• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.513-513
• /
• 2012

핵 융합로의 대면재질(Plasma Facing Material; PFM)은 고온의 플라즈마와 고 에너지의 이온들에 지속적으로 노출 된다. 특히 PFM은 흡착되는 기체 등에 의한 부식과 변형이 발생할 수 있다. 현재 핵 융합로 내부의 PFM으로 고려되고 있는 재질 중 하나인 고순도 탄소타일의 경우 고온의 수소동위원소 플라즈마에 직접적으로 노출되므로 이에 의한 탄소타일에 흡착되는 수소 등의 기체에 대한 정량적인 분석방법이 필요하다. 본 연구는 고순도 탄소타일 등과 같은 플라즈마 대면재료에 흡착되어 있는 물질의 정량적 분석이 가능한 TDA (Thermal Desorption Analyzer)의 개념 설계에 관한 것이다. TDA는 고온 가열($800^{\circ}C$ 이상) 및 시료 장착부 및 초고진공(~10-9 torr) 및 측정부의 두 부분으로 구성 하였다. TDA 설계시 고온 가열 및 시료 장착부는 시료 내부에 흡착되어 있는 기체의 효과적 탈착을 위한 가열 및 시료의 모양에 영향을 받지 않는 장착방법, 시료 장착부의 outgassing rate를 최소화 하는 재질 선정 등을 고려하였으며, 초고진공(~10-9 torr) 및 측정부는 초고진공 유지방법, 터보펌프 배기속도 실측을 위한 구조, 진공측정 ion 게이지, 잔류가스분석기(Residual Gas Analyzer)의 최적위치 설정 등을 고려하여 설계하였다. 개념 설계된 TDA에 대하여 발표하고자 한다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.22 no.11
• /
• pp.961-968
• /
• 2009

In this work, transparent conductive oxide(TCO) films such as $In_2O_3-SnO_2$(ITO) and $In_2O_3-ZnO$(IZO) were prepared on polyethylene naphthalene(PEN) and glass substrates by using rf-magnetron sputtering system. The TCO films deposited on PEN substrate show very poor conductivity as compared to that of the TCO films deposited on glass substrates. From the results of the residual gas analysis(RGA) test, this poor stability of plastic substrate is presumed to be caused by the deteriorated adhesion between the TCO films and the plastic substrate due to outgassing from the plastic substrate during deposition of TCO films. From our experiment, it is found that the vaporization of some defects in the plastic substrates deteriorate the adhesion of the TCO films to the plastic substrate, because the most plastic substrates containing the water vapor and/or other adsorbed particles such as organic solvents. Mixing of these gases vaporized in the sputtering process will also affect the electrical property of the deposited TCO films. Inorganic thin composite $(SiO_2)_{40}(ZnO)_{60}$ film as a gas barrier layer is coated on the PEN substrate to protecting the diffusion of vapors from the substrate, so that the TCO films with an improved quality can be obtained.

• Journal of Sensor Science and Technology
• /
• v.13 no.5
• /
• pp.329-334
• /
• 2004

Functional residual capacity (FRC) is an important diagnostic parameter measured using $N_{2}$ analyzer. Since $N_{2}$ analyzer is expensive as well as cumbersome for use of noisy vacuum pump, the FRC measurement becomes possible only in large well-equipped hospitals. The present study introduced a new $TN_{2}$ wash-out technique to measure FRC by $O_{2}/CO_{2}$ analysis, which is relatively cheaper and much simpler to apply. Slower $O_{2}$ response was compensated for high frequency to be coincided with $CO_{2}$ response, thereby enabled indirect, but accurate $N_{2}$ concentration measurement. FRC was estimated by continuous integration of expired $N_{2}$ volume obtained with air flow signal. Experiment with 3 L syringe, a standard calibration device recommended by the American Thoracic Society, demonstrated less than 1% error at 0, 1, and 2 L. Correlation coefficient was almost ideal, guaranteeing linear estimation of FRC. The present technique is inexpensive and simple to apply, thus should he of great convenience.

