• Computers and Concrete
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• v.18 no.2
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• pp.267-278
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• 2016

In order to observe the internal damage of concrete in real time, we introduced acoustic emission nondestructive detecting technology into a series of fracture tests; the test results revealed the whole process that concrete undergoes when it sustains damage that leads to failure, according to the change rules of the acoustic emission parameters. The results showed that both the initiation and unstable loads can be accurately determined using the abrupt change of the acoustic emission rate curves and the turning point of the acoustic emission parameters' accumulative curves. The whole process, from damage to failure, includes five phases, beginning with damage, such as cracking, a stable crack growth process, a critical unstable stage, and unstable propagation. The brittle fracture characteristics of concrete change when steel bars are joined, because the steel bars and the concrete structure bond, which causes an increase in the acoustic emission signals within the fracture process of the reinforced concrete. The unstable propagation stage is also extended. Our research results provide a valid methodology and technical explanations, which can help researchers to monitor the cracking process of concrete structures, in real time, during actual projects.

• Textile Coloration and Finishing
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• v.18 no.3 s.88
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• pp.16-22
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• 2006

Process contract has received considerable attention in silk degumming processes because of its critical role in quality assurance. In degumming, process exhibits shrinkage of high twisted yarn and lot-varying behavior, thus increasing the difficulties of reduction by conventional means. This necessitates the application of a package that adapts to changing degumming process, and a new approach involving package degumming is proposed. The gains of this process are prevent of shrinkage by package winding, which is simplified by reduced soft-winding or re-twisting process. The approach is expected to achieve high quality results in conventional process due to its feature of demage by tension and rubbing. Therefore package degumming has many merits such as reduce of pilling and shrinkage, production expenses saving by process contract are expected of the simplified degumming process.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.14 no.5
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• pp.36-41
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• 2015

In this paper, research on the mold design of motor housing produced by the HPDC process was conducted using computer simulations and experiments. Recently, automobile parts have been required to be light and have high strength. The die casting process was used to manufacture automotive motor housings. In the die casting process, the control of casting defects is very important. However, it has usually depended on the experience of the foundry engineer. For the analysis of the manufacturing process of motor housing, the finite element method is applied. Through the simulations using commercial software, the filling pattern and product defects could be confirmed. The analysis results obtained from the filling behavior of the casting process agreed with the experimental results. The computer simulation results of filling behavior were reflected in the optimal mold design of motor housing.

• Korean Chemical Engineering Research
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• v.46 no.3
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• pp.633-638
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• 2008

The bunsen reaction, part of IS(Iodine-sulfur) cycle that one of the hydrogen production by the thermochemical water splitting, was investigated. It was observed that $H_2SO_4$ was uniformly generated and generation of $H_2SO_4$ was independent of iodine input. However, generation of HI was decreased with increasing iodine input. It was thought that HI and unreacted iodine were formed complex compound such as $HI_3$ $HI_5$ or $HI_7$. The complex compound accelerated liquid-liquid separation properties in the product. It was also revealed that reaction kinetics was increased with increasing iodine input. Liquid-liquid separation properties were improved with increasing iodine input and reaction temperature. Moreover, no side reaction was occurred at all reaction conditions.

• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.43-48
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• 2016

3-Dimensional System in Package (3-D SiP) structure (Amkor calls it mPossum-molded Possum) using double side Surface Mount Technology (SMT) and double side molding was evaluated in order to achieve small/thin form factor as well as good functionality by integration and double side layout. As the new platform on laminate substrate basis, molding process was challenge in mold flow balance at top and bottom side and package warpage control over the overall assembly process. There were two types of different molding process evaluated with 1) 1-step molding which was done at both side at the same time and 2) 2-step molding which was done at the conventional molding process twice. Mold simulation helped to narrow down the material selections and parameters available before actual sample build. There were many challenges for this first trial in design/ parameter and material types but optimized them to enable this structure.

