• 제목/요약/키워드: RF plasma oxidation

검색결과 31건 처리시간 0.023초

RF-PECVD 법으로 제조된 비정질 BON박막의 산화 (Oxidation of Amorphous BON Thin Films Grown by RF-PECVD)

  • 김재운;부진효;이동복
    • 한국재료학회지
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    • 제14권10호
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    • pp.683-687
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    • 2004
  • The BON thin films were grown on the Si substrate by the RF-PECVD method. When stored at the room temperature, the phase separation or transition of BON thin films occurred on the surface, due to the hydrophilic property of BON. The oxidation of BON thin films occurred mainly by the evaporation of B, O and N. The oxidized BON thin films consisted of an amorphous phase and a bit of the polycrystalline phase.

LOW TEMPERATURE DEPOSITION OF SILICON OXIDE FILMS BY UV-ASSOSTED RF PLASMA-ENHANCED CVD

  • Hozumi, Atsushi;Sugimoto, Nobuhisa;Sekoguchi, Hiroki;Takai, Osamu
    • 한국표면공학회지
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    • 제29권6호
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    • pp.773-780
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    • 1996
  • Silicon oxide films were prepared by using five kinds of organosilicon compound as gas sources without oxygen by rf plasma-enhanced CVD (PECVD). UV light was irradiated on a substrate vertically during deposition to enhance film oxidation and ablation of carbon contamination in a deposited films. Films prepared with UV irradiation contained less carbon than those prepared without UV irradiation. The oxidation of the films was improved by UN irradiation. The effect of UV irradiation was, however, not observed when the films were prepared with tetramethy lsilane (TMS) which contained no oxygen atom. Dissociated oxygen atoms from an organosilicon compound were excited in the plasma with UV irradiation around the substrate surface and affected the enhancement of film oxidation and ablation of carbon in the films.

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Plasma Enhanced CVD 법으로 증착한 BON박막과 Si-DLC 박막의 산화 (Oxidation of BON and Si-DLC Thin Films deposited by Plasma Enhanced CVD method)

  • 김찬우;홍리석;이동복
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2007년도 춘계학술발표회 초록집
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    • pp.73-73
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    • 2007
  • Amorphous BON and Si-DLC thin films were synthesized by the RF plasma enhanced CVD method, and their oxidation behavior was studied up to $500^{\circ}C$ in air. The oxidation of both films was accompanied by evaporation of volatile species. The oxidation of BON film was preceded by nitrogen escape from the film, and oxygen penetration into the film. The oxidation of Si-DLC film was preceded by carbon escape probably as CO or $CO_2$from the film, and oxygen penetration into the film. The inwardly transported oxygen simply stayed in the oxidized BON and Si-DLC thin films.

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RF 플라즈마를 이용한 순수 바나늄 분말의 구상화 거동 연구 (Spheroidization of Pure-vanadium Powder using Radio Frequency Thermal Plasma Process)

  • ;양승민;이민규;;김정한
    • 한국분말재료학회지
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    • 제26권4호
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    • pp.305-310
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    • 2019
  • In the present work, spheroidization of angular vanadium powders using a radio frequency (RF) thermal plasma process is investigated. Initially, angular vanadium powders are spheroidized successfully at an average particle size of $100{\mu}m$ using the RF-plasma process. It is difficult to avoid oxide layer formation on the surface of vanadium powder during the RF-plasma process. Titanium/vanadium/stainless steel functionally graded materials are manufactured with vanadium as the interlayer. Vanadium intermediate layers are deposited using both angular and spheroidized vanadium powders. Then, 17-4PH stainless steel is successfully deposited on the vanadium interlayer made from the angular powder. However, on the surface of the vanadium interlayer made from the spheroidized powder, delamination of 17-4PH occurs during deposition. The main cause of this phenomenon is presumed to be the high thickness of the vanadium interlayer and the relatively high level of surface oxidation of the interlayer.

