• Journal of Advanced Navigation Technology
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• v.17 no.6
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• pp.658-663
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• 2013

In this paper, a microstrip line implementation using via transition and its application of multilayer compact ring hybrid coupler are presented. This transition is the sandwich structure with via hole to connect two microstrip lines in different layer. For designing a compact RF/Microwave passive circuit, the microstrip line using via-hole transition is proposed to reduce a size of microwave circuit with long transmission line. For the validation of the microstrip line with via-hole transition, the multilayer ring hybrid coupler is implemented at center frequency of 2 GHz. The measured performances are in good agreement with simulation results and about 50% size reduction compare to conventional ring hybrid coupler.

• Journal of Korea Multimedia Society
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• v.21 no.4
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• pp.493-498
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• 2018

In this paper, we provide the performance analyses of a dual-hop amplify-and-forward(AF) relay transmission composed of asymmetric radio-frequence(RF) and free-space optical(FSO) links. In the mixed RF/FSO system, a relay is equipped with two receive antennas for RF signals and one additional transmit antenna for FSO signals. In order to improve a performance of RF link, a switch-and-stay (SSC) diversity technique is applied at the relay which can provide a proper link performance with a low complexity. Specifically, we offer the performance analyses of the proposed system in terms of outage probability and secrecy outage probability. In numerical examples, we compare the system performances with no diversity and selection combining systems and verify our analytical results via computer-based Monte-Carlo simulations.

• Journal of electromagnetic engineering and science
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• v.4 no.2
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• pp.56-62
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• 2004

We present a multi-Gbit/s digital I/O interface based on RF-modulation and capacitive-coupling over an impedance matched transmission line. The RF-interconnect(RFI) can greatly reduce the digital switching noise and eliminate the dc power dissipation over the channel. It also enables reduced signal amplitude(as low as 200 ㎷) with enhanced data rate and affordable circuit overhead. This paper addresses the system advantages and implementation issues of RFI. A prototype on-chip RFI transceiver is implemented in 0.18-${\mu}{\textrm}{m}$ CMOS. It demonstrates a maximum data rate of 2.2 Gbit/s via 10.5-㎓ RF-modulation. The RFI can be very instrumental for future high-speed inter- and intra-ULSI data links.

• Journal of the Korean Ceramic Society
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• v.44 no.10
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• pp.585-588
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• 2007

Silicon nitride films for an anti-reflection coating were deposited on silicon via RF magnetron sputtering using a $Si_3N4$ target. The best result was obtained at the sputtering condition of 340 W RF power, 5 mtorr Ar atmosphere, $100^{\circ}C$ substrate temperature. The films showed 7.9% reflectance minimum with 2.35 refractive index. 0.21 absorption coefficient at 66.6 nm thickness. The surface morphology showed a smooth and dense film with good adhesion to silicon surface.

• Journal of the Microelectronics and Packaging Society
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• v.6 no.4
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• pp.61-71
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• 1999

The recent trend toward higher frequencies, miniaturization and lower-cost in wireless communication equipment is demanding high density packaging technologies such flip chip interconnection and multichip module(MCM) as a substitute of conventional plastic package. With analyzing the recently reported research results of the RF flip chip, this paper presents the technical issues and advantages of RF flip chip and suggest the flip chip technologies suitable for the development stage. At first, most of RF flip chips are designed in a coplanar waveguide line instead of microstrip in order to achieve better electrical performance and to avoid the interaction with a substrate. Secondly, eliminating wafer back-side grinding, via formation, and back-side metallization enables the manufacturing cost to be reduced. Finally, the electrical performance of flip chip bonding is much better than that of plastic package and the flip chip interconnection is more suitable for Transmit/Receiver modules at higher frequency. However, the characterization of CPW designed RF flip chip must be thoroughly studied and the Au stud bump bonding shall be suggested at the earlier stage of RF flip chip development.

• Journal of Institute of Control, Robotics and Systems
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• v.7 no.9
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• pp.733-740
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• 2001

A monitoring robot capable of doing network and RF communication is introduced. The robot has several features that poses arbitrary position thanks to a mechanism combining the 4wheel drive and 4 link mechanism, transmits an image and command data via RF wireless communication. Moreover, the image data from the camera are transferred through a network communication. The robot plays a role in monitoring what is happening around the robot, and covers wide range due to a moving camera associated with the 4 arms. The robot can adjust its mass center by the 4 link mechanism, hence it guarantees a stability in moving on the slope.

• Proceedings of the Korean Institute of Navigation and Port Research Conference
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• 2022.11a
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• pp.390-391
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• 2022

Recently, SpaceX, private enterprise dealing in space development company, has reported a plan for launching of low earth orbit satellites via Starlink Business, and launched 900 satellites until now. Concretely, it plans tp operate Ku/Ka band satellite, and launch 7,518 of V band satellites for broadband communication. Therefore, wireless communication service for ship will be provided, and various solutions will be offered through the low earth orbit satellites. In this work, we investigated RF characteristics of coplanar waveguide employing periodic 3D coupling structures, and examined its potential for a development of marine radio communication FISoC (fully-integrated system on chip) semiconductor device.

• Proceedings of the IEEK Conference
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• 2000.11b
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• pp.341-344
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• 2000

Several new via structures in printed circuit boards are proposed, fabricated and characterized in RF regime. The new structure with a larger inductance component in the bottom layer shows 3㏈ improvement over the conventional structure. The ADS simulation with model parameters extracted from 3D fie]d solver matches with the characterization of these vias

• The Journal of Korean Institute of Communications and Information Sciences
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• v.38B no.9
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• pp.715-721
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• 2013

Minimization techniques are adaptations of Helical structure, Meta material, multi-layer structure etc. But, Helical structure is not suited to minimization technique of RF circuit having single resonant frequency. Because it generate resonant frequency following as rotation of circumference. Meta material and multi layer structure have weakness of expenditure and complex structure. In addition, conventional three dimensional M$\ddot{o}$bius Strip and planar M$\ddot{o}$bius Strip are not two dimensional planar M$\ddot{o}$bius Strip that has weakness of electrical coupling effect. Therefore, in this paper, we proposed miniaturized and reduced electrical coupling effect antenna by adaptation of Quasi M$\ddot{o}$bius Strip that topology is same as three dimensional M$\ddot{o}$bius Strip with Via-Hole structure. According to the simulation result, physical circumferential length is 1/3 minimized compared with conventional ring antenna under the same resonant frequency. In addition, coupling effect is not nearly generates near to the resonant frequency, 2.4GHz.

• Journal of the Korean Vacuum Society
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• v.7 no.3
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• pp.255-260
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• 1998

The ionized magnetron sputtering is very useful in filling of small metal contact or via in ULSI processing with very high ionization upto 80% based on incoming flux ratio. But fairly high sputtering gas pressure is required to get high ionization, which instead gives low deposition rate and diverse incoming neutral's angular distribution. The electron quenching by heavily sputtered metals and gas rarefaction were considered the main causes of decreased ionization in this process. RF pulsing of sputtering power was proposed to solve those two problems. The results showed that 10㎳/10 ㎳ and 100㎳/100 ㎳ of on/off pulsings were optimal pulse conditions from OES measurements and also XRD of deposited Ag film showed distinct change of (111) to (200) preferred orientation. These results were analysed in a view point of neutral gas heating and cooling by high power sputtering.