• 제목/요약/키워드: Reflow Process

검색결과 173건 처리시간 0.031초

플립칩용 웨이퍼레벨 Fine Pitch 솔더범프 형성 (Fabrication of Wafer Level Fine Pitch Solder Bump for Flip Chip Application)

  • 주철원;김성진;백규하;이희태;한병성;박성수;강영일
    • 한국전기전자재료학회논문지
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    • 제14권11호
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    • pp.874-878
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    • 2001
  • Solder bump was electroplated on wafer for flip chip application. The process is as follows. Ti/Cu were sputtered and thick PR was formed by several coating PR layer. Fine pitch vias were opened using via mask and then Cu stud and solder bump were electroplated. Finally solder bump was formed by reflow process. In this paper, we opened 40㎛ vias on 57㎛ thick PR layer and electroplated solder bump with 70㎛ height and 40㎛ diameter. After reflow process, we could form solder bump with 53㎛ height and 43㎛ diameter. In plating process, we improved the plating uniformity within 3% by using ring contact instead of conventional multi-point contact.

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LIGA-reflow Micro-lens Pattern 적용 도광판의 미세사출성형

  • 황철진;허영무;하수용;이규현
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2004년도 춘계학술대회 논문요약집
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    • pp.134-134
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    • 2004
  • LCD-BLU의 고효율 광특성을 유도하기 위한 도광판의 초미세패턴 형상가공기술, 미세사출성형기술과 미세형상패턴 광학해석기술 및 전광특성 측정 및 보완기술이 요구된다. 이러한 기술들을 바탕으로 LCD-BLU의 고단가의 주요요인인 기능성 광학 sheet(prism sheet 등)를 연차적으로 제거 및 도광판에 기능을 결합하는 기술개발이 본 연구의 목적이다.(중략)

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솔벤트 증기처리 Reflow를 이용한 폴리머 마이크로 렌즈 제작 및 특성고찰 (Fabrication and Characterization of Polymer Microlens using Solvent-vapor-assisted Reflow)

  • 양승우;김신형;김보현;조영학
    • 한국정밀공학회지
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    • 제32권3호
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    • pp.299-305
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    • 2015
  • In this paper, we propose a simple and low-cost fabrication method of polymer microlens using solvent-vapor-assisted reflow (SVAR). Metal molds for replication of polymer were fabricated using micro milling and the cylindrical shape of polymer was imprinted using hot-embossing process. The cylindrical shape of polymer was changed to hemispherical lens shape by SVAR. The characteristics of fabricated microlens were evaluated according to the condition of SVAR such as temperature and time. The focal length of polymer microlens could be controlled more easily in low-temperature and long-time condition than in high-temperature and short-time condition. That is, the level of concentrated light to focal point could be improved through the control of temperature and time. Also, we confirmed that toluene was more appropriate solvent than acetone in fabrication of PMMA polymer microlens using SVAR.

Design and Fabrication of Multi-Focusing Microlens Array with Different Numerical Apertures by using Thermal Reflow Method

  • Park, Min-Kyu;Lee, Ho Jun;Park, Ji-Sub;Kim, Mugeon;Bae, Jeong Min;Mahmud, Imtiaz;Kim, Hak-Rin
    • Journal of the Optical Society of Korea
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    • 제18권1호
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    • pp.71-77
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    • 2014
  • We present design and fabrication of a multi-focusing microlens array (MLA) using a thermal reflow method. To obtain multi-focusing properties with different numerical apertures at the elemental lens of the MLA, double-cylinder photoresist (PR) structures with different diameters were made within the guiding pattern with both photolithographic and partial developing processes. Due to the base PR layer supporting the thermal reflow process and the guiding structure, the thermally reflowed PR structure had different radii of curvatures with lens shapes that could be precisely modeled by the initial volume of the double-cylinder PR structures. Using the PR template, the hexagonally packed multi-focusing MLA was made via the replica molding method, which showed four different focal lengths of 0.9 mm, 1.1 mm, 1.6 mm, and 2.5 mm, and four different numerical apertures of 0.1799, 0.2783, 0.3973, and 0.4775.

패키지 박리 개선을 위한 플라즈마 세정 효과 (Plasma Cleaning Effect for Improvement of Package Delamination)

  • 구경완;김도우;왕진석
    • 대한전기학회논문지:전기물성ㆍ응용부문C
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    • 제54권7호
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    • pp.315-318
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    • 2005
  • The effect of plasma cleaning was examined on package delamination phenomena in the integrated circuit (IC) packaging process. Without plasma cleaning, delamination was observed for all three experimental treatments applied after the packaging step, which include bake of If, reflow, and bake of If followed by reflow However, no delamination was observed when the plasma cleaning was performed before and after the wire bonding step. Plasma cleaning was found to be a critical step to improve the reliability of the package by reducing the possibility of contact failure between die pad and bonding wire.

Thermal Reflow법에 의한 마이크로렌즈의 제작 및 그 특성 (Fabrication and Characteristics of Microlens using Thermal Reflow Method)

  • 박광범;김인회;정석원;김건년;문현찬;박효덕;신상모
    • 한국광학회:학술대회논문집
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    • 한국광학회 2000년도 제11회 정기총회 및 00년 동계학술발표회 논문집
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    • pp.192-193
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    • 2000
  • We studied the characteristics and fabricated the plano-convex refractive microlenses using the thermal reflow method. The exposed resist was resolved in a standard developing process. The remaining resist of circle pattern was melted in an oven 12$0^{\circ}C$ to 15$0^{\circ}C$. The shape of the melted resist microlenses is ruled by surface tension. Diameter and hight of the fabricated microlenses were 250${\mu}{\textrm}{m}$ to 325${\mu}{\textrm}{m}$ and 15${\mu}{\textrm}{m}$ to 22${\mu}{\textrm}{m}$, respectively. The surface profile was calculated using data curve-fitting method with circle equation. The optical characteristics was analysed using optical simulation program.