• Journal of Korean Society of Occupational and Environmental Hygiene
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• v.29 no.3
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• pp.310-321
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• 2019

Objectives: The purpose of this study was to investigate types and characteristics of chemical substances used in LCD(Liquid crystal display) panel manufacturing process. Methods: The LCD panel manufacturing process is divided into the fabrication(fab) process and module process. The use of chemical substances by process was investigated at four fab processes and two module processes at two domestic TFT-LCD(Thin film transistor-Liquid crystal display) panel manufacturing sites. Results: LCD panels are manufactured through various unit processes such as sputtering, chemical vapor deposition(CVD), etching, and photolithography, and a range of chemicals are used in each process. Metal target materials including copper, aluminum, and indium tin oxide are used in the sputtering process, and gaseous materials such as phosphine, silane, and chlorine are used in CVD and dry etching processes. Inorganic acids such as hydrofluoric acid, nitric acid and sulfuric acid are used in wet etching process, and photoresist and developer are used in photolithography process. Chemical substances for the alignment of liquid crystal, such as polyimides, liquid crystals, and sealants are used in a liquid crystal process. Adhesives and hardeners for adhesion of driver IC and printed circuit board(PCB) to the LCD panel are used in the module process. Conclusions: LCD panels are produced through dozens of unit processes using various types of chemical substances in clean room facilities. Hazardous substances such as organic solvents, reactive gases, irritants, and toxic substances are used in the manufacturing processes, but periodic workplace monitoring applies only to certain chemical substances by law. Therefore, efforts should be made to minimize worker exposure to chemical substances used in LCD panel manufacturing process.

• Journal of Korea Technical Association of The Pulp and Paper Industry
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• v.37 no.4 s.112
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• pp.44-51
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• 2005

Paper mills use and discharge lots of water. And so now the papermaking industry could be classified into major water consuming industry In order to analyze the process water network and to establish the mass, water balance of duplex board mill, computer aided simulation was made using water pinch method. Based on the pinch analysis results, reuse of process water, after regenerating by microfilter as much as $140\;m^3/hr$, could be suggested without significant accumulation of contaminants in process water. According to this suggestion about $3000\;m^3/day$ of recycled process water could be sub stituted by regenerated water and consequently $30\%$ of energy cost is expected to be reduced.

• Journal of Microbiology and Biotechnology
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• v.9 no.5
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• pp.613-618
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• 1999

L-Proline-producing mutant strains were developed by exposing L-glutamic acid-producing bacteria to N-metyl-N-nitro-nitrosoguanidine and UV irradiation. A L-histidine auxotroph of Corynebacterium acetoacidophilum RYU3161(KCTC 0616BP), which was resistant to sulfaguanidine and proline analogs (DHP, AZC, TAC), was isolated. The activity of the mutant strain's $\gamma$-glutamyl kinase was 45% higher than that of the parent strain. The optimum level of L-histidine for production of L-proline was 0.16 g/l. In a 5-1 jar fermenter, the mutant strain produced L-proline at a high concentration (35 g/l) level within 48 h of cultivation.

• 한국정보디스플레이학회:학술대회논문집
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• 2002.08a
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• pp.519-522
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• 2002

In this paper, we analyze the impact of plasma etching process induced device degradation on low temperature poly-Si TFTs. The results indicate the relationship between device degradation and PPID effect during plasma fabrication. The dual-gate structure, which is used to suppress leakage current, is also discussed in this research.

• Journal of Navigation and Port Research
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• v.35 no.7
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• pp.575-580
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• 2011

It is important to understand the trajectory of structure in launching process because of the short time of launching process may result in unexpected accidents or damage to structures. The high risk of structural failure is not avoidable without the fully comprehension of changing forces in launching procedure. The commercial software can evaluate the motion of launching event in calm water condition but there is the limitation of research application because of the programmed commercial software. The launching process of the spar hull is suggested with stage concept that is divided into 10 stages in time domain. A force equilibrium diagram is derived for each stage where the changes of force vector and motion characteristics take place. In particular, the effects of changes in buoyancy and drag force due to the progressive submergence of the spar hull are taken into account by means of a touch length concept. The results contained in this paper provide the valuable information of the trajectory motion evaluation with suggested methods in spar launching process with sliding barge. Furthermore, the presented stage concept and touch length concept will provide basic knowledge for understanding launching process and help to develop further research area for launching analysis.