• Journal of Welding and Joining
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• 제31권3호
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• pp.22-30
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• 2013

Due to ELV banning, automotive electronics cannot use four kinds of heavy metal element (Pb, Hg, Cd, $Cr^{6+}$) from 2016. Therefore, this study was focused on degradation characteristics of Sn-3.0Ag-0.5Cu Lead-free solder joint with OSP and ENIG finsh under various reliability assessment method, as like to thermal shock test and high temeprature/high humidity test with test duration for cabin electronics. Also, we compared bonding strength degradation to other advanced research results of electronic control unit for engine room because of difference service temperature with mount location in automotive. Whisker growth phenomenon and mitigation method which were essentially consideration items for Pb-free car electronics were examined. Conformal coating is a strong candidate for mitigating whisker growth in automotive electronics. Necessary condition to adapt Pb-free in car electronics was shown.

• 산업경영시스템학회지
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• 제32권4호
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• pp.228-234
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• 2009

신뢰성성장시험은 주어진 기간 동안에 고장모드를 체계적이고 영구적으로 제거하여 신뢰성을 향상시키려는 것이 목적이다. 이러한 활동은 대부분 매우 제약된 시간에 이루어져야 함으로 신제품개발프로그램에 있어서는 가속수명 시험이 필수적인 신뢰성성장시험 도구로 적용된다. 본 연구에서는 가속수명시험 하에서 신뢰성성장을 계획하고 분석하는데 유용한 도구로 사용할 수 있는 가속 신뢰성성장모델을 제시하였다. 시험전략은 test-find-test 전략으로서 시험중 고장모드가 발견되어도 이 문제에 대한 근본적 조치는 시험이 완성된 이후에 이루어지는 경우를 가정하였다. 이는 시험을 중간에 중단하고 시작하는 비용이 매우 높거나, 시스템이 고도로 복잡하여 완전히 분해하는데 어려움이 있는 경우에 적용된다.

• 품질경영학회지
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• 제37권4호
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• pp.16-22
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• 2009

The inflection S-shaped software reliability growth model (SRGM) proposed by Ohba(1984) is one of the most commonly used models and has been discussed by many authors. The main purpose of this paper is to estimate the parameters of Ohba's SRGM within the Bayesian framework by applying the Markov chain Monte Carlo techniques. While the maximum likelihood estimates for these parameters are well known, the Bayesian method for the inflection S-shaped SRGM have not been discussed in the literature. The proposed methods can be quite flexible depending on the choice of prior distributions for the parameters of interests. We also compare the Bayesian methods with the maximum likelihood method numerically based on the real data.

• 수산해양기술연구
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• 제29권2호
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• pp.152-161
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• 1993

This paper deals with the effect of spatial distribution of material properties on its statistical characteristics and numerical estimation method of reliability of fatigue sensitive structures with respect to the fatigue crack growth. A method is proposed to determine experimentally the probability distribution functions of material parameters of Paris law. da/dN=C(ΔK/K sub(0) ) super(m), using stress intensity factor controlled fatigue tests. The result with a high tensile strength steel shows that the distribution of the parameter m is approximately normal and that of 1/C, is a 3-parameter Weibull. The main result obtained are : (1) The theoretical autocorrelation of the resistance, 1/C, to fatigue crack growth are almost same for different lengths. (2) The variance decreases with the increasing a averaging length. When spatial correlation length is very small. the variane decreases significantly were the averaging length. (3) The probability distribution of load cycles or the number for a crack to reach a certain length can be estimated using these functions by simulation of non-Gaussian(expecially Weibull) Stochastic Process.

• 디지털산업정보학회논문지
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• 제10권2호
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• pp.29-36
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• 2014

Finite failure NHPP software reliability models presented in the literature exhibit either constant, monotonic increasing or monotonic decreasing failure occurrence rates per fault. In this paper, proposes the Gompertz distribution reliability model, which made out efficiency application for software reliability. Algorithm to estimate the parameters used to maximum likelihood estimator and bisection method, model selection based on mean square error (MSE) and coefficient of determination$(R^2)$, for the sake of efficient model, was employed. Analysis of failure using real data set for the sake of proposing fixed shape parameter of the Gompertz distribution was employed. This analysis of failure data compared with the Gompertz distribution model of shape parameter. In order to insurance for the reliability of data, Laplace trend test was employed. In this study, the proposed Gompertz model is more efficient in terms of reliability in this area. Thus, Gompertz model can also be used as an alternative model. From this paper, software developers have to consider the growth model by prior knowledge of the software to identify failure modes which can was helped.