• Transactions on Electrical and Electronic Materials
• /
• v.6 no.6
• /
• pp.262-271
• /
• 2005

In order to achieve timely and accurate fault detection of plasma etching process, neural network based time series modeling has been applied to reactive ion etching (RIE) using two different in-situ plasma-monitoring sensors called optical emission spectroscopy (OES) and residual gas analyzer (RGA). Four different subsystems of RIE (such as RF power, chamber pressure, and two gas flows) were considered as potential sources of fault, and multiple degrees of faults were tested. OES and RGA data were simultaneously collected while the etching of benzocyclobutene (BCB) in a $SF_6/O_2$ plasma was taking place. To simulate established TSNNs as incipient fault detectors, each TSNN was trained to learn the parameters at t, t+T, ... , and t+4T. This prediction scheme could effectively compensate run-time-delay (RTD) caused by data preprocessing and computation. Satisfying results are presented in this paper, and it turned out that OES is more sensitive to RF power and RGA is to chamber pressure and gas flows. Therefore, the combination of these two sensors is recommended for better fault detection, and they show a potential to the applications of not only incipient fault detection but also incipient real-time diagnosis.

• Journal of the Korean Vacuum Society
• /
• v.13 no.4
• /
• pp.139-144
• /
• 2004

Recently, the importance of clean vacuum and partial pressure measurement of gas species has been increased in the vaccum process. In this study, the partial pressures of $H_2$, He, C, N, $O_2$, $H_2O $, Ar/2, $N_2$(CO), Ar, $CO_2$ were measured by residual gas analyzer according to temperature of cryogenic pump which is used to clean vacuum generation and compared. The experimental results showed that the cryopanel temperature was reached to 12K after 72 minutes of pumping and after 25hours, the partial pressures in percent were 24.9 %, 6.6%, 5.5 %, 2.2 %, 3.8%, 30.7%, 6.5%, 6.1 %, 5.5%, 8.2% for $H_2$, He, C, N, $O_2$, $H_2O $, Ar/2, $N_2$, Ar, $CO_2$ respectively. The dominant gases were $H_2$ and $H_2O $, and the partial pressures were relatively high compare to other gases.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2015.08a
• /
• pp.103.1-103.1
• /
• 2015

위성체 개발에 있어서 지상에서 위성체의 부품에 대한 고온($85^{\circ}C$ 이상)과 고진공($5.0{\times}10-3Pa$ 이하)의 상태를 모사하여 오염물질을 제거하는 베이크아웃 시험이 필수적이다. 일반적으로 베이크아웃 시험의 종료여부는 TQCM (Thermoelectric Quartz Crystal Microbalance)을 이용한 탈기체(outgassing)의 흡착률을 측정하여 결정한다. 측정된 흡착률을 통해 시험 대상 표면에서 발생하는 탈기체량을 추정할 수 있으며, 결국 시험 대상의 우주 부품으로써의 적합성을 판단할 수 있다. TQCM을 적용하지 못하는 경우, 베이크아웃 시험 종료여부를 판단하기 위해 잔류가스분석기(Residual Gas Analyzer: RGA)를 활용하는 것을 고려하였다. 베이크아웃 시험 중 잔류가스분석기를 활용하여 시편에서 방출되는 오염물질을 측정하였으며, 그 중 측정량이 가장 많은 40-45 amu 범위의 측정값 추이를 관찰하여, 베이크아웃 시험 종료조건 수립 가능성을 검토하였다.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.08a
• /
• pp.51-51
• /
• 2010

