• 제목/요약/키워드: Rapid Solidification Process

검색결과 79건 처리시간 0.027초

분무 주조 과공정 Al-Si계 합금의 응력이완 및 Creep 천이 거동 (Load Relaxation and Creep Transition Behavior of a Spray Cast Hypereutectic Al-Si Based Alloy)

  • 김민수;방원규;박우진;장영원
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2005년도 춘계학술대회 논문집
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    • pp.176-179
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    • 2005
  • Spray casting of hypereutectic Al-Si based alloy has been reported to provide distinct advantages over ingot metallurgy (IM) or rapid solidification/powder metallurgy (RS/PM) process in terms of microstructure refinement. Hypereutectic Al-Si based alloys have been regarded attractive for automotive and aerospace application, due to high specific strength, good wear resistance, low coefficient of thermal expansion, high thermal stability, and good creep resistance. In this study, hypereutectic Al-25Si-2.0Cu-1.0Mg alloy was prepared by OSPREY spray casting process. High temperature deformation behavior of the hypereutectic Al-Si based alloy has been investigated by applying the internal variable theory proposed by Chang et al. The change of strain rate sensitivity and Creep transition were analyzed by using the load relaxation test and constant creep test.

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Al합금 펄스 Nd:YAG 레이저 점 용접부의 균열 발생기구 (Mechanism of Crack Formation in Pulse Nd:YAG Laser Spot Welding of Al Alloys)

  • 하용수;조창현;강정윤;김종도;박화순
    • Journal of Welding and Joining
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    • 제18권2호
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    • pp.86-94
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    • 2000
  • This study was performed to investigate types and formation mechanism of cracks in two Al alloy welds, A5083 and A7N01 spot-welded by pulse Nd : YAG laser, using SEM, EPMA and Micro-XRD. In the weld zone, three types of crack were observed : center line crack({TEX}$C_{C}${/TEX}), diagonal crack({TEX}$C_{D}${/TEX}), and U shape crack({TEX}$C_{U}${/TEX}). Also, HAZ crack({TEX}$C_{H}${/TEX}) was observed in the HAZ region, furthermore, mixing crack({TEX}$C_{M}${/TEX}) consisting of diagonal crack and HAZ crack was observed. White film was formed at th hot crack region in the fractured surface after it was immersed to 10% NaOH water. In the case of A5083 alloy, white films in {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack region were composed of low melting phases, {TEX}$Fe_{2}SiAl_{8}${/TEX} and eutectic phases, $Mg_2$Al$_3$ and $Mg_2$Si. Such films observed $CuAl_2$, {TEX}$Mg_{32}(Al,Zn)_{3}${/TEX}, MgZn$_2$, $Al_2$CuMg and $Mg_2$Si were observed in the whitely etched films near {TEX}$C_{C}${/TEX} crack and {TEX}$C_{D}${/TEX} crack regions. The formation of liquid films was due to the segregation of Mg, Si, Fe in the case of A5083 alloy and Zn, Mg, Cu, Sim in the case of A7N01 alloy, respectively. The {TEX}$C_{C}${/TEX} and {TEX}$C_{D}${/TEX} cracks were regarded as a result of the occurrence of tensile strain during the welding process. The formation of {TEX}$C_{M}${/TEX} crack is likely to be due to the presence of liquid film at the grain boundary near the fusion line in the base metal as well as in the weld fusion zone during solidification. The {TEX}$C_{U}${/TEX} crack is considered a result of the collapsed keyhole through incomplete closure during rapid solidification.

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발포 폴리스티렌 폼을 이용한 가변 적층 쾌속 조형 공정 밀 장치 개발 (Development of Variable Lamination Manufacturing(VLM) Process and Apparatus by Using Expandable Polystyrene Foam)

  • 안동규;이상호;양동열;신보성;박승교;이용일
    • 한국정밀공학회지
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    • 제18권8호
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    • pp.54-63
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    • 2001
  • Rapid Prototyping(RP) techniques have their unique characteristics according to the working principles: stair-stepped surface of a part due to layer-by-layer stacking, low build speed caused by point-by-point or line-by-line solidification to build one layer, and additional posts processing to improve surface roughness, so high cost is required to introduce and to maintain the RP apparatus. The objective of this study is to develop a new RP process, Variable Lamination Manufacturing by using expandable polystyrene foam sheet as part material(VLM-S), and to design an apparatus for implementation of the process. So, the process parameters and design criterions of the apparatus were defined and the techniques were proposed to satisfy the design criterion. Based on the results, a knob-shape, pyramid shape. and a solid block were fabricated on the apparatus in which unit shape part(USP) was generated for building each layer.

