우수한 것으로 관찰되었다.

• 분석과학
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• 제11권3호
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• pp.189-193
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• 1998

조사후 핵연료의 용해실험 다음에 잔류된 불용성 잔유물을 구성하는 Mo, Ru, Rh 등의 원소로 이루어진 이성분계 합금인 $MoRu_3$와 $MoRh_3$을 아르곤 아아크로를 이용하여 $1700^{\circ}C$ 이상의 고온에서 합성하였다. 이들 합금의 정확한 구조와 결정격자상수는 ICDD(International Centre for Diffraction Data)에서 제작되는 분말회절수집철(JCPDS files) 등에 수록된 바가 없다. X선 회절분석결과 이들 두 합금은 육방밀집구조와 $P6_3/mmc$의 공간군을 갖는 $WRh_3$의 구조와 매우 유사한 것으로 나타났다. 이 화합물들의 격자상수, a와 c는 최소자승법을 이용하여 구하였다. 또한 XPS로 분석을 통하여 이들의 표면을 조사한 결과 금속 표면이 실온에서 공기와 접촉하였을 때 여러 구성성분 중에서 Mo(0)가 Mo(6+)로 산화되는 것을 확인하였는데, 아르곤이온으로 표면을 15분 정도 sputtering 하여 Mo(6+)층을 제거할 수 있었다. 합금의 구성성분 중, Mo, Ru, Rh 원소에서 내부 전자들의 결합에너지에는 커다란 변화가 없는 것으로 나타났다. 이들 화합물들의 자화율을 측정해 본 결과 2~300 K 범위에서 전형적인 Pauli-paramagnetic 행동을 보여주었다.

• 대한기계학회논문집A
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• 제30권7호
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• pp.841-848
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• 2006

Many researchers are developing computational prediction methods for protein tertiary structures to get much more information of protein. These methods are very attractive on the aspects of breaking technologies of computer hardware and simulation software. One of the computational methods for the prediction is a fragment assembly method which shows good ab initio predictions at several cases. There are many barriers, however, in conventional fragment assembly methods. Argues on protein energy functions and global optimization to predict the structures are in progress fer example. In this study, a new prediction method for protein structures is proposed. The proposed method mainly consists of two parts. The first one is a fragment assembly which uses very shot fragments of representative proteins and produces a prototype of a given sequence query of amino acids. The second one is a global optimization which folds the prototype and makes the only protein structure. The goodness of the proposed method is shown through numerical experiments.

• 한국대기환경학회지
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• 제31권1호
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• pp.63-71
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• 2015

The gaseous and particulate emissions from agricultural crop residues burning were investigated. The test residues included white soybean stem, pepper stem, apple branch, peach branch, pear branch, grape branch, sesame stem, perilla stem, and barley stem. Particulate emissions were dominated by fine particles (< $0.1{\mu}m$ in size). The highest $PM_{2.5}$ Emission factors were from barley stems (35.2 g/kg), and the lowest from pepper stems (7.9 g/kg). Emission factors for CO, NO, and VOCs were 146~305 g/kg, 4.94~15.02 g/kg, 27.4~353.3 g/kg, respectively. Benzene played an important role in VOCs emissions from biomass burning.

• Journal of Microbiology and Biotechnology
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• 제15권5호
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• pp.1039-1046
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• 2005

The salt resistance of antibacterial activity and synergistic effect with clinically used antibiotic agents are critical factors in developing effective peptide antibiotic drugs. For this reason, we investigated the resistance of antibacterial activity to antagonism induced by NaCl and $MgCl_2$ and the synergistic effect of P20 with cefotaxime. P20 is a 20-residue synthetic peptide derived from a cecropin A (CA)-melittin(ME) hybrid peptide. In this study, P20 was found to have potent antibacterial activity against clinically isolated methicillin-resistant Staphylococcus aureus (MRSA) strains without hemolytic activity against human erythrocytes. The combination study revealed that P20 in combination with cefotaxime showed synergistic antibacterial activity in an energy-dependent manner. We also confirmed the synergism between P20 and cefotaxime by fluorescence-activated flow cytometric analysis by staining bacterial cells with propidium iodide (PI) and bis-(1,3-dibutylbarbituric acid) trimethine oxonol (BOX). This study suggests that P20 may be useful as a therapeutic antibiotic peptide with synergistic effect in combination with conventional antibiotic agents.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.57-64
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology fur their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electrodes nickel, solder jetting, stud bumping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.

• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.51-59
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• 2000

As integrated circuits become more complex, the number of I/O connections per chip grow. Conventional wire-bonding, lead-frame mounting techniques are unable to keep up. The space saved by shrinking die size is lost when the die is packaged in a huge device with hundreds of leads. The solution is bumps; gold, conductive adhesive, but most importantly solder bumps. Virtually every semiconductor manufacturer in the world is using or planning to use bump technology for their larger and more complex devices. Several wafer-bumping processes used in the manufacture of bumped wafer. Some of the more popular techniques are evaporative, stencil or screen printing, electroplating, electroless nickel, solder jetting, stud humping, decal transfer, punch and die, solder injection or extrusion, tacky dot process and ball placement. This paper will discuss the process steps for bumping wafers using these techniques. Critical cleaning is a requirement for each of these processes. Key contaminants that require removal are photoresist and flux residue. Removal of these contaminants requires wet processes, which will not attack, wafer metallization or passivation. Research has focused on enhanced cleaning solutions that meet this critical cleaning requirement. Process parameters defining time, temperature, solvency and impingement energy required to solvate and remove residues from bumped wafers will be presented herein.