• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Archives of Reconstructive Microsurgery
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• 제3권1호
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• pp.40-44
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• 1994

Microsurgery has advanced beyond its nascent stages reaching success rates of 90% to 95%. However, this means that even in the best circumstances, 5% to 10% of free flaps and replants fail. Almost all failures are due to vessel thrombosis, resulting in ischemia of the transplanted tissue. Many attemps have been undertaken to treat and reverse its effects. Zdeblick and colleagues noted an improvement in the viability of amputated limbs replanted after an extended period of ischemia following intraarterial infusion of urokinase. Subsequent studies have investigated many modalities of urokinase administration in various animal models by differing ischemic periods. These studies, however, have failed to establish a definitive, generally accepted protocol for administration of urokinase in the salvage of tissue subjected to prolonged ischemia. Our clinical observations suggest that a bolus of urokinase delivered under pressure may increase the thromoblytic effect of the drug, probably by means of increased delivery to microvasculature. We intend to investigate the role of selective pressure perfusion of ischemic flaps as a new means for increasing the effectiveness of urokinase in the treatment of the "no-reflow" phenomenon. A total of 32 male New Zealand rabbits were used and divided into the four groups according to the method of infusion. After 12 hours of ischemia the flaps were injected with Hartmann's solution or with urokinase and the percent survival of the flap was determined at 7 days following flap reperfusion. As the result, the flap survival rate was highest in the pressure injection of urokinase group.

• 대한수의학회지
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• 제37권1호
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• pp.111-117
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• 1997

This study was carried out determine the effect of renal ischemia on amino acid transport in rabbit renal cortical slices. The animal models of renal ischemia induced experimentally by clamping the renal artery. These results were summarized as follows: 1. The uptake of amino acids lysine and ${\alpha}$-aminobutyrate(AIB), dicarboxylate succinate and organic anion PAH in cortical slices was normal or increased after 30 or 60 min of ischemia in vivo. 2. In a 30 min ischemic kidney, the slice uptake of amino acids was returned to the control level by 30 min of reflow. In a 60 or 90 min ischemic kidney, the lysine uptake was returned to the control level after of reflow, but the uptake of AIB and succinate was significantly reduced during reflow period of 30-120 min. 3. Oxygen consumption in cortical slices was increased after 30 min of ischemia but was not altered by 60 min of ischemia. This results indicat that transient ischemia caused increasing of amino acid uptake in renal cortical slices without metabolic disorder of renal proximal tubule.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.274.2-274.2
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• 2013

We described a simple and efficient fabrication method for generating microfluidic channels with a circular-cross sectional geometry by exploiting the reflow phenomenon of a thick positive photoresist. Initial rectangular shaped positive photoresist micropatterns on a silicon wafer, which were fabricated by a conventional photolithography process, were converted into a half-circular shape by tuning the temperature to around $105^{\circ}C$. Through optimization of the reflow conditions, we could obtain a perfect circular micropattern of the positive photoresist, and control the diameter in a range from 100 to 400 ${\mu}m$. The resultant convex half-circular photoresist was used as a template for fabricating a concave polydimethylsiloxane (PDMS) through a replica molding process, and a circular PDMS microchannel was produced by bonding two half-circular PDMS layers. A variety of channel dimensions and patterns can be easily prepared, including straight, S-curve, X-, Y-, and T-shapes to mimic an in vivo vascular network. To inform an endothelial cell layer, we cultured primary human umbilical vein endothelial cells (HUVECs) inside circular PDMS microchannels, and demonstrated successful cell adhesion, proliferation, and alignment along the channel.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 춘계학술대회 논문집
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• pp.269-272
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• 2008

LGP is a key component of LCD back light unit because it determines the brightness and sharpness of display image. Usually, it has optical patterns fabricated on the bottom surface. In the present paper the LiGA-reflow method was applied to fabricate the LGP mold. Furthermore, the optical simulation considering the replication ratio of pattern height was applied to the pattern design. The optical simulation through systematic correction scheme helped find the optimum distribution of pattern density. Finally, the stamper fabricated by this method was installed in the mold and LGP was produced by injection molding. As a result of luminance measurement for the final product, the average luminance and luminance uniformity was measured 3,180 nit and 84%, respectively. Consequently, the mold fabrication method using the LiGA-reflow and optical simulation(CAE) can save the expense and time compared with the existing fabrication methods(laser ablation and chemical etching).