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SLM 방식으로 적층 제조된 Ti-6Al-4V 합금의 HIP 처리에 따른 준정적 및 동적 기계적 특성 변화 (Influence of Hot Isostatic Press on Quasi-static and Dynamic Mechanical Properties of SLM-printed Ti-6Al-4V Alloy)

  • 장지훈;최영신;김형균;이동근
    • 열처리공학회지
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    • 제33권3호
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    • pp.99-106
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    • 2020
  • Selective laser melting (SLM) is an additive manufacturing process by melting metallic powders and stacking into layers, and can product complex shapes or near-net-shape (NNS) that are difficult to product by conventional processes. Also, SLM process is able to raise the efficiency of production by creating a streamlined manufacturing process. For manufacturing in SLM process using Ti-6Al-4V powder, analysis of microstructural evolution and evaluation of mechanical properties are essential because of rapid melting and solidification process of powders according to high laser power and rapid scan speed. In addition, it requires a post-processing because the soundness and mechanical properties are degraded by defects such as pore, un-melted powder, lack-of-fusion, etc. In this study, hot isostatic press (HIP) was conducted as a post-processing on SLM-printed Ti-6Al-4V alloy. Microstructure of post-processed Ti-6Al-4V alloy was compared to as-built Ti-6Al-4V, and the evolution of quasi-static (Vickers hardness, room temperature tensile characteristic) and dynamic (high-cycle fatigue characteristic) mechanical properties were analyzed.

Development of Build-up Printed Circuit Board Manufacturing Process Using Rapid Prototyping Technology and Screen Printing Technology

  • Im, Yong-Gwan;Cho, Byung-Hee;Chung, Sung-Il;Jeong, Hae-Do
    • International Journal of Precision Engineering and Manufacturing
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    • 제4권4호
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    • pp.51-56
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    • 2003
  • Generally, the build-up printed circuit board manufactured by a sequential process involving etching, plating, drilling, etc, which requires many types of equipments and long lead time. Etching process is suitable for mass production, however, it is not adequate for manufacturing a prototype in the development stage. In this study, we introduce a screen printing technology for prototyping a build-up printed circuit board. As for the material, photo/thermal curable resin and conductive paste are used for the formation of dielectric and conductor. The build-up structure is made by subsequent processes such as formation of a liquid resin thin layer, solidification by a UV/IR light, and via hole filling with a conductive paste. By use of photo curable resin, productivity is greatly enhanced compared with thermal curable resin. Finally, the basic concept and the possibility of build-up printed circuit board prototyping are proposed in comparison with the conventional process.

SLA를 이용한 신속 시작작업에서 최적 성형방향의 결정 (Determination of Optimal Build-up Direction for Stereolithographic Rapid Prototyping)

  • 허정훈;이건우
    • 한국정밀공학회지
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    • 제13권4호
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    • pp.163-173
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    • 1996
  • Stereolithography is a process used to rapidly produce polymer components directly form a computer representation of the part. There are several considerations to be made for the efficient use of the process. Especially, the build-up orientation of part critically affects the part accuracy, total build time and the volume of support structures. The purpose of tis study is to determine the optimal build-up part orientation for the SLA process with improving part accuracy, and minimizing total build time and the volume of support structures. The forst factor is related to the area of surfaces whioch have staircase protrusions after solidification, the second factor is related to the total number of layers, and the third factor is related to the area of the surfaces which need to be supported with support structures. An algorithm is developed to calculate the staircase area, quantifying the process errors by the volume of materials supposed to be removed or added to the part, and the optimal layer thickness for the SLA system which can handle the variable layer thickness. So the optima l part orientation is determined based on the user's selections of primary criter- ion and the optimal thickness of layers is calculated at any part orientations.

