• The Proceeding of the Korean Institute of Electromagnetic Engineering and Science
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• v.13 no.2
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• pp.33-43
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• 2002

현대의 레이다나 통신 시스템에 있어 위상 배열안테나는 필수 구성요소이고 이러한 위상 배열 안테나에는 수 천개의 독립적인 위상제어기가 사용되어지고 있다. 따라서 대량생산이 가능하면서도 성능이 우수한 저손실, 저가격의 True-Time Delay (TTD)를 지원하는 위상천이기가 크게 요구되고 있는 실정이다. 최근 몇 년 동안 MEMS 공정을 이용한 저손실 RF 스위칭 소자와 가변 캐패시터가 성공적으로 개발되었으며 이러한 저손실의 MEMS 스위칭 소자를 이용한 위상천이기 구현이 가능하게 되었다. 본 논문에서는 크기나 전력소모, 삽입손실 등에서 우수한 고주파 특성을 갖는 RF MEMS (Micro-Electro Mechanical System) 스위치에 대해서 간략히 언급하고 이를 이용한 위상천이기와 기존의 위상천이기를 비교 분석하였다.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.282-283
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• 2007

본 논문에서는 저전압에서 구동 할 수 있는 압전구동 방식의 RF MEMS 스위치를 설계하였다. 설계는 유한요소기법(FEM)을 지원하는 시뮬레이터 (ConventorWare)를 사용하여 수행하였고, 이를 바탕으로 deflection, contact force, stress 등 기계적인 해석을 함으로써 최적화된 설계를 할 수 있었다. 이번 설계에서는 적절한 contact force를 유지하면서 hinge에서 받는 stress를 최소화하기 위하여 구동기를 2개 사용한 듀얼형식의 모델을 제안하였고, hinge의 모양은 'ㄷ'로 하여 deflection을 향상시켰다. 이 듀얼형식의 최적화된 모델은 signal line과 contact pad 간의 gap이 3.4${\mu}m$일 때, 최초 2.8V에서 contact이 이루어졌으며, 5V에서 12.4${\mu}N$의 contact force와 116MPa의 stress를 얻었고, 차후, SP4T나 SP6T 등의 설계시 공간 효율이 높은 다양한 형태의 구조를 설계할 수 있다.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.147-150
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• 2005

Low actuation voltage and no contact stiction are the important factors to apply MEMS RF switches to mobile devices. Conventional electrostatic MEMS RF switches require several tens of voltages for actuation. In this paper we propose PAS MEMS RF switch which adopt PZT actuators and seesaw cantilevers to meet the above requirements. The fundamental structures of PAS MEMS switch were designed, optimized, and fabricated. Through the developed processes PAS SPDT MEMS RF switches were successfully fabricated on 4" wafers and they showed good electrical properties. The driving voltage was less than 5 volts. And the insertion loss was -0.5dB and the isolation was 35dB at 5GHz. The switching speed was about 5kHz. So these MEMS RF switches can be applicable to mobile communication devices or wireless multi-media devices at lower than 6GHz.

• Journal of Sensor Science and Technology
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• v.20 no.1
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• pp.58-63
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• 2011

A low loss radio frequency(RF) micro electro mechanical systems(MEMS) switch driven by a low actuation voltage was designed for the development of a new RF MEMS switch. The RF MEMS switch should be encapsulated. The glass cap and fabricated RF MEMS switch were assembled by the Au/Sn eutectic bonding principle for wafer-level packaging. The through-vias on the glass substrate was made by the glass dry etching and Au electroplating process. The packaged RF MEMS switch had an actuation voltage of 12.5 V, an insertion loss below 0.25 dB, a return loss above 16.6 dB, and an isolation value above 41.4 dB at 6 GHz.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.59-60
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• 2008

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.6
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• pp.25-29
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• 2017

This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.

• Journal of Sensor Science and Technology
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• v.19 no.4
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• pp.320-327
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• 2010

In this paper, electrostatically actuated direct contact type RF MEMS switches have been designed and demonstrated. As driving structures of the switch, cantilever, bridge, and torsion spring beam structures are used and the actuation voltage characteristics of the switches have been compared and discussed. The designed RF switches are fabricated with the surface micromachining technology using the electroplated gold and nickel structures. The characteristics of the fabricated switches are measured and analyzed. The switch, which is fabricated using the 510 ${\mu}m$-length bridge structure with the thickness of 1.5 ${\mu}m$, is actuated with 15 V driving voltage. The insertion losses are less than 0.2 dB over the measured frequency ranges from 0 to 20 GHz and the isolations are more than 30 dB.

• Journal of IKEEE
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• v.13 no.3
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• pp.1-6
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• 2009

In this paper, the external matching circuits were designed in order to compensate the efficiency which decreases by human body effect in the internal antenna phone. Comparing the two types of matching circuit, we selected the structure to minimize the switch stress. RF MEMS switch using low voltage was compared with FET switch and measured the performance in the handset. Here, the detection circuit which can couple th reflection power from antenna was added in the handset and we set up the demonstration system that can compensate the loss of hand effect automatically. In this system, when hand effect occurred, the radiation power increased 2.5dB by operation the matching circuit.

• Journal of Satellite, Information and Communications
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• v.6 no.1
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• pp.28-31
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• 2011

In this paper, a new set of structural and sacrificial material that is diamond like carbon (DLC)/photoresist for high performance piezoelectric RF-MEMS switches which are actuated in d33 mode is suggested. To avoid curing problem of photoresist sacrificial layer, DLC structure layer is deposited at room temperature by radio frequency plasma enhanced chemical vapor deposition (RF-PECVD) method. And lead zirconate titanate (PZT) piezoelectric layer is deposited on structure layer directly at room temperature by rf magnetron sputtering system and crystallized by rapid thermal annealing (RTA) equipment. Particular attention is paid to the annealing of PZT film in order to crystallize into perovskite and the variation of mechanical properties of DLC layer as a function of annealing temperature. The DLC layer shows good performance for structure layer in aspect to Young's modulus and hardness. The fabrication becomes much simpler and cheaper with use of a photoresist.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.953-956
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• 2005

Low voltage actuation and high isolation characteristics are key features to be solved in electrostatic RF switch design. Since these parameters in the conventional parallel plate MEMS switch design are in trade-off relation, both requirements cannot be met simultaneously. In vertical comb design, however, the actuation voltage is independent to the vertical separation distance between the contact electrodes. Then, we can design the large separation distance between contact electrodes to get high isolation. We have designed an RF MEMS switch which has -40dB isolation at 5 GHz and 6 V operation voltages. The characteristics of the fabricated switch are being evaluate.