Residual Gas Analyzer(RGA)는 진공공정에서 전구체를 측정하고 분석하는 기기로써 다양한 방법으로 반도체나 디스플레이 소자제조를 위한 진공공정에 많이 사용되고 있다. 특히, 최근의 반도체 공정은 고집적화와 design의 나노 사이즈화로 인해, 안정적인 MOCVD 공정의 진행에 있어서 중요한 Factor중에 전구체의 안정적인 공급에서 어려움이 있다. 공정에 투입된 전구체의 질적, 양적인 실시간 모니터링이 불가능한 상태로 공정이 진행되어 원활한 박막의 생산에 큰 어려움을 격고 있다. 또한, 전구체의 정상상태를 확인 할 수 없음으로 인한 질적인 저하 등을 그 예로 들수 있겠다. 기존 양산 후 남은 전구체를 외관상의 변색, 점도 변화를 통해서 변질을 확인하고 전구체를 교체함으로써, 엄청난 경제적 손실을 가져왔다. 본 연구에서는 reference 전구체와 공정에서 사용된 전구체를 이용하여 Vapor Pressure측정과, FT-IR 측정, RGA분석을 통하여 전구체의 사용 전, 후를 비교 분석하고자 한다.

• 한국정보디스플레이학회:학술대회논문집
• /
• 2006.08a
• /
• pp.126-129
• /
• 2006

AC-plasma display panels were examined before and after the aging process to analyze the effect of the aging process. The gas analysis was done to detect the impurity gases out of the MgO film and phosphor by a residual gas analyzer. There were no differences found in the components. The MgO film was analyzed to find out the effect of an ion bombardment due to discharge. The surface roughness of the MgO film was different from regional groups due to the different degree of ion bombardments. XPS analysis showed that the 8 hour aging process was not sufficient to remove $Mg(OH)_2$ and $MgCO_3$ existed on the MgO surface. Photoluminescence measurement showed the small deterioration of blue and green phosphor.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2010.02a
• /
• pp.284-284
• /
• 2010

Currently, hydrogen has been produced by Steam Reforming or partial oxidation reforming processes mainly from oil, coal, and natural gas and results in the production of $CO_2$. However, these are influenced greatly on the green house effect of the earth. so it is important to find the new way to produce hydrogen utilizing water without producing any environmentally harmful by-products. In our research, we use microwave water plasma and photocatalyst to improve dissociation rate of water. At low pressure plasma, electron have high energy but density is low, so temperature of reactor is low. This may cause of recombination in the generated hydrogen and oxygen from splitting water. If it want to high dissociation rate of water, it is necessary to control of recombination of the hydrogen and oxygen using photocatalyst. We utilize the photocatalytic material($TiO_2$, ZnO) coated plasma reactor to use UV in the plasma. The quantity of hydrogen generated was measured by a Residual Gas Analyzer.

• Journal of the Korean Vacuum Society
• /
• v.11 no.2
• /
• pp.87-96
• /
• 2002

Outgassing from such sources as paints, coatings, adhesives and other non-metallic surfaces can contaminate satellites, especially second surface mirror and optical lens, it cause satellite to fail in own missions. The vacuum bake-out test using high temperature(more than $85 ^{\circ}C$)and high vacuum(less than $5.0{\times}1-^{-3}$ Pa) certify that the components of satellite work properly and can survive and operate in space environment like high vacuum. In the bake-out chamber installed at SITC of KARI, Rotary vacuum pump and Booster pump produce low vacuum of 5.0 Pa, and then two cryopumps produce high vacuum of below $5.0{\times}10^{-3}$ Pa. Also 48 ceramic heaters were provided to simulate high temperature. During the vacuum bake-out test, we detected contaminants using RGA(Residual Gas Analyzer) and measure the outgassing rate of the contaminant using the TQCM(Thermoelectric Quartz Crystal Microbalance). Also, IR/UV Spectrometer and witness plate be used to certify that the components were suitable for the spacecraft. This paper includes the preparation and procedures of the bake-out test for SAR(Solar Array Regulator) and MLI(Multi Layer Insulator), which were the components of the spacecraft. Especially, we discussed the methods and results of the contamination measurement. In the bake-out for SAR, the contamination was measured continuously although it was on the decrease from TQCM results. And RCA established that it is a highly polymerized compound. In the MLI bake-out using RGA and witness plate, we didn't detect any contamination materials.