• Journal of the Korean Society of Manufacturing Process Engineers
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• v.19 no.7
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• pp.67-73
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• 2020

Shrinkage is inevitable in the curing of resins during the nanoimprint process. The degree of shrinkage that occurs as the resin transforms from a viscous liquid to solid differs depending on the type of resin. However, if the cured material is repeatedly cured using the same material, constant shrinkage can be confirmed. In this study, the pattern of change was observed by repeatedly performing the nanoimprint process using a resin with a constant shrinkage rate. The observed pattern for the change of shape was made using a triangular pyramid-shaped aluminum master mold and a flexible replica mold made from the master. Shrinkage that results from the nanoimprint process occurs linearly in the longitudinal direction of the pattern and can be predicted by simple calculations. The change of the pattern due to shrinkage occurred as expected. If the shrinkage rate remains constant, various patterns can be manufactured with high accuracy by correcting these changes before producing a specific shape. This study confirms that the pattern of the desired angle can be obtained by performing the repeated imprint without having to manufacture a master mold.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.24 no.10
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• pp.790-793
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• 2011

In this study, the surface modification for a silicon(Si) mold using $CHF_3$ inductively coupled plasma(ICP). The conditions under that plasma was treated a input ICP power 600 W, an operating gas pressure of 10 mTorr and plasma exposure time of 30 sec. The Si mold surface became hydrophobic after plasma treatment in order to $CF_x$(X= 1,2,3) polymer. However, as the de-molding process repeated, it was investigated that the contact angle of Si surface was decreased. So, we attempted to investigate the degradation mechanism of the accurate pattern transfer with increasing the count of the de-molding process using scanning electron microscope (SEM), contact angle, and x-ray photoelectron spectroscopy (XPS) analysis of Si mold surface.