• 한국재료학회지
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• 제26권4호
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Design & Manufacturing
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• 제2권2호
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• pp.20-24
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• 2008

Recently, the study for production technology is focused on cycle time reduction as various products are manufactured. In order to manufacture tool and die, rapid prototyping and rapid tooling are researched. Stereolithography apparatus, selective laser sintering, 3D printing, laminated object manufacturing are developed in rapid prototype. The purpose of this study is to develop rapid tooling technology using thermal spray process. This technology is not well-known to korea, but this study will be contributed in development of domestic molds industry through continuous research and development.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2015년도 제49회 하계 정기학술대회 초록집
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• pp.195-195
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• 2015

반도체 제조 시 ohmic contact을 형성하고, barrier metal layer형성을 위해 NH3 기체를 사용하는 rapid thermal nitridation (RTN)은 반도체 공정에 있어 매우 중요한 핵심 기술이다. 그러나 공정 진행 시 발생하는 공정 부산물에 의한 chamber오염으로 인해 매우 정확히 입사 되어야 할 thermal energy의 controllability가 저하되고 있어, 미세 공정능력 구현의 한계에 부닥치고 있다. 본 연구에서는 quartz plate liner를 적용하여 RTN 공정에서 발생하는 공정 부산물인 ammonium chloride (NH4Cl)의 chamber 표면 증착을 최소화하였고, 공정 진행 온도의 controllability를 확보하였다.

• 한국기계가공학회지
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• 제19권7호
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• pp.60-66
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• 2020

In order to improve fatigue life of transmission gear carburizing is normally used. Carburizing is a very good process to achieve low cost and high performance. The machined gears are heated up to carburizing temperature and then cooled rapidly in an oil bath to produce high surface hardness. The gears may undergo excessive thermal distortion during heating and rapid cooling. In order to predict the distortion during heating and rapid cooling, a coupled thermo-mechanical simulation is needed. In the current research, the simulation of heating and cooling was performed. The results show that the thermal distortion and the residual stresses are well predicted by the coupled simulation. In addition, induction heating and rapid cooling simulation is carried out to predict the thermal distortion. The amount of distortion is compared. It is shown that induction heating is very effective to reduce thermal distortion.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2005년도 하계학술대회 논문집 Vol.6
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• pp.466-467
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• 2005

Al doped zinc oxide films (ZnO:Al) were deposited on glass substrate by RF magnetron sputtering from a ZnO target mixed with 2 wt% $Al_2O_3$. The as-deposited ZnO:Al films were rapid-thermal annealed. Electrical properties and structural evolution of the films, as annealed by rapid thermal process (RTP), were studied and compared with the films annealed by conventional annealing process. RTP, the (002) peak intensity increases and the electrical resistivity decreases by 20%, after RT annealing. The effects of RT annealing on the structural evolution and electrical properties of RF sputtered films were further discussed and compared also with the films deposited by DC magnetron sputtering.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1424-1425
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• 2006

A four-step rapid thermal annealing (RTA) process is proposed in order to improve the throughput and stabilize the process, compared to the six-step RTA process. Effects of annealing on the properties of a structure mode of CMOS process in both cases were investigated. The implanted dopant(As, $BF_2$ and Ti/TiN) movement in silicon during different rapid thermal annealing conditions was studied using secondary ion mass spectroscopy (SIMS) technique. These results show that the four-step RTA process significantly improves time effect and throughput (15%) by the condition of ramping up compared to the six-step RTA process.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1994년도 추계학술대회 논문집 학회본부
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• pp.246-248
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• 1994

The Electrical properties of thin $SiO_2$ film by rapid thermal processing have been investigated and this film has been compared with thermal $SiO_2$ film by furnace. The RTO(rapid thermal oxide) film annealed in Ar ambient represent more superior properties than thermal $SiO_2$ film by furnace at breakdown field and leakage current. The RTO(rapid thermal oxide) film annealed in $NH_3$ ambient represent more inferior properties than thermal $SiO_2$ film by furnace at electrical properties, but the capacitance was improved 15-25% than the conventional oxide film.

• E2M - 전기 전자와 첨단 소재
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• 제8권6호
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• pp.737-743
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• 1995

Two step RTD(Rapid Thermal Diffussion) of P into silicon wafer using tungsten halogen lamp was used to fabricated very shallow n$^{+}$p junction. 1st RTD was performed in the temperature range of 800.deg. C for 60 see and the heating rate was in the 50.deg. C/sec. Phosphrous solid source was transfered on the silicon surface. 2nd RTD process was performed in the temperature range 1050.deg. C, 10sec. Using 2 step RTD we can obtain a shallow junction 0.13.mu.m in depth. After RTD, the Ti-silicide process was performed by the two step RTA(Rapid Thermal Annealing) to reduced the electric resistance and to improve the n$^{+}$p junction diode. The titanium thickness was 300.angs.. The condition of lst RTA process was 600.deg. C of 30sec and that of 2nd RTA process was varied in the range 700.deg. C, 750.deg. C, 800.deg. C for 10sec-60sec. After 2 step RTA, sheet resistance was 46.ohm../[]. Ti-silicide n+p junction diode was fabricated and I-V characteristics were measured.red.

• 대한전기학회논문지:시스템및제어부문D
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• 제49권2호
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• pp.62-67
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• 2000

The uniformity of temperature on a wafer is one of the most important parameters to control the RTP (Rapid Thermal Process) with proper input signals. Since it is impossible to achieve the uniformity of temperature without exact estimation of temperature at all points on the wafer, the difficulty of understanding internal dynamics and structural complexities of the RTP is a primary obstacle to accurately measure the distributed temperatures on the wafer. Furthermore, it is also hard to accomplish desirable estimation because only few pyrometers have been commonly available in the general equipments. In the paper, a thermal model based on the chamber geometry of the AST SHS200 RTP system is developed to effectively control the thermal uniformity on the wafer. First of all, the estimation method of one-point measurement is developed, which is properly extended to the case of multi-point measurements. This thermal model is validated through certain simulation and experiments. The work can be usefully contributed to building a run-by-run or a real-time controls of the RTP.

• 전자통신동향분석
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• 제13권3호통권51호
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• pp.71-83
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• 1998

반도체 제조용 웨이퍼의 온도를 측정하고 제어하는 기술의 진보로 열처리 장비 시장에서 점점 더 각광을 받고 있는 급속 열처리(rapid thermal process: RTP) 장치의 최근 기술 동향을 전반적으로 조사 분석하였다. RTP의 장점, 온도 제어 모델링 기술(model-based control), 최근에 개발된 여러 종류의 RTP 시스템 설계 및 이들 각각의 기술적인 문제들이 기술된다. 새롭게 개발된 단일 wafer furnace와 광자 효과를 이용한 rapid photothermal process (RPP)에 관해서도 기술하였다. 아울러 최근 열처리 장비 업체들의 현황과 열처리 장비 시장의 향후 전망에 관해서도 검토하였다.