• Proceedings of the IEEK Conference
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• 1998.10a
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• pp.1053-1056
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• 1998

Package strutures for RF circuit design are characterized and their equivalent circuitsare developed. The circuit parameters are extracted by using the commercial 3-dimensional field solver. The circuit models are verified by using the full-wave analysis in the RF region. It is demonstarted with the developed circuit models that the packages have substantial effects on the RF circuit performances.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.44 no.4
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• pp.28-39
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• 2007

This paper presents a programmable RF DFT (Radio Frequency Design-for-Testability) circuit for low noise amplifiers. We have developed a new on-chip RF DFT circuit that measures RF parameters of low noise amplifier (LNA) using only DC measurements [1, 2]. This circuit is extremely useful for today's RFIC devices in a complete RF transceiver environment. The DFT circuit contains test amplifier with programmable capacitor banks and RF peak detectors. The test circuit utilizes output DC voltage measurements and these measured values are translated into the LNA specifications such as input impedance and gain using the mathematical equations. Our on-chip DFT circuit can be self programmed for 1.8GHz, 2.4GHz and 5.25GHz low noise amplifiers for GSM, Bluetooth and IEEE802.11g standards. The circuit is simple and inexpensive.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.1004-1007
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• 2005

This paper presents a programmable RF BIST (Built-in Self-Test) circuit for low noise amplifiers. We have developed a new on-chip RF BIST circuit that measures RF parameters of low noise amplifier (LNA) using only DC measurements. The BIST circuit contains test amplifier with programmable capacitor banks and RF peak detectors. The test circuit utilizes output DC voltage measurements and these measured values are translated into the LNA specifications such as input impedance and gain using the mathematical equations. Our on-chip BIST can be self programmed for 1.8GHz, 2.4GHz and 5.25GHz LNA for GSM, Bluetooth and IEEE802.11g standards.

• Journal of information and communication convergence engineering
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• v.11 no.1
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• pp.56-61
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• 2013

Modern integrated circuits (ICs) are becoming an integrated parts of analog, digital, and radio frequency (RF) circuits. Testing these RF circuits on a chip is an important task, not only for fabrication quality control but also for tuning RF circuit elements to fit multi-standard wireless systems. In this paper, RF test circuits suitable for embedded testing are introduced: RF power detectors, power control circuits, directional couplers, and six-port reflectometers. Various types of embedded RF power detectors are reviewed. The conventional approach and our approach for the RF power control circuits are compared. Also, embedded tunable active directional couplers are presented. Then, six-port reflectometers for embedded RF testing are introduced including a 77-GHz six-port reflectometer circuit in a 130 nm process. This circuit demonstrates successful calibrated reflection coefficient simulation results for 37 well distributed samples in a Smith chart. The details including the theory, calibration, circuit design techniques, and simulations of the 77-GHz six-port reflectometer are presented in this paper.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11b
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• pp.410-413
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• 2001

In this paper, we present results of this that design of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonation circuit and the oscillation circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for acquiring EM(Electromagnetic) characteristics of conductor pattern as well as designing multi-layer VCO, Acquired EM characteristics of the circuit pattern was used like real components at nonlinear RF circuit simulator. Finally VCO is simulated at nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was DuPont #9599, which is applied for L TCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 1[dBm], the phase noise was 102 [dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of l0[mA]

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.11a
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• pp.410-413
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• 2001

In this paper, we present results of this that design of the multi-layer VCO(Voltage Controlled Oscillator), which is composed of the resonation circuit and the oscillation circuit, using EM simulator and nonlinear RF circuit simulator. EM simulator is used for acquiring EM(Electromagnetic) characteristics of conductor pattern as well as designing multi-layer VCO, Acquired EM characteristics of the circuit pattern was used like real components at nonlinear RF circuit simulator. Finally VCO is simulated at nonlinear RF circuit simulator. The material for the circuit pattern was Ag and the dielectric was Dupont ＃9599, which is applied for LTCC process. The structure is constructed with 4 conducting layer. Simulated results showed that the output level was about 1[dBm], the phase noise was 102 [dBc/Hz] at 30[kHz] offset frequency, the harmonics -8dBc, and the control voltage sensitivity of 30[MHz/V] with a DC current consumption of 10[mA].

• Proceedings of the Korean Institute of Communication Sciences Conference
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• 2006.07a
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• pp.687-687
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• 2006

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.1
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• pp.8-18
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• 2000

We presented a BGA(Ball Grid Array) package for RF circuit modules and extracted its electrical parameters. As the frequency of RF system devices increases, the effect of its electrical parasitics in the wireless communication system requires new structure of RF circuit modules because of its needs to be considered of electrical performance for minimization and module mobility. RF circuit modules with BGA packages can provide some advantages such as minimization, shorter circuit routing, and noise improvement by reducing electrical noise affected to analog and digital mixed circuits, etc. We constructed a BGA package of ITS(Intelligent Transportation System) RF module and measured electrical parameters with a TDR(Time Domain Reflectometry) equipment and compared its electrical parasitic parameters with PCB RF circuits. With a BGA substrate of 3${\times}$3 input and output terminals, we have found that self capacitance of BGA solder ball is 68.6fF, and self inductance 146pH, whose values were reduced to 34% and 47% of the value of QFP package structure. S11 parameter measurement with a HP4396B Network Analyzer showed the resonance frequency of 1.55GHz and the loss of 0.26dB. Routing length of the substrate was reduced to 39.8mm. Thus, we may improve electrical performance when we use BGA package structures in the design of RF circuit modules.

• Proceedings of the KIEE Conference
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• 1999.07g
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• pp.3256-3258
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• 1999

Recently contactless ID system has emerged as new ID industry. It's called RF-ID. RF-ID is divided into active RF-ID and passive RF-ID. The passive RF-ID operates without battery and so has no limitation in its operating range and life time. But it needs the RF-OC conversion circuit. It also can be applied to batteryless sensor for many application. This paper presents the study of the RF-OC conversion circuit for batteryless system in high frequency and confirms it by simulation and experiment.

• JSTS:Journal of Semiconductor Technology and Science
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• v.11 no.4
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• pp.238-246
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• 2011

A 3-5 GHz UWB radar chip in 0.13 ${\mu}m$ CMOS process is presented in this paper. The UWB radar transceiver for surveillance and biometric applications adopts the equivalent time sampling architecture and 4-channel time interleaved samplers to relax the impractical sampling frequency and enhance the overall scanning time. The RF front end (RFFE) includes the wideband LNA and 4-way RF power splitter, and the analog signal processing part consists of the high speed track & hold (T&H) / sample & hold (S&H) and integrator. The interleaved timing clocks are generated using a delay locked loop. The UWB transmitter employs the digitally synthesized topology. The measured NF of RFFE is 9.5 dB in 3-5 GHz. And DLL timing resolution is 50 ps. The measured spectrum of UWB transmitter shows the center frequency within 3-5 GHz satisfying the FCC spectrum mask. The power consumption of receiver and transmitter are 106.5 mW and 57 mW at 1.5 V supply, respectively.