• 전자통신동향분석
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• 제14권4호통권58호
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• pp.1-9
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• 1999

In this paper, we summarize the lessons learned from the applications of the software reliability engineering to a large-scale software project. The considered software is the software system of the TDX-10 ISDN switching system. The considered software consists of many components, called functional blocks. These functional blocks serve as the unit of coding and test. The software is continuing to be developed by adding new functional blocks. We are mainly concerned with the analysis of the effects of these software components to software reliability and with the analysis of the reliability evolution. We analyze the static characteristics of the software related to software reliability using failure data collected during system test. We also discussed a pattern which represents a local and global growth of the software reliability as version evolves. To find the pattern of software of the TDX-10 ISDN system, we apply the S-shaped model to a collection of failure data sets of each evolutionary version and the Goel-Okumoto (G-O) model to a grouped overall failure data set. We expect this pattern analysis will be helpful to plan and manage necessary human/resources for a new similar software project which is developed under the same developing circumstances by estimating the total software failures with respect to its size and time.

• 한국정보처리학회논문지
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• 제3권2호
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• pp.231-241
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• 1996

지금까지 많은 소프트웨어 신뢰도 성장 모델들의 제안되어 왔으나 현상을 완전히 고려한 소프트웨어 신뢰도 모델은 아직 개발되어 있지 못한 실정이다. 따라서 다양한 소프트웨어 신뢰도 모델이 계속 개발되어 모든 현상을 고려할 수 있는 모델의 개발이 필요하다고 볼 수 있다. 이와 같은 목적하에 본 논문에서는 발견되는 오류를 오류의 특성에 따라 3종류로 분류하였고, 또한 각 오류의 분류된 오류의 발견 시점 등을 고려 하여 소프트웨어의 신뢰도를 측정할 수 있는 신뢰도 모델을 제안하였다. 그리고모델의 파라메타의 추정 및 신뢰성 평가를 위해실측 데이타를 이용하여 고찰하였으며, 본 논문의 적합성을 검증하기 위해 기존의 모델과 비교 분석 하였다.

• 디지털융복합연구
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• 제7권3호
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• pp.123-135
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• 2009

The considerable progress of IT industry has changed the industrial structure and lifestyle of our society. One of the remarkable fields of IT industry is online game industry. It showed rapid growth for the past decade. But in recent years online game industry faced with the limit of its growth for a number of reasons. To overcome such situation, online game companies should improve functions of game and analyze their customer's needs for sustainable growth through increasing customer satisfaction and loyalty. The purpose of the study is to investigate and evaluate the factors of online game service quality and the relation of customer satisfaction and loyalty. SPSS 14.0 and AMOS 7.0 are used for experimental research. Through reliability and validity test, service quality factors influencing the customer satisfaction are appeared to be 5 latent variables(reliability, responsiveness, assurance, empathy, tangibles). In addition, by structural equation model and covariance structural model, the result showed that empathy is the most influenced factor to customer satisfaction and customer satisfaction has positive effect on customer loyalty. The results of this research have important implications for explaining an mechanism for service quality of online game, customer satisfaction and loyalty and they might provide operational guidelines to the online game service company.

• 대한기계학회논문집A
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• 제23권7호
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• pp.1139-1146
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• 1999

Reliability analysis of structures based on fracture mechanics requires knowledge on statistical characteristics of the parameter C and m in the fatigue crack growth law, $da/dN=C({\Delta}K)^m$. The purpose of the present study is to investigate if it is possible to predict fatigue crack growth rate by only the fluctuation of the parameter C. In this study, Paris-Erdogan law is adopted, where the author treat the parameter C as random and m as constant. The fluctuation of crack growth rate is assumed only due to the parameter C. The growth resistance coefficient of material to fatigue crack growth (Z=1/C) was treated as a spatial stochastic process, which varies randomly on the crack path. The theoretical crack growth rates at various stress intensity factor range are discussed. Constant ${\Delta}K$ fatigue crack growth tests were performed on the structural steel, SM45C. The experimental data were analyzed to determine the autocorrelation function and Weibull distributions of the fatigue crack growth resistance. And also, the effect of the parameter m of Paris' law due to variation of fatigue crack growth resistance was discussed.

• Journal of Welding and Joining
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• 제25권2호
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• pp.82-88
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• 2007

Sn-3.0Ag-0.5Cu lead fee solder was generally utilized in electronics assemblies. But it is insufficient to research about activation energy(Q) that is applying to evaluate the solder joint reliability of environmental friendly electronics assemblies. Therefore this study investigated Q values which are needed to IMC formation and growth of Sn-3.0Ag-0.5Cu/Cu and Sn-40pb/Cu solder joints during aging treatment. We bonded Sn-3.0Ag-0.5Cu and Sn-40Pb solders on FR-4 PCB with Cu pad$(t=80{\mu}m)$. After reflow soldering, to observe the IMC formation and growth of the solder joints, test specimens were aged at 70, 150 and $170^{\circ}C$ for 1, 2, 5, 20, 60, 240, 960, 15840, 28800 and 43200 min, respectively. SEM and EDS were utilized to analysis the IMCS. From these results, we measured the total IMC$(Cu_6Sn_5+Cu_3Sn)$ thickness of Sn-3.0Ag-0.5Cu/Cu and Sn-40Pb/Cu interface, and then obtained Q values for the IMC$(Cu_6Sn_5,\;Cu_3Sn)$ growth of the solder joints.