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In-situ 공정에 의한 복합솔더 제조 (Manufacturing of Composite Solders by an In-situ Process)

  • 황성용;이주원;이진형
    • 한국주조공학회지
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    • 제22권1호
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    • pp.35-41
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    • 2002
  • To improve the reliability of solder joints, a composite solder which consists of solder matrix and intermetallic reinforcements was manufactured by a new method. The cast ingot of Sn-6.9Cu-2.9Ag alloy had primary Cu6Sn5 intermetallics in the form of dendrites. After rolling the ingot, the intermetallic dendrites were crushed into fine particles and distributed uniformly throughout the solder matrix. As the rolled strips became thinner, the average size of the crushed particles reached a critical size which did not decrease any more by further rolling. The critical size was nearly the same as the average width of intermetallic dendrite trunk. The crushed intermetallic particles did not melt and remained in solid state during reflow soldering due to their high meltingterm-perature. The coarsening and gravitational segregation of the particles were observed during reflow soldering.

Constructing a Three-Dimensional Endothelial Cell Layer in a Circular PDMS Microchannel

  • Choi, Jong Seob;Piao, Yunxian;Kim, Kyung Hoon;Seo, Tae Seok
    • 한국진공학회:학술대회논문집
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    • 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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    • pp.274.2-274.2
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    • 2013
  • We described a simple and efficient fabrication method for generating microfluidic channels with a circular-cross sectional geometry by exploiting the reflow phenomenon of a thick positive photoresist. Initial rectangular shaped positive photoresist micropatterns on a silicon wafer, which were fabricated by a conventional photolithography process, were converted into a half-circular shape by tuning the temperature to around $105^{\circ}C$. Through optimization of the reflow conditions, we could obtain a perfect circular micropattern of the positive photoresist, and control the diameter in a range from 100 to 400 ${\mu}m$. The resultant convex half-circular photoresist was used as a template for fabricating a concave polydimethylsiloxane (PDMS) through a replica molding process, and a circular PDMS microchannel was produced by bonding two half-circular PDMS layers. A variety of channel dimensions and patterns can be easily prepared, including straight, S-curve, X-, Y-, and T-shapes to mimic an in vivo vascular network. To inform an endothelial cell layer, we cultured primary human umbilical vein endothelial cells (HUVECs) inside circular PDMS microchannels, and demonstrated successful cell adhesion, proliferation, and alignment along the channel.

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$50{\mu}m$ Microlens 패턴 금형의 미세사출성형 전사성과 전광특성 기초연구 (A Basic Study of replication and brightness for micro injection molding with ${\sim}50{\mu}m$ micro-lens pattern mold)

  • 황철진;고영배;허영무
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2004년도 추계학술대회논문집
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    • pp.280-283
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    • 2004
  • Micro-lens patterned micro-mold fabrication method for Light Guiding Plate(LGP), kernel part of LCD-BLU(Back Light Unit), was presented. Instead of erosion dot pattern for LGP optical design, micro-lens pattern, fabricated by LIGA-reflow process, was applied. Optical pattern design method was also developed not only for negative pattern LGP, but also positive pattern LGP. During injection molding process, experimental study was conducted to improve replication quality and brightness of ${\sim}50um$ micro-lens pattern mold. The effect of mold temperature for the replication quality of micro-lens array was studied.

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가열용융 방법에 의한 Ge-BPSG 마이크로렌즈 어레이 제작 (Ge-doped Boro-Phospho-Silicate Glass Micro-lens Array Produced by Thermal Reflow)

  • 정진호;오진경;최준석;최기선;이형종;배병성
    • 한국광학회지
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    • 제16권4호
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    • pp.340-344
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    • 2005
  • 화염가수분해 증착법(FHD : Flame Hydrolysis Deposition)으로 제작된 Ge이 첨가된 BPSG(Boro-Phospho-Silicate-Glass)막의 표면을 절단톱(dicing saw)을 이용하여 일정한 깊이로 절단함으로써 각 단위 마이크로렌즈 셀들을 형성시켰다. 또한 절단된 각 단위 마이크로렌즈 셀들을 가열용융(thermal reflow) 방법을 이용하여 $1200^{\circ}C$에서 가열용응시킴으로써 직경이 $53.4{\mu}m$인 마이크로렌즈 어레이를 제작할수 있었다. 이 때 렌즈간 간격은 $70{\mu}m,$ 렌즈 두께는 약 $28.4{\mu}m$이었다. 제작된 마이크로렌즈 어레이의 형상을 이미지-프로세스로 분석하였으며. 초점거리는 $62.2{\mu}m$이었다. 본 제작방법은 일반적인 사진식각 공정을 이용한 마이크로렌즈 제작보다 간단하면서도 저렴한 비용으로 제작이 가능하다. 또한 곡률반경의 조절이 용이하고, 보다 정밀하며 다양한 마이크로렌즈 어레이를 구현할 수 있다.