저압급속열산화법과 플라즈마확산산화법에 의한 실리콘 산화박막의 제조 (Fabrication of Ultrathin Silicon Oxide Layer by Low Pressure Rapid Thermal Oxidation and Remote Plasma Oxidation)

  • 고천광;이원규
    • Korean Chemical Engineering Research
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    • 제46권2호
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    • pp.408-413
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    • 2008
  • 본 연구에서는 5nm 이하의 실리콘 산화박막 성장을 위하여 저압급속열산화법과 플라즈마확산산화법을 사용하여, 실리콘 산화박막의 성장특성을 분석하였다. 저압급속열산화법으로 기판의 온도와 산소기체의 유량 변화에 따른 실리콘 산화박막의 성장은 공정시간 5분이 경과 할 때 까지 급격한 증가를 보이다 성장 속도가 포화되는 특성을 나타내었다. 또한 $900^{\circ}C$에서 5 nm의 최대 두께를 가진 산화박막을 얻을 수 있었다. 플라즈마확산산화법은 기판의 온도와 압력은 $500^{\circ}C$, 200 mTorr으로 고정했을 때, 플라즈마 세기와 산소기체의 유량이 증가할수록 산화박막의 성장속도는 증가하였다. 보통 4분이 경과한 후 성장속도가 포화영역에 도달하여 산화막의 두께가 거의 일정하게 되는 것을 알 수 있었다. 저압급속열산화법에 의해 성장된 산화박막은 일반열산화법에 의해 제조된 산화박막의 특성과 거의 같았다.

RF 플라즈마 CVD 프로세스의 전계제어에 의한 그래핀 나노월 성장 연구 (Study on the Synthesis of Graphene Nanowall by Controlling Electric Field in a Radio Frequency Plasma CVD Process)

  • 한상보
    • 조명전기설비학회논문지
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    • 제28권9호
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    • pp.45-51
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    • 2014
  • This work carried out for the effective synthesis characteristics of graphene nanowall film by controlling the electric field in a RF plasma CVD process. For that, the bipolar bias voltage was applied to the substrate such as Si and glass materials for the best chemical reaction of positive and negative charges existing in the plasma. For supplying the seed formation sites on substrate and removing the oxidation layer on the substrate surface, the electron bombardment into substrates was performed by a positive few voltage in hydrogen plasma. After that, hydrocarbon film, which is not a graphene nanowall, was deposited on substrates under a negative bias voltage with hydrogen and methane gases. At this step, the film on substrates could not easily identify due to its transparent characteristics. However, the transparent film was easily changed into graphene nanowall by the final hydrogen plasma treatment process. The resultant raman spectra shows the existence of significant large 2D peaks corresponding to the graphene.

실험계획법을 통한 구리 질화물 패시베이션 형성을 위한 아르곤 플라즈마 영향 분석 (Analysis of Ar Plasma Effects for Copper Nitride Passivation Formation via Design of Experiment)

  • 박해성;김사라은경
    • 마이크로전자및패키징학회지
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    • 제26권3호
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    • pp.51-57
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    • 2019
  • 구리 표면을 대기 중의 산화로부터 보호하기 위해서 아르곤(Ar)과 질소($N_2$) 가스를 이용하는 two-step플라즈마 공정으로 산화 방지층인 구리 질화물 패시베이션 형성을 연구하였다. Ar 플라즈마는 구리 표면에 존재하는 이물질을 제거하는 동시에 표면을 활성화시켜 다음 단계에서 진행되는 $N_2$ 플라즈마 공정 시 질소 원자와 구리의 반응을 촉진시키는 역할을 수행한다. 본 연구에서는 two-step 플라즈마 공정 중 Ar 플라즈마 공정 조건이 구리 질화물 패시베이션 형성에 미치는 영향을 실험계획법의 완전요인설계를 통하여 분석하였다. XPS 분석에 의하면 Ar 플라즈마 공정 시 낮은 RF 파워와 압력을 사용할 경우 구리 산화물 피크(peak) 면적은 감소하고, 반대로 구리 질화물(Cu4N, Cu3N) 피크 면적은 증가하였다. Ar 플라즈마 공정 시 구리 질화물 형성의 주 효과는 RF 파워로 나타났으며 플라즈마 공정 변수간 교호작용은 거의 없었다.

