• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.4
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• pp.63-69
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• 1999

The electrical properties of rf-magnetron sputtered $Ba_{0.5}Sr_{0.3}TiO_3$ (BST) capacitors were investigated by varying annealing temperature and atmosphere of the rapid thermal annealing (RTA). The electrical properties of Pt/BST/Pt capacitors were found to strongly depend on the RTA condition. It seems that the dependence of the electrical properties of the Pt/BST/Pt capacitors on the RTA condition is related to the oxygen vacancies in BST thin films. In order to clarify the relation between the oxygen vacancies and the electrical properties of Pt/BST/Pt capacitors, we have examined the two different annealing methods. One annealing method was performed in $O_2$ gas and the other was done in $O_2$-plasma at the same condition of 450$^{\circ}C$, 20 mtorr. It was found that the leakage current densities of $O_2$-plasma annealed capacitor were much lower than those of $O_2$ annealed capacitor. The dielectric constants of $O_2$ annealed capacitor decreased about 14% comparing with those of as-deposited. In contrast, there was no decrease in the dielectric constant of $O_2$-plasma annealed. These results indicate that $O_2$-plasma annealing is very effective in compensation the oxygen vacancies in BST thin films. It can be also concluded that the oxygen vacancies greatly affect the electrical properties of Pt/BST/Pt capacitors.

• YAKHAK HOEJI
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• v.41 no.1
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• pp.60-73
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• 1997

In order to design a 24 hr sustained release preparation of sulindac for oral administration, fast release pellet (FR), slow release pellet (SR) and two combined formulation (1 : 1 and 1 : 2) were prepared. The pharmacokinetic effect of such preparations has been evaluated using rabbits as a suitable in vivo model, and tested in man. Dose determination was carried out using curve fitting according to RSTPJP II program. In bioavailability test using rabbit, AUCs of sulindac in a few designed formulations were similar to each other. $C_{max}$- of RF and SR were 1.8 times and 1.2 times higher, respectively, compared to that of combined formulation (FR:SR=1:1). While plasma concentration of FR and SR decreased rapidly, that of combined formulation (FR:SR 1:1) lasted at the level close to $C_{max}$ for 24 hrs. Plasma concentration of sulfide form from the combined pellet(FR:SR=1:1) lasted for 24 hrs, and its AUC value was 1.4-fold, 2.7-fold. and 1.2-fold greater than FR pellet, SR pellet and combined pellet (FR:SR 1 : 2). Thus, the combined pellet of 1:1 ratio was found to be the most effective for oral sustained release formulation. Bioavailability test in human showed that AUC of sulfide from TSRP (1 : 1) was approximately 1.5 times greater than total AUC of Immbaron$^{\circledR}$ administered twice in a day. While $T_{max}$ of sulfide from lmmbaron$^{\circledR}$ was 4.33 +/- 1.37 hr (lst administration) and 3.33 ${pm}$ 0.82 hr (2nd administration), respectively, that of sulfide from TSRP increased to 7.17 ${pm}$ 2.86 hr. Plasma concentration of sulfide from TSRP was sustained at more, than 1.0 ${\mu}g{\cdot}$hr/ml until 24 hrs after one dose administration. In addition, TSRP may decrease local adverse reaction in the stomach, since plasma concentration of sulfide from the combined pellet was low within 2hrs in the stomach. In conclusion, it is suggested that TSRP formulation may be effective for oral 24 hr sustained release formulation of sulindac dosing 300 ~ 350mg once a day.

• Proceedings of the Materials Research Society of Korea Conference
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• 2012.05a
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• pp.68.1-68.1
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• 2012

