• Proceedings of the Korean Vacuum Society Conference
• /
• 2012.02a
• /
• pp.486-486
• /
• 2012

반도체 식각 공정에서 이온의 플럭스와 충돌 에너지를 각각 조절하고자 Dual frequency RF source가 사용된다. 듀얼 freuqnecy RF가 인가된 Capacitively coupled plasma (CCP) 의 경우, 기판에 걸린 Low freuqency (LF) RF 소스에 의하여 이온의 에너지를 조절하고, High frequency (HF) 소스를 조절하여 이온의 플럭스를 조절하는 것이 일반적이다. 그러나 LF의 세기가 증가함에 따라서, 플라즈마의 밀도가 오히려 감소하는 문제점이 있었다. 이 경우, 약한 자장을 플라즈마에 걸어줌으로써 밀도가 감소되는 문제를 해결할 수 있다고 알려져 왔다. Inductively coupled plasma (ICP) 에서는 HF를 안테나에 가하여 이온의 플럭스를 조절하고, LF를 기판에 가하여 이온의 충돌 에너지를 조절하는 것이 일반적인데, 위와 동일한 문제가 이 경우에도 발생하는 것을 확인 하였다. CCP와 마찬가지로, 바이어스에 걸린 파워의 세기가 증가함에 따라서 플라즈마의 밀도가 감소하고 전자의 온도가 증가하는 현상을 확인하였다. 또한 이때에도, 약한 자장을 걸어줌으로써 플라즈마의 밀도가 감소하지 않고 유지될 수 있으며, 전자의 온도 또한 유지될 수 있음을 발견하였다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.21 no.11
• /
• pp.973-976
• /
• 2008

In addition to its similarity to genuine diamond film, diamond-like carbon (DLC) film has many advantages, including its wide band gap and variable refractive index. In this study, DLC films were prepared by the RF PECVD (Plasma Enhanced Chemical Vapor Deposition) method on silicon substrates using methane ($CH_4$) and hydrogen ($H_2$) gas. We examined the effects of the RF power on the electrical properties of the DLC films. The films were deposited at several RF powers ranging from 50 to 175 W in steps of 25 W. The leakage current of DLC films increased at higher deposition RF power. And the resistivities of DLC films grown at 50 W and 175 W were $5\times10^{11}$ ${\Omega}cm$ and $2.68\times10^{10}$ ${\Omega}cm$, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.27 no.1
• /
• pp.39-44
• /
• 2014

Silicon nitride thin film deposited with Plasma Enhanced Chemical Vapor Deposition was treated by a nitrogen plasma generated by Inductively Coupled Plasma at room temperature. The treatment was investigated by Fourier Transform Infrared Spectroscopy and Atomic Force Microscopy on the surface at various RF source powers at two RF bias powers. The amount of hydrogen was reduced and the surface roughness of the films was decreased remarkably after the plasma treatment. In order to understand the causes, we analyzed the plasma diagnostics by Optical Emission Spectroscopy and Double Langmuir Probe. Based on these analysis results, we show that the nitrogen plasma treatment was effective in the improving of the properties silicon nitride thin film for flexible display.

• Journal of the Korean institute of surface engineering
• /
• v.41 no.4
• /
• pp.134-141
• /
• 2008

We have developed a numerical model for a remote ICP(inductively coupled plasma) system in 2D and 3D with gas distribution configurations and confirmed it by plasma diagnostics. The ICP source has a Cu tube antenna wound along a quartz tube driven by a variable frequency rf power source($1.9{\sim}3.2$ MHz) for fast tuning without resort to motor driven variable capacitors. We investigated what conditions should be met to make the plasma remotely localized within the quartz tube region without charged particles' diffusing down to a substrate which is 300 mm below the source, using the numerical model. OES(optical emission spectroscopy), Langmuir probe measurements, and thermocouple measurement were used to verify it. To maintain ion current density at the substrate less than 0.1 $mA/cm^2$, two requirements were found to be necessary; higher gas pressure than 100 mTorr and smaller rf power than 1 kW for Ar.