Si/$SiO_2$/NiFe/$Al_2$$O_3$/Co 박막의 투과자기저항 특성 연구 (Tunneling Magnetoresistance in Si/$SiO_2$/NiFe/$Al_2$$O_3$/Co Thin Films)

  • 현준원;백주열
    • 한국전기전자재료학회논문지
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    • 제14권11호
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    • pp.934-940
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    • 2001
  • Magnetic properties were investigated for Si/SiO$_2$/NiFe(300 )/A1$_2$O$_3$(t)/Co(200 ) junction related with the parameters of $Al_2$O$_3$. Insulating $Al_2$O$_3$ layer was formed by depositing a 5~40 thick Al layer, followed by a 90~120s RF plasma oxidation in an $O_2$ atmosphere. Magnetoresistance was not observed for tunnel junction with 5~10 thick Al layer, but magnetoresistance was observed large for tunnel junction with 15~40 thick Al layer. Oxidation time did not largely influence magnetoresistance. Tunnel magnetoresistance effect depended on magnetization behavior of two ferromagnetic layers. Tunneling junction was confirmed through nonlinear I-V curve. In this work, tunneling magnetoresistance(TMR) up to 30 % was observed. This apparent TMR is an artifact of the nonuniform current flow over the junction in the cross geometry of the electrodes.

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The Properties of RF Sputtered Zirconium Oxide Thin Films at Different Plasma Gas Ratio

  • Park, Ju-Yun;Heo, Jin-Kook;Kang, Yong-Cheol
    • Bulletin of the Korean Chemical Society
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    • 제31권2호
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    • pp.397-400
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    • 2010
  • Zirconium oxide thin films deposited on the p-type Si(100) substrates by radio-frequency (RF) reactive magnetron sputtering with different plasma gas ratios have been studied by using spectroscopic ellipsometry (SE), atomic force microscopy (AFM), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). The deposition of the films was monitored by the oxygen gas ratio which has been increased from 0 to 80%. We found that the thickness and roughness of the zirconium oxide thin films are relatively constant. The XRD revealed that the deposited thin films have polycrystalline phases, Zr(101) and monoclinic $ZrO_2$ ($\bar{1}31$). The XPS result showed that the oxidation states of zirconium suboxides were changed to zirconia form with increasing $O_2$ gas ratio.

Effect of O2 Plasma Treatments of Carbon Supports on Pt-Ru Electrocatalysts

  • Park, Soo-Jin;Park, Jeong-Min;Seo, Min-Kang
    • Bulletin of the Korean Chemical Society
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    • 제31권2호
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    • pp.331-334
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    • 2010
  • In the present study, carbon supports mixed with purified multi-walled carbon nanotubes (MWNTs) and carbon blacks (CBs) were used to improve the cell performance of direct methanol fuel cells (DMFCs). Additionally, the effect of $O_2$ plasma treatment on CBs/MWNTs supports was investigated for different plasma RF powers of 100, 200, and 300 W. The surface and structural properties of the CBs/MWNTs supports were characterized by FT-IR, X-ray photoelectron spectroscopy (XPS), X-ray diffraction (XRD), and inductive coupled plasma-mass spectrometer (ICP-MS). The electrocatalytic activity of PtRu/CBs/MWNTs catalysts was investigated by cyclic voltammetry measurement. In the experimental results, the oxygen functional groups of the supports were increased with increasing plasma RF power, while the average Pt particle size was decreased owing to the improvement of dispersibility of the catalysts. The electrochemical activity of the catalysts for methanol oxidation was gradually improved by the larger available active surface area, itself due to the introduction of oxygen functional groups. Consequently, it was found that $O_2$ plasma treatments could influence the surface properties of the carbon supports, resulting in enhanced electrocatalytic activity of the catalysts for DMFCs.