• Title/Summary/Keyword: Removal of impurities

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Removal of Cu impurities in LiBr solution using cyclone electrowinning method (싸이클론 전해환원방법을 이용한 LiBr 용액내의 Cu 불순물 제거에 관한 연구)

  • Da Jung Park;Kyu Hwan Lee
    • Journal of the Korean institute of surface engineering
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    • v.57 no.2
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    • pp.92-97
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    • 2024
  • The LiBr aqueous solution, which is the absorption liquid of absorption refrigerator, must be replaced periodically because the concentration of impurities such as Cu2+, Fe2+, Ca2+, etc., increases due to corrosion of the tubes as the period of use increases, and the refrigeration efficiency decreases significantly. In order to reuse the waste absorption liquid, flocculation-precipitation method is mainly applied to precipitate the impurities, which requires hundreds of times the concentration of impurities and generates additional waste. In this study, a process for removing Cu ion impurities from cyclone electrolyzer by electrolytic reduction is presented in a small-scale facility without additional waste. It was confirmed that Cu ion impurities can be removed down to 1 ppm by electrolytic reduction process, and to further improve the removal rate, the mass transfer rate was increased by using a cyclone electrolyzer. The removal rate of Cu ions increased with the increase of flow rate and current density, and it was confirmed that Cu was removed at a rate of 1.48 ppm/h under the condition of 330 mL/sec and 2.5 mA/cm2.

Removal of Cu and Fe Impurities on Silicon Wafers from Cleaning Solutions (세정액에 따른 실리콘 웨이퍼의 Cu 및 Fe 불순물 제거)

  • Kim, In-Jung;Bae, So-Ik
    • Korean Journal of Materials Research
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    • v.16 no.2
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    • pp.80-84
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    • 2006
  • The removal efficiency of Cu and Fe contaminants on the silicon wafer surface was examined to investigate the effect of cleaning solutions on the behavior of metallic impurities. Silicon wafers were intentionally contaminated with Cu and Fe solutions by spin coating and cleaned in different types of cleaning solutions based on $NH_4OH/H_2O_2/H_2O\;(SC1),\;H_2O_2/HCl/H_2O$ (SC2), and/or HCl/$H_2O$ (m-SC2) mixtures. The concentration of metallic contaminants on the silicon wafer surface before and after cleaning was analyzed by vapor phase decomposition/inductively coupled plasma-mass spectrometry (VPD/ICP-MS). Cu ions were effectively removed both in alkali (SC1) and in acid (SC2) based solutions. When $H_2O_2$ was not added to SC2 solution like m-SC2, the removal efficiency of Cu impurities was decreased drastically. The efficiency of Cu ions in SC1 was not changed by increasing cleaning temperature. Fe ions were soluble only in acid solution like SC2 or m-SC2 solution. The removal efficiencies of Fe ions in acid solutions were enhanced by increasing cleaning temperature. It is found that the behavior of metallic contaminants as Cu and Fe from silicon surfaces in cleaning solutions could be explained in terms of Pourbaix diagram.

Cr, Ni and Cu removal from Si wafer by remote plasma-excited hydrogen (리모트 수소 플라즈마를 이용한 Si 웨이퍼 위의 Cr, Ni 및 Cu 불순물 제거)