• Bulletin of the Korean Chemical Society
• /
• v.30 no.3
• /
• pp.595-598
• /
• 2009

The authors describe an analytical method to determine total chlorine in a sanitizer liquid, incorporating a lab-made He-rf-plasma within a PDMS polymer microchip. Helium was used instead of Ar to produce a plasma to achieve efficient Cl excitation. A quartz tube 1 mm i.d. was embedded in the central channel of the polymer microchip to protect it from damage. Rotational temperature of the He-microchip plasma was in the range 1350-3600 K, as estimated from the spectrum of the OH radical. Chlorine was generated in a volatilization reaction vessel containing potassium permanganate in combination of sulfuric acid and then introduced into the polymer microchip plasma (PMP). Atomic emission lines of Cl at 438.2 nm and 837.7 nm were used for analysis; no emission was observed for Ar plasma. The achieved limit of detection was 0.81 ${\mu}g\;mL^{-1}$ (rf powers of 30-70 W), which was sensitive enough to analyze sanitizers that typically contained 100-200 ${\mu}g\;mL^{-1}$ of free chlorine in chlorinated water. This study demonstrates the usefulness of the devised PMP system in the food sciences and related industries.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2003.07b
• /
• pp.1111-1114
• /
• 2003

In this paper, electrical characteristics of inductively coupled plasma in an electrodeless fluorescent lamp were investigated using a Langmuir probe with a variation of argon gas pressure. The RF output was applied in the range of $5{\sim}50W$ at 13.56MHz. The internal plasma voltage of the chamber and the probe current were measured while varying the supply voltage to the Langmuir probe in the range of $-100V{\sim}+100V$. When the pressure of argon gas was increased, electric current was decreased. There was a significant electric current increase from l0W to 30W. Also, when the RF power was increased, electron density was increase. This implies that this method can be used to find an optimal RF power for efficient light illumination in an electrodeless fluorescent lamp.

• Journal of the Korean institute of surface engineering
• /
• v.29 no.6
• /
• pp.781-787
• /
• 1996

Silicom oxide films with good water repellency were prepared by rf plasma-enhanced CVD (rf-PECVD) using four kinds of organosilicon compound, which had different number of methyl ($CH_3$) groups, and oxygen as gas sources. The differences in the deposition rates, film composition and film properties were studied in detail. Water repellency depended on the number of $CH_3$ groups in the organosilicon compounds and the partial pressure of oxygen in the plasma. The highest contact angle for water drops, about 95 degrees, was obtained when trimethy lmethoxy silane (TMMOS) was used. The contact angle decreased with the amount of oxygen gas introduced into the plasma. The dissociation of $CH_3$ groups by adding oxygen was comfirmed by Fourier transform infrared spectroscopy(FTIR) and X-ray photoelectron spectroscopy (XPS). The optical properties were estimated by double-beam spectroscopy and ellipsometry. The transmittance of the glass plate coated by the film prepared with tetramethoxy silane (TMOS) was about 90% and the refractive index of film was 1.44. This value was smaller than the refractive index of a glass plate(soda lime glass, refractive index is 1.515) and this film played a role of anti-refractive coating.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.48 no.9
• /
• pp.616-621
• /
• 1999

A planar inductively coupled $CH_4/H_2/Ar$plasma was used to investigate dry etch characteristics of GaN as a function of input power, RF bias power, and etch gas composition. Etch rate of GaN increased with input power up to 600 W and was saturated at the higher power. Also, the etch rates increased with increasing RF bias power, composition of $CH_4$ and Ar gas. We achieved the maximum etch rate of $930{\AA}$/min at the input power 400 W, RF bias power 250 W, and operational pressure 10 mTorr. This paper shows that smooth etched surface having roughness less than 1 nm in rms can be obtained by using planar inductively coupled plasma with $CH_4/H_2/Ar$ gas chemistry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.11a
• /
• pp.183-186
• /
• 2004

The dry etch behavior of PZT thin films was investigated in $BCl_3/N_2$ plasma. The experiments were carried out with measuring etch rates and selectivities of PZT to $SiO_2$ as a function of gas concentration and input rf power, chamber pressure. The maximum etch rate was 126 nm/min when 30% $N_2$ was added to $BCl_3$ chemistry. Also, as input rf power increases, the etch rate of PZT thin films was increased. Langmuir probe measurement showed the noticeable influence of $BCl_3/N_2$ mixing ratio on electron temperature and electron density as input rf power increased. The variation of Cl radical density as plasma parameters changed was examined by Optical Emission Spectroscopy (OES) analysis. According to X-ray diffraction (XRD) analysis, PZT thin films were damaged in plasma and an increase in (100), (200) and (111) phases showed the improvement in structure of the PZT thin films after the $O_2$ annealing process.

• Proceedings of the Korean Vacuum Society Conference
• /
• 1995.06a
• /
• pp.102-102
• /
• 1995