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Co 치환이 α-Fe기 초미세결정립 Nd-Fe-B계 합금의 자기특성에 미치는 영향 (The Effects of Co-substitution on the Magnetic Properties of Nanocrystalline Nd-Fe-B based Alloy Containing α-Fe as Main Phase)

  • 조덕호;조용수
    • 한국자기학회지
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    • 제12권1호
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    • pp.30-33
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    • 2002
  • 초미세결정렵 Nd-Fe-B-Mo-Cu합금에서 Co 치환이 미세조직과 자기특성에 미치는 영향을 조사 하였다. 급속응고법으로 제조된 비정질 Nd-(Fe, Co)-B-Mo-Cu합금은 결정화에 의하여 $\alpha$-Fe기 초미세결정립 Nd-(Fe, Co)-B-Mo-Cu합금이 제조되었다. Co로의 Fe치환은 결정립 미세화에 기여하며, 이로 인하여 경자기특성이 개선되었다. 최적열처리된 초미세결정립 N $d_4$(F $e_{0.85}$ $Co_{0.15}$)$_{82}$ $B_{10}$M $o_3$Cul합금의 잔류자화, Curie온도는 Co가 치환되지 않은 합금에 비하여 개선된 우수한 특성을 나타내었다. 64$0^{\circ}C$, 10분 열처리된 초미세결정립 N $d_4$(F $e_{0.85}$ $Co_{0.15}$)$_{82}$ $B_{10}$M $o_3$Cu 합금의 평균결정립 크기는 약 15 nm이며, 이때 보자력, 잔류자화 및 최대에너지적은 각각 239kA/m, 1.4 T 및 103.5 kJ/ $m^3$이었다.

급속응고 Mg 합금분말의 제조 및 동적성형특성 (Fabrication and Dynamic Consolidation Behaviors of Rapidly Solidified Mg Alloy Powders)

  • 채홍준;김영도;김택수
    • 한국분말재료학회지
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    • 제18권4호
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    • pp.340-346
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    • 2011
  • In order to improve the weak mechanical properties of cast Mg alloys, Mg-$Zn_1Y_2$ (at%) alloy powders were synthesized using gas atomization, a typical rapid solidification process. The powders consist of fine dendrite structures less than 3 ${\mu}m$ in arm spacing. In order to fabricate a bulk form, the Mg powders were compacted using magnetic pulse compaction (MPC) under various processing parameters of pressure and temperature. The effects of the processing parameters on the microstructure and mechanical properties were systematically investigated.

신속한 주물 시제품 개발을 위한 전산모사 기술과 산업용 단층촬영기 및 쾌속표형기의 적용 (The Application of Computer Simulation, Industrial CT and DLS RP for the rapid development of casting pilot models)

  • 유승목;임채호;조인성;최정길
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 2006년도 춘계학술대회 논문집
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    • pp.195-196
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    • 2006
  • Direct laser sintering (DLS) technology for the resign coated sand is one of attractive technologies to produce molds and cores for the foundry industry rapidly and cost effectively. The objective of this case study is to develop casting pilot models using computer simulation technology, DLS RP machine and industrial computed tomography. The proposed casting design was verified by the Z-Cast software in the fields of fluid flow and solidification during the casting process. Casting parts with aluminum alloy using the post-curing treated sand moulds and cores are accurate to dimension and defect free.

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급속응고법에 의한 열전반도체 재료 개발 (Development of thermoelectric semiconductor material by rapid solidification process)

  • 홍순직;천병선;이윤석
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2002년도 추계학술강연 및 발표대회
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    • pp.80-80
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    • 2002
  • Bi-Te게 열전재료는 200~400K 정도의 저온에서 에너지 변환 효율이 가장 높은 재료로써 열전냉각, 발전재료 등에 응용하기 위하여 제조방법 및 특성에 관한 많은 역구가 진행되어 왔다. 현재 산업화에 응용되고 있는 일방향응고법은 기계적 강도가 약하여 회수 율이 낮으며, 결정을 성장시키는데 비교적 장시간을 필요로 하기 때문에 제조 단가가 비싸다. 따라서 이와 같은 문제점을 보완하기 위하여 합금설계 및 가공공정에 대한 연구가 활발히 진행되고 있다. 이에 본 연구에서는 가스분사법을 이용하여 용질원자 편석감소, 고용도의 증가, 균일고용체 형성, 결정립 미세화 등 급속응고 장점을 이용하여 화학적으로 균일한 BI-TerP열전재료 분말을 제조하고, 열간압출 가공을 통하여 이방성의 향상과 함께 미세한 결정립으로 우수한 기계적 강도를 얻을 수 있도록 제조된 분말을 압출 가공하여 열전소자의 기계적 성질과 열전특성을 연구하였다. 그 결과 급속응고 및 압출 공정을 이용한 본 연구에서는 $10\mu\textrm{m}$이하의 미세한 조직과 함께 압출공정을 통하여 이방성을 향상시켰으며, 열전소자는 $2.5{\times}10^{-3}/K$이상의 Figure of merit값을 나타내는 우수한 열전특성을 나타냈다.

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