  • 이성욱;이종무
    • Journal of the Korean Vacuum Society
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    • v.10 no.2
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    • pp.267-274
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    • 2001
  • Removal of Cr, Ni and Cu impurities on Si surfaces using remote plasma-excited hydrogen was investigated. Si surfaces were contaminated intentionally by acetone with low purity. To determine the optimum process condition, remote plasma-excited hydrogen cleaning was conducted for various rf-powers and plasma exposure times. After remote plasma-excited hydrogen cleaning, Si surfaces were analyzed by Total X-ray Reflection Fluorescence(TXRF), Surface Photovoltage(SPV) and Atomic Forece Microscope(AFM). The concentrations of Cr, Ni and Cu impurities were reduced and the minority carrier lifetime increased after remote plasma-excited hydrogen. Also RMS roughness decreased by more than 30% after remote plasma-excited hydrogen cleaning. AFM analysis results also show that remote plasma-excited hydrogen cleaning causes no damage to the Si surface. TXRF analysis results show that remote plasma-excited hydrogen cleaning is effective in eliminating metallic impurities from Si surface only if it is performed under an optimum process conditions. The removal mechanism of the Cr, Ni and Cu impurities using remote plasma-excited hydrogen treatments is proposed to be the lift-off during removal of underlying chemical oxides.

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A Study on the Purification of Domestic Kaolin Mineral (국내산 고령토정제에 관한 연구)

  • Shin, Kun-Chul;Lee, Jae-Jang;Chun, Ho-Seok;Choi, Seong-Baek
    • Journal of Industrial Technology
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    • v.10
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    • pp.83-88
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    • 1990
  • The samples used for this work were low grade c1ay($Fe_2O_3$ : 2.90%, $TiO_2$ : 1.65%) produced from Youngsan-po district, and for the iron-bearing impurities removal having a bad influence on Kaoline sample was carried out column floatatoin using Oleic acid, Potassium oleat, Aero 840 promotor, Aero 870 promotor and Keroseneas collectors. For removal of the iron-vearing impurities from the kaoline, investigated first chemical composition size distribution of Kaoline sample, also performanced a basic study on pulp density, collector and pH change on a sort of frother. The flotation separation of impurities from kaoline can be achieved by using both oleic acid and Aero 840 promotor as collectors within narrow acid limits(pH 2-3). Pine oil was more effective frother than MIBC with olelic acid as aa collector.

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Microbial population dynamics in constructed wetlands: Review of recent advancements for wastewater treatment

  • Rajan, Rajitha J.;Sudarsan, J.S.;Nithiyanantham, S.
    • Environmental Engineering Research
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    • v.24 no.2
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    • pp.181-190
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    • 2019
  • Constructed wetlands are improvised man-made systems, designed for adopting the principle of natural wetlands for purifying wastewater - the elixir of life. They are used widely as a cost-effective and energy-efficient solution for treating greywater generated from different tertiary treatment sources. It provides an elaborate platform for research activities in an attempt to recycle earth's natural resources. Among the several organic impurities removal mechanisms existing in constructed wetland systems, the earth's active microbial population plays a vital role. This review deals with the recent advancements in constructed wetland systems from a microbiological perspective to (effect/ devise/ formulate) chemical and physical treatment for water impurities. It focuses on microbial diversity studies in constructed wetlands, influence of wetland media on microbial diversity and wetland performance, role of specific microbes in water reuse, removal of trace elements, some heavy metals and antibiotics in constructed wetlands. The impurities removal processes in constructed wetlands is achieved by combined interactive systems such as selected plant species, nature of substrate used for microbial diversity and several biogeochemical effected reaction cycles in wetland systems. Therefore, the correlation studies that have been conducted by earlier researchers in microbial diversity in wetlands are addressed herewith.

Removal of Impurities from Metallurigical Grade Silicon by Acid Washing (금속급(金屬級) 실리콘에서 산세척(酸洗滌)에 의한 불순물(不純物)의 제거(除去))

  • Lee, Man-Seung;Kim, Dong-Ho
    • Resources Recycling
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    • v.20 no.1
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    • pp.61-68
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    • 2011
  • Impurity removal from metallurgical grade silicon by acid washing at $50^{\circ}C$ was investigated by employing sulfuric, nitric acid and the mixture of hydrochloric and hydrofluoric acid. Acid washing treatment had no effect on the removal of boron and the concentration of this clement after treatment was rather increased. In our experimental range, the removal percentage of phosphorus was 60%. In the acid washing with sulfuric and nitric acid, the removal percentage of major impurities was below 50%, which indicates that refining effect was not great with these acids. Acid washing with the mixture of hydrochloric and hydrofluoric acid led to removal percentage of higher than 90%. Data on the purity of silicon after acid washing at various conditions are reported.