• 한국표면공학회지
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• 제33권5호
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• pp.373-380
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• 2000

The flow melting behavior of the electrolytic tinplate during reflow treatment was investigated in terms of morphology and structure of coating layers which were electrodeposited with variation of electrolyte temperature. It was commonly found that the nucleation density of the electrodeposits showed little difference with the electrolyte temperature, and the growth of electrodeposited tin occurred along <100> direction of (002) plane. At low electrolyte temperature, the (002) plane of tin nucleated paralleling to the substrate and grew perpendicularly to the substrate, which rendered porous rod-like deposits. With increasing the temperature, the (002) plane nucleated declining $15^{\circ}$ to the substrate and also grew to the normal <100> direction, which enabled lateral growth of the tin crystals and rendered compact deposits. During reflow treatment, the matte deposit transformed to the reflowed state via transition regions consisted of contraction, island formation, and wetting . The matte deposits formed at low temperature exhibited wide transition regions because of poor thermal transfer between crystals due to their porous nature. While that formed at high temperature transformed very rapidly to the reflowed state by enhanced thermal transfer between the compact crystals.

• 한국초전도ㆍ저온공학회논문지
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• 제12권2호
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• pp.9-12
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• 2010

A lamination system using reflow soldering was developed to enhance the mechanical properties of high temperature superconductor (HTS) tape. The laminated coated conductor tape was fabricated using the continuous lamination process. The mean, maximum, and minimum tensile loads in a T-peel test of the laminated coated conductor were 9.9 N, 12.5 N, and 7.6 N, respectively. The critical current ($I_c$) distributions of the non-laminated and laminated coated conductor were compared using anon-contact Hall probe method. The transport $I_c$ nearly matched the non-contact $I_c$; however, some degraded Ic regions were found on the length of 800 cm of laminated coated conductor. We confirmed that the cause of the partially degraded $I_c$ was due to an increase in line tension by (1) solidification induced by a change of composition that usually occurs in molten brass (Cu, Zn) in solder, or (2) non-homogeneity of the thickness of the coated conductor or metal tapes. We suggest that reflow soldering is a promising method for reinforced HTS tape if the controlling solder thickness and lamination guide are modified.

• 마이크로전자및패키징학회지
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• 제8권1호
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• pp.33-38
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• 2001

5인치 실리콘 기판위에 수 회 코팅기술을 이용하여 두꺼운 감광막을 얻은 후, 전기도금 법으로 솔더범프를 형성하고, 비아크기의 변화에 따른 리플로 전과, 후의 솔더범프 형성에 미치는 영향을 조사하였다. 리플로 전의 범프바닥 (bump bottom) 직경은 리플로 후에도 거의 변화가 없는 반면, 솔더범프 모양은 패턴된 비아직경 크기에 크게 의존했다. 비아직경이 클수록 높은 도금효율을 보였다. 비아직경이 작을수록 리플로 후의 범프는 리플로 전의 범프높이와 비교하여 크게 낮아졌지만, aspect ratio는 크다는 것을 알았다. 고밀도와 고aspect ratio를 갖는 범프를 얻기 위하여 비아직경과 범프피치를 줄여야하지만, 과도금 (overplating), 또는 리플로를 할 때 최인접 간 범프끼리 맞닿을 수 있기 때문에 최인접 간 범프거리 확보는 중요하다. 비아높이(film두께)를 높게 하여 과도금을 하지 않고 비아높이가지만 도금하여 과도금으로 인한 최인접 범프끼리의 맞닿음을 없애는 방법과 범프배열을 zig-zag로 하는 방법을 혼용하면 과도금, 또는 리플로를 할 때 최인접 범프 간에 맞닿는 문제는 어느 정도 해결할 수 있다.

• 마이크로전자및패키징학회지
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• 제29권3호
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• pp.55-61
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• 2022

본 연구에서는 용융온도가 중온계 무연 솔더인 Sn-3.0Ag-0.5Cu(SAC305)와 저온계 무연 솔더인 Sn-57Bi-1Ag를 사용하여 형성된 복합 무연 솔더 접합부의 특성에 대하여 보고 하였다. SAC305 솔더볼이 형성된 ball grid array(BGA) 패키지와 Sn-57Bi-1Ag 솔더 페이스트가 도포된 flame retardant-4(FR-4) 인쇄회로기판(printed circuit board, PCB)을 리플로우 솔더링 공정을 이용하여 복합 무연 솔더 접합부를 형성 하였다. 공정 온도 프로파일을 두 가지 형태로 달리하여 리플로우 솔더링 공정을 진행하였으며 리플로우 솔더링 공정 조건에 따른 계면 반응, 금속간화합물(intermetallic compound, IMC)의 형성, Bi의 확산 거동 등 복합 무연 솔더 접합부 계면 특성을 비교 분석 하였다. 또한, 열 충격 시험을 통하여 리플로우 솔더링 공정에 따른 복합 무연 솔더 접합부의 신뢰성 특성을 비교하고 열 충격 시험 전후 전단 시험을 진행하여 접합부의 기계적 특성 변화를 분석하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2002년도 춘계학술발표회 초록집
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• pp.14-14
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• 2002