• 제목/요약/키워드: RLDA

검색결과 2건 처리시간 0.016초

디젤차량 요소수탱크의 진동 특성을 고려한 진동내구시험법 연구 (Study of Vibration Fatigue Test for Urea Tank of Diesel Vehicle Considering Vibration Characteristics)

  • 윤지수
    • 한국신뢰성학회지:신뢰성응용연구
    • /
    • 제18권3호
    • /
    • pp.213-219
    • /
    • 2018
  • Purpose: Satisfying the environmental regulations, the automobile manufacturer should install urea tank, which is a key component of the urea system. However, due to the limitations of existing layouts, it may be mounted which is disadvantageous to vibration and shock resulting in durability robust. analyze the factors affecting the durability life of urea tank and the vibration characteristics through RLDA. In this study, clarify the limit of the current practice test method of urea tank and analyze the possibility of the new vibration test method in the system unit reflecting the characteristics of actual use condition. Methods: Analyzing the factors affecting the durability life of urea tank and the vibration characteristics through PSD & FDS of RLDA that actual vehicle driving data on durability test road. Results: The limit of the uniform width/single frequency test method of urea tank is clarifed and the positive prospects of the new test method are discovered. Conclusion: The vibration durability test with PSD method in system unit effectively reflects the magnitude and frequency characteristics of field vibration.

웨이퍼 이송 로봇의 잔류진동 저감을 위한 입력성형 기법의 적용 (Application of an Input Shaping Method for Reduction of Residual Vibration in the Wafer Positioning Robot)

  • 안태길;임재철;김성근;김국원
    • 반도체디스플레이기술학회지
    • /
    • 제11권2호
    • /
    • pp.33-38
    • /
    • 2012
  • The wafer positioning robot in the semiconductor industry is required to operate at high speed for the improvement of productivity. The residual vibration caused by the high speed of the wafer positioning robot, however, makes the life of the robot shorter and the cycle time longer. In this study, the input shaping and the path of the system are designed for the reduction of the residual vibration and the improvement of the cycle time. The followings are the process for the reduction and the improvement; 1) System modeling of the wafer positioning robot, 2) Verification of dynamic characteristics of the wafer positioning robot, 3) Input shaping plan using impulse response reiteration, 4) Simulation test using SIMULINK program, 5) Analysis of result.