The Effects of Impurities of Polyester Fiber Fabric on the Dyeing Property (Polyester 섬유직물에 함유된 불순물이 염색성에 미치는 영향)

  • 박민식;장철민;엄재영;김삼수;허만우
    • Textile Coloration and Finishing
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    • v.10 no.1
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    • pp.43-50
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    • 1998
  • In order to investigate the effect of contained impurities of polyester fiber fabric on the scouring and dyeing property, 3 kinds of polyester fabrics were heat-set treated at $160-200^\circ{C}$ and evaluated its scouring and dyeing property by through with soxhlet extraction and K/S value of the dyed fabric derived from the surface reflectance. The impurities such as oiling and sizing agent are adhered more strongly on the polyester fabric surface by heat setting temperature. In scouring test, the removal of the these re-adhered impurities on the polyester fabric is very difficult in comparing with unheat-set treated polyester fabric. It is also confirmed that the remained impurities on the polyester fiber decreased its dyeing property.

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A Study of Organic Impurity Removal Efficiency for Waste LCD Touch Panel Glass by Solvents Types (폐 LCD 유리 재활용을 위한 용매 별 유기물 제거 효율에 대한 연구)

  • Kang, Yubin;Choi, Jin-Ju;Park, Jae Layng;Lee, Chan Gi
    • Resources Recycling
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    • v.29 no.6
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    • pp.57-64
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    • 2020
  • In this study, removal of OCA and organic impurities for recycling LCD touch panel glass was conducted by mechanical and chemical dissolution methode. Cut mill and oscillation mill were used for mechanical crushing of touch panel, and water, ethanol, dichloromethane were used to remove OCA and organic impurities. As a result of TGA, when applied only dicloromethane in the process, the efficiency of organic removal was to be best. In addition, removal effect of organic impurities increased as the cleaning temperature increased. As a result of zeta potential analysis to confirm the dispersion degree of touch panel glass in the solvent, the absolute value of the zeta potenial of water with the lowest cleaning effect was lower than other solvents, and it was confirmed that efficiency of organic removal is affected not only by the chemical dissolution properties but also the physical dispersion properties in the solvent.

Effect of Residual Impurities on Solid State Sintering of the Powder Injection Molded W-15 wt%Cu Nanocomposite Powder (분말사출성형한 W-15 wt%Cu 나노복합분말의 고상소결에 미치는 잔류불순물의 영향)

  • 윤의식;이재성;윤태식
    • Journal of Powder Materials
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    • v.9 no.4
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    • pp.235-244
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    • 2002
  • The effects of residual impurities on solid state sintering of the powder injection molded (PIMed) W-15wt%Cu nanocomposite powder were investigated. The W-Cu nanocomposite powder was produced by the mech-ano-chemical process consisting of high energy ball-milling and hydrogen reduction of W blue powder-cuO mixture. Solid state sintering of the powder compacts was conducted at $1050^{\circ}C$ for 2~10 h in hydrogen atmosphere. The den-sification of PIM specimen was slightly larger than that of PM(conventional PM specimen), being due to fast coalescence of aggregate in the PIM. The only difference between PIM and PM specimens was the amount of residual impurities. The carbon as a strong reduction agent effectively reduced residual W oxide in the PIM specimen. The $H_2O$ formed by $H_2$ reduction of oxide disintegrated W-Cu aggregates during removal process, on the contrary to this, micropore volume rapidly decreased due to coalescence of the disintegrated W-Cu aggregates during evolution of CO.It can be concluded that the higher densification was due to the earlier occurred Cu phase spreading that was induced by effective removal of residual oxides by carbon.