• 제목/요약/키워드: RMS surface roughness

검색결과 205건 처리시간 0.024초

구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과 (The Effect of Hydroxy Ethyl Cellulose(HEC) on the Surface Morphology and Mechanical Characteristis of Copper Electrodeposition)

  • 우태규;박일송;이현우;설경원
    • 한국재료학회지
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    • 제16권11호
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    • pp.710-714
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    • 2006
  • The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

코팅공구를 사용한 Face Milling의 가공특성에 관한 연구 (A Study on Machining Characteristics of Face Milling Using Coated Tool)

  • 이위로;김성일;김태영
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1993년도 추계학술대회 논문집
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    • pp.106-111
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    • 1993
  • This experimental study mainly deal with the single and multi-insert cutting characteristics using coated tool. Because metal cutting of the single and multi-insert has a large relation to the improvement of productivity, the economic cutting process can be achieved by the analysis of proper metal cutting mechanism. Therefore, machining characteristics of face milling in this paper has been studied by investigating the role of different insert number which is concerned with mean cutting force, the RMS values of AE(acoustic emission) signal, tool life and surface roughness in milling SS 41 and SUS 304.

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선삭가공시 전류신호를 이용한 채터 검출에 관한 연구 (A Study on the Detection of the Chatter Using Current Signal in Turning)

  • 서한원;유기현;오석형;서남석
    • 한국정밀공학회:학술대회논문집
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    • 한국정밀공학회 1997년도 춘계학술대회 논문집
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    • pp.947-951
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    • 1997
  • Recently, the necessity of the detection of abnormal machining process is being emphasized in order to improve the machining accuracy and reduce the cost in unmanned operating system. The vibration by chatter generated in cutting processes within machine tools is a relative motion between tools and workpieces. So, if the chatter occurs, the surface roughness and accuracy of workpieces will be deteriorate and it leads to the rapid wear of tools. The author intended to use the I /sab/RMS (current of root mean square) of current sigals and the movimg C.V. (coefficient of variation) of each phase for the detection method of chatter.

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우주망원경용 비구면 반사경 표면조도 향상을 위한 진화형 수치제어 연삭공정 모델 (NOVEL CNC GRINDING PROCESS CONTROL FOR NANOMETRIC SURFACE ROUGHNESS FOR ASPHERIC SPACE OPTICAL SURFACES)

  • 한정열;김석환;김건희;김대욱;김주환
    • Journal of Astronomy and Space Sciences
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    • 제21권2호
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    • pp.141-152
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    • 2004
  • 우주망원경용 비구면 반사경 가공 공정은 고정입자 연삭, 자유입자 래핑, 연마의 순서를 따른다. 숙련공에 의한 경험적 공정조절에 의해 목표 비구면을 가공하는 전통적 연삭 공정에서는 수 ${mu}m$ 높이의 표면 밑 손상을 남기며 뒤이은 자유입자 래핑 및 연마 공정에서 이를 제거하며 가공한다. 본 연구는 컴퓨터 수치 제어 연삭 공정진화 모델을 개발하여, 연삭가공을 통해 반사경 표면조도 최소 40nm이하, 가공 예측정확도 20nm급을 이루었다. 구체적인 방법론으로 초정밀가공기의 연삭모듈을 이용하여 연삭 휠 입자의 크기, 이송속도, 공작물 회전선속도 등 연삭 변수를 변화시키며 직경 20, 100mm Zerodur 소재를 초기 연삭하였다. 초기 연삭 변수와 측정된 표면조도와의 관계를 경험적 해석과 다 변수 회귀분석 해석 방법을 통하여 공정조절용 수치 연삭 모델을 구성하였다. 정량적 공정제어는 입력된 연삭변수들로부터 가공 후 표면조도를 예측하고, 측정된 표면조도를 이용하여 수치연삭 모델을 개량한 후 다음 가공에서 측정될 표면조도를 예측하는 순으로 만복 진행되었다. 본 연구에서는 CNC 연삭공정조절로부터 최소 평균 표면조도 36nm, 예측정확도 ${pm}20nm$를 얻었다. 이 연구결과는 정량적 연삭공정제어 모델을 사용하여 자유입자 래핑 공정을 수행할 필요 없이 연삭에서 직접 연마 공정으로 진행할 수 있는 획기적인 공정 효율 향상을 의미한다.

A Semi-empirical Model for Microwave Polarimetric Radar Backscattering from Bare Soil Surfaces

  • Oh, Yi-Sok
    • 대한원격탐사학회지
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    • 제10권2호
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    • pp.17-35
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    • 1994
  • A semi-empirical model for microwave polarimetric radar backscattering from bare soil surfaces was developed using polarmetric radar measurements and the knowledge based on the theoretical and numerical solutions. The microwave polarimetric backscatter measurements were conducted for bare soil surfaces under a variety of roughness and moisture conditions at L-, C-, and X-band frequencies at incidence angles ranging from 10` to 70`. Since the accrate target parameters as well as the radar parameters are necessary for radar scattering modeling, a complete and accurate set of ground truth data were also collected using a laser profile meter and dielectric probes for each surface condition, from which accurate measurements were made of the rms height, correlation length, and dielectric constant. At first, the angular and spectral dependencies of the measured radar backscatter for a wide range of roughnesses and moisture conditions are examined. Then, the measured scattering behavior was tested using theoretical and numerical solutions. Based on the experimental observations and the theoretical and numerical solutions, a semi-empirical model was developed for backscattering coeffients in terms of the surface roughness parameters and the relative dielectric constant of the soil surface. The model was found to yield very good agreement with the backscattering measurements of this study as well as with independent measurements.

