• The Journal of Korean Institute of Communications and Information Sciences
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• v.31 no.10A
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• pp.943-951
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• 2006

Multi-input-multi-output (MIMO) systems are considered to improve the capacity and reliability of next generation mobile communication. However, the multiple RF chains associated with multiple antennas are costly in terms of size, power and hardware. Antenna selection is a low-cost low-complexity alternative to capture many of the advantages of MIMO systems. We proposed new joint Tx/Rx antenna selection algorithm with low complexity. The proposed algorithm is a method selects $L_R{\times}L_T$ channel matrix out of $L_R{\times}L_T$ entire channel gain matrix where $L_R{\times}L_T$ matrix selects alternate Tx antenna with Rx antenna which have the largest channel gain to maximize Frobenius norm. The feature of this algorithm is very low complexity compare with Exhaustive search which have optimum capacity. In case of $4{\times}4$ antennas selection out of $8{\times}8$ antennas, the capacity decreases $0.5{\sim}2dB$ but the complexity also decreases about 1/10,000 than optimum exhaustive search.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.40-40
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• 2009

The Cu-bearing PFS-700 steel which has yield strength over 700 MPa was developed to replace the existing submarine structural material, HY-100. PFS-700 steel has good combination of mechanical properties and superior weldability which can be welded without pre-heating before welding. Application PFS-700 steel to submarine or battle ship will give a great reduction of cost by removing or lowing pre-heating. To develop pre-heat free welding consumables that matches and take advantage of PFS-700 steel, new welding consumables have been designed for the GMAW, SAW processes and explosion bulge test(EBT) were conducted to see the reliability of welded structure. All welding was conducted without pre-heating before welding, the inter-pass temperatures were below $50^{\circ}C$ for SAW50 and $150^{\circ}C$ for GMAW and SAW150. All EBT specimens show over 14% reduction of thickness without through-thickness crack or propagation of crack to the hole-down area. Tensile properties for all welding conditions show higher(GMAW) or similar values(SAW50, SAW150) to the base metal. Charpy impact values for the weld metal also show 163.5J(GMAW), 95.4J(SAW50) and 69.0J(SAW150), which meet the goal, 50J, of this project.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.36 no.12
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• pp.1563-1568
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• 2012

Printed electronics is a technology used for forming electronic circuits or devices, and it is used in the manufacture of many products such as RFID tags, solar cells, and flexible display panels with a much lower cost than in the case of semiconductor process technology. Web-guide-type printing such as roll-to-roll printing is a method used to produce printed electronic devices in a large volume. To commercialize such products, highly precise alignment between printed layers is required. In this study, a highly precise alignment system is proposed, and some experimental results are compared with those obtained using a laser surface vibrometer to illustrate the reliability of the proposed system. The robustness of the proposed system to web deformation is also considered experimentally.

• Health Policy and Management
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• v.23 no.4
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• pp.434-444
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• 2013

Background: Regional Cardiocerebrovascular Centers (RCC) were established for the prevention and treatment of cardiocerebrovascular disease and funded by the Ministry of Health and Welfare. The purpose of this study was to develop and validate the measurement tool of public benefits in RCC. Methods: Through the intensive literature review, experts surveys and their repetitive feedback, we selected the 46 items about the public benefits in RCC. Development of measurement tool involved content validity test using Content Validity Index (CVI), construct validity test through factor analysis and reliability test. Results: Thirty-five items were selected by content validity test, which CVI was 0.08 or higher. Through the construct validity test, 32 items in 7 factors were derived. And Cronbach's alpha was 0.951. Finally, public benefits measurement tool is composed of 32 items in 7 factors which are comprehensiveness of health care services, market complement, emergency care, cost, governance, quality improvement, and government control. Conclusion: Though we developed the measurement tool of public benefits in RCC, it would be utilized to measure the public benefits of various health agencies.

• Journal of Korea Society of Industrial Information Systems
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• v.23 no.4
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• pp.107-121
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• 2018

This study investigates the effects of the Kano model on the product quality and quality satisfaction on the FDM low cost 3D printer, which is used by consumer and makers. 3D printer product quality is analyzed in terms of functionality, usability, durability, reliability and safety based on the inherent quality of the product itself. This study were tested using Kano analysis to calculate the product detail characteristics and Timko coefficient to calculate the degree of satisfactory effects of the 3D printer. As a result, this study becomes product size, the output speed, durability against external impact as attractive quality and the safety part is regarded as One-dimensional quality. With the exception of surface resolution, the Timko customer satisfaction index was the same as the Kano model.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.4
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• pp.1883-1889
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• 2013

Although Fe-Si based alloy has lower figure of merit than Si-Ge alloy applied for space probe, its low cost related to abundant raw material, rather simple processing, high temperature resistance and reliability up to $800^{\circ}C$ made it one of the most promising middle temperature thermoelectric generation materials. The effect of particle size and additive on the thermoelectric properties of p-$FeSi_2$ prepared by a RF inductive furnace was investigated. The electrical conductivity increased slightly with decreasing particle size and hence better grain-to-grain connectivity due to the increase of density. The Seebeck coefficient exhibited the maximum value at about 600~800K and decreased slightly with increasing particle size. This must be due to the amount of residual metallic phase ${\varepsilon}$-FeSi. $Fe_2O_3$ and/or $Fe_3O_4$-doped specimens showed the higher electrical conductivity and the lower Seebeck coefficient due to increase of the metallic phase and Si-vacancy. On the other hand, $SiO_2$-doped specimen showed the higher electrical conductivity and the higher Seebeck coefficients.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.7
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• pp.28-35
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• 2010

In the display industry, COG bonding method is being applied to production of LCD panels that are used for mobile phones and monitors, and is one of the mounting methods optimized to compete with the trend of ultra small, ultra thin and low cost of display. In COG bonding process, electrical characteristics such as contact resistance, insulation property, etc and mechanical characteristics such as bonding strength, etc depend on properties of conductive particles and epoxy resin along with ACF materials used for COG by manufacturers. As the properties of such materials have close relation to optimization of bonding conditions such as temperature, pressure, time, etc in COG bonding process, it is requested to carry out an in-depth study on characteristics of COG bonding, based on which development of bonding process equipment shall be processed. In this study were analyzed the characteristics of COG bonding process, performed the analysis and reliability evaluation on electrical and mechanical characteristics of COG bonding using ACF to find optimum bonding conditions for ACF, and performed the experiment on bonding characteristics regarding fine pitch to understand the affection on finer pitch in COG bonding. It was found that it is difficult to find optimum conditions because it is more difficult to perform alignment as the pitch becomes finer, but only if alignment has been made, it becomes similar to optimum conditions in general COG bonding regardless of pitch intervals.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.377-377
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• 2011

Organic solar cells (OSCs) with low cost have been studied to apply on flexible substrate by solution process in low temperature [1]. In previous researches, conventional organic solar cell was composed of metal oxide anode, buffer layer such as PEDOT:PSS, photoactive layer, and metal cathode with low work function. In this structure, indium tin oxide (ITO) and Al was generally used as metal oxide anode and metal cathode, respectively. However, they showed poor reliability, because PEDOT:PSS was sensitive to moisture and air, and the low work function metal cathode was easily oxidized to air, resulting in decreased efficiency in half per day [2]. Inverted organic solar cells (IOSCs) using high work function metal and buffer layer replacing the PEDOT:PSS have focused as a solution in conventional organic solar cell. On the contrary to conventional OSCs, ZnO and TiO2 are required to be used as a buffer layer, since the ITO in IOSC is used as cathode to collect electrons and block holes. The ZnO is expected to be excellent electron transport layer (ETL), because the ZnO has the advantages of high electron mobility, stability in air, easy fabrication at room temperature, and UV absorption. In this study, the IOSCs based on poly [N-900-hepta-decanyl-2,7-carbazole-alt-5,5-(40,70-di-2-thienyl-20,10,30-benzothiadiazole)] (PCDTBT) : [6,6]-phenyl C71 butyric acid methyl ester (PC70BM) were fabricated with the ZnO electron-transport layer and MoO3 hole-transport layer. Thickness of the ZnO for electron-transport layer was controlled by rotation speed in spin-coating. The PCDTBT and PC70BM were mixed with a ratio of 1:2 as an active layer. As a result, the highest efficiency of 2.53% was achieved.

• Korean Journal of Community Nutrition
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• v.16 no.3
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• pp.386-397
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• 2011

This study was to investigate the housewives' purchase behaviors on the environment-friendly agricultural products (EFAP) by survey in Daejeon area housewives. 390 questionnaires were used and analysed. Most of the subjects were female (92.6%) distributed evenly in their 40's (55.4%), and graduated from high school (43.6%) or college (36.4%). Subjects' occupation was most housewives (64.1%) and 77.4% of the subjects had monthly family income of 2 million won or more. 76.9% of the subjects had purchased EFAP already. The reason of purchasing EFAP was mainly "good for health" (80.3%), and reason for non-purchasing was "high prices" (28%) or "not so trustworthy" (25.6%). The most purchasing frequency was "once a week" (29%). 46.7% of the subjects spent 20% of their agricultural product cost for EFAP and 38.7% of them spent less than 30,000 won per month for EFAP. On checking of EFAP labeling, the housewives scored 3.59 for the validate date, 3.25 for the place of origin, 2.8 for the quality certification mark by 4-point Likert scale. 65.1% of the subject had intention to increase purchasing of EFAP in future. To promote the consumption of EFAP, the improvement factors were price-cutting (47.9%), trust on producers (18.2%) and quality betterment (17.7%). Accordingly, the consumers prefer EFAP for wellbeing health of families; however, they hesitate to buy due to their high price and the low reliability on producers of EFAP. Thus the producers and the related organization of EFAP should contrive proper countermeasures to increase consumer's satisfaction level on their credibility and price of EFAP.

• Journal of Sensor Science and Technology
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• v.15 no.1
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• pp.58-64
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• 2006

In this study, we describe a low-temperature wafer-level thermocompression bonding using electroplated gold seal line and bonding pads by electroplating method for RF-MEMS devices. Silicon wafers, electroplated with gold (Au), were completely bonded at $320^{\circ}C$ for 30 min at a pressure of 2.5 MPa. The through-hole interconnection between the packaged devices and external terminal did not need metal filling process and was made by gold films deposited on the sidewall of the throughhole. This process was low-cost and short in duration. Helium leak rate, which is measured to evaluate the reliability of bonded wafers, was $2.7{\pm}0.614{\times}10^{-10}Pam^{3}/s$. The insertion loss of the CPW packaged was $-0.069{\sim}-0.085\;dB$. The difference of the insertion loss between the unpackaged and packaged CPW was less than -0.03. These values show very good RF characteristics of the packaging. Therefore, gold thermocompression bonding can be applied to high quality hermetic wafer level packaging of RF-MEMS devices.