디스플레이 확산 방지층 응용을 위한 비대칭 마그네트론 스퍼터로 증착된 질화 티타늄 박막의 특성에 대한 연구 (A Study on Characteristics of TiN Thin Films Deposited by Unbalanced Magnetron Sputtering Method for the Application of Diffusion Barrier Layers in Displays)

  • 박용섭
    • 한국전기전자재료학회논문지
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    • 제32권2호
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    • pp.129-133
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    • 2019
  • TiN thin films were fabricated using an unbalanced magnetron sputtering (UBMS) system, and their structure and surface characteristics as well as their optical and tribological properties were evaluated. The hardness, elastic modulus, adhesive force, surface roughness, and transmittance of the Ti thin films fabricated using the UBMS system were 11.5 GPa, 103 GPa, 27.5 N, 2.45 nm and 20%, respectively. The TiN films prepared with various proportions of nitrogen as the reaction gas exhibited maximum values for the hardness, elastic modulus, critical load, RMS roughness and transmittance of approximately 19.2 GPa, 182 GPa, 27.3 N, 0.98 nm, and 85%, respectively. Moreover, the TiN thin film fabricated under the condition of 30 sccm nitrogen gas showed the optimal physical properties. In summary, the TiN thin films fabricated using the UBMS system exhibited excellent hardness, elastic modulus, adhesion, and smooth surface in addition to good hydrophilic properties.

Addition of $B_2O_3$ precursors and their effect on texture and surface roughness of $La_2Zr_2O_7$ buffer layers

  • Kim, Young-Kuk;Yoo, Jai-Moo;Chung, Kook-Chae;Shin, Pyung-Woo
    • 한국초전도ㆍ저온공학회논문지
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    • 제10권2호
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    • pp.20-23
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    • 2008
  • [ $La_2Zr_2O_7$] (LZO) buffer layers were deposited on biaxially textured Ni-W substrates by chemical solution deposition method (CSD). In this study, the effect of $B_2O_3$ addition on texture and surface roughness of LZO films was investigated. The alkoxide-based precursor solution was employed to synthesize the precursor solution of LZO and the solution was coated on biaxially textured Ni-W substrates and subsequently annealed at $900^{\circ}C$ for crystallization. The pure LZO film without $B_2O_3$ addition showed a (222) reflection in the X-ray diffraction (XRD) profile. The intensity of (222) reflection was enhanced and more rough surface was obtained after further repetition of coating. Contrary to this, the LZO film prepared by $B_2O_3$ added precursor solution shows well-developed (400) reflection peak in the XRD profile and excellent biaxial texture (${\Delta}{\theta}=4.3^{\circ}$, ${\Delta}{\phi}=6.8^{\circ}$). The surface roughness of LZO films were also improved by addition of $B_2O_3$ even after multicoating ($R_{rms}{\sim}3.1nm$). It was shown that the LZO film with smooth surface and biaxial texture was grown on the biaxially textured Ni-W substrates with addition of $B_2O_3$ in the precursor solution.

유도결합 플라즈마 마그네트론 스퍼터링에 의한 MgO 박막의 특성 연구 (A Study of MgO Thin Film′s Properties Fabricated by ICP Magnetron Sputtering Method)

  • 김선호;주정훈
    • 한국표면공학회지
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    • 제37권3호
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    • pp.169-174
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    • 2004
  • MgO thin films were reactively deposited using an internal inductively coupled plasma assisted sputtering method varying reactive gas ratio to get stoichiometric film composition, and bipolar dc substrate bias to suppress micro arcs. The minimum frequency required for arc suppression was about 10KHz depending on ICP power. Their crystallinity was analyzed using X-ray diffraction and surface morphology using AFM. The surface was very smooth with rms roughness less than 0.42nm. The preferred orientation of the films were changing from (200) to bulk-like characteristics as Ar: $O_2$ratio was controlled to 10 : 2. Optical emission spectroscopy revealed that there were two distinct discharge modes: a blue one and a green one, where enhanced emission from Ar and Mg were observed. This cannot simply be understood by metallic or oxide mode of reactive sputtering due to ICP coupled to magnetron discharge.

초정밀 연삭기에 의한 사파이어의 나노가공 (A Study on the Nano Grinding of Sapphire by Ultra-Precision Grinder)

  • 김우순;김동현;난바의치
    • 한국공작기계학회논문집
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    • 제12권5호
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    • pp.40-45
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    • 2003
  • Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

플라스틱 BGA 패키지의 아르곤 가스 플라즈마 처리 효과 (Effect of Ar Gas Plasma Treatment of Plastic Ball Grid Array Package)

  • 신영의;김경섭
    • 한국전기전자재료학회논문지
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    • 제13권10호
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    • pp.805-811
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    • 2000
  • Reliability of PBGA(plastic ball grid array) package is weak compared with normal plastic packages. The low reliability is caused by low resistance to the popcorn cracking, which is generated by moisture absorption in PCB(prited circuit board). In this paper, plasma treatment process was used and we analyzed its effects to interface adhesion. The contents of C and Cl decrease after plasma treatment but those of O, Ca, N relatively increase. The plasma treatment improves the adhesion between EMC(epoxy molding compound) and PCB(solder mask). The grade of improvement was over 100% Max, which depends on the properties of EMC. The RMS(root mean square) roughness value of the solder mask surface increases to plasma treatment. There is little difference of adhesion in RF power and treatment time.

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