The best part of graphene is - charge-carriers in it are mass less particles which move in near relativistic speeds. Comparing to other materials, electrons in graphene travel much faster - at speeds of $10^8cm/s$. A graphene sheet is pure enough to ensure that electrons can travel a fair distance before colliding. Electronic devices few nanometers long that would be able to transmit charge at breath taking speeds for a fraction of power compared to present day CMOS transistors. Many researches try to check a possibility to make it a perfect replacement for silicon based devices. Graphene has shown high potential to be used as interconnects in the field of high frequency electrical devices. With all those advantages of graphene, we demonstrate characteristics of electrical and optical properties of graphene such as the effect of graphene geometry on the microwave properties using the measurements of S-parameter in range of 500 MHz - 40 GHz at room temperature condition. We confirm that impedance and resistance decrease with increasing the number of graphene layer and w/L ratio. This result shows proper geometry of graphene to be used as high frequency interconnects. This study also presents the optical properties of graphene oxide (GO), which were deposited in different substrate, or influenced by oxygen plasma, were confirmed using different characterization techniques. 4-6 layers of the polycrystalline GO layers, which were confirmed by High resolution transmission electron microscopy (HRTEM) and electron diffraction analysis, were shown short range order of crystallization by the substrate as well as interlayer effect with an increase in interplanar spacing, which can be attributed to the presence of oxygen functional groups on its layers. X-ray photoelectron Spectroscopy (XPS) and Raman spectroscopy confirms the presence of the $sp^2$ and $sp^3$ hybridization due to the disordered crystal structures of the carbon atoms results from oxidation, and Fourier Transform Infrared spectroscopy (FTIR) and XPS analysis shows the changes in oxygen functional groups with nature of substrate. Moreover, the photoluminescent (PL) peak emission wavelength varies with substrate and the broad energy level distribution produces excitation dependent PL emission in a broad wavelength ranging from 400 to 650 nm. The structural and optical properties of oxygen plasma treated GO films for possible optoelectronic applications were also investigated using various characterization techniques. HRTEM and electron diffraction analysis confirmed that the oxygen plasma treatment results short range order crystallization in GO films with an increase in interplanar spacing, which can be attributed to the presence of oxygen functional groups. In addition, Electron energy loss spectroscopy (EELS) and Raman spectroscopy confirms the presence of the $sp^2$ and $sp^3$ hybridization due to the disordered crystal structures of the carbon atoms results from oxidation and XPS analysis shows that epoxy pairs convert to more stable C=O and O-C=O groups with oxygen plasma treatment. The broad energy level distribution resulting from the broad size distribution of the $sp^2$ clusters produces excitation dependent PL emission in a broad wavelength range from 400 to 650 nm. Our results suggest that substrate influenced, or oxygen treatment GO has higher potential for future optoelectronic devices by its various optical properties and visible PL emission.

• Journal of the Optical Society of Korea
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• v.13 no.1
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• pp.8-14
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• 2009

In a laser-plasma wakefield accelerator, the ponderomotive force of an ultrashort high intensity laser pulse excites a longitudinal wave or plasma bubble in a way similar to the excitation of a wake wave behind a boat as it propagates on the water surface. Electric fields inside the plasma bubble can be several orders of magnitude higher than those available in conventional RF-based particle accelerator facilities which are limited by material breakdown. Therefore, if an electron bunch is properly phase-locked with the bubble's acceleration field, it can gain relativistic energies within an extremely short distance. Here, in the bubble regime we show the generation of stable and reproducible sub GeV, and GeV-class electron beams. Supported by three-dimensional particle-in-cell simulations, our experimental results show the highest acceleration gradients produced so far. Simulations suggested that the plasma bubble elongation should be minimized in order to achieve higher electron beam energies.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.418.1-418.1
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• 2016

Atomic layer deposition (ALD)를 이용하여 증착된 aluminum oxide ($Al_2O_3$)는 우수한 패시베이션 특성을 가지고 있다. $Al_2O_3$ 박막은 많은 수소를 가지고 있기 때문에 화학적 패시베이션에 의한 실리콘 표면을 패시베이션 할 수 있다. 또한 $Al_2O_3$는 강한 고정전하를 가져 전계 효과 패시베이션을 할 수 있다. 따라서 $Al_2O_3$ 박막을 태양전지에 적용할 경우 높은 효율을 기대할 수 있다. 실리콘 태양전지를 제작하기 위해 소성공정(> $800^{\circ}C$)은 필수이다. $Al_2O_3$ 박막은 많은 수소를 가지고 있기 때문에 소성공정시 수소가스를 방출하여 $Al_2O_3$ 박막에 블리스터를 형성시킨다. 이 블리스터는 $Al_2O_3/Si$ 계면에서 발생하여 패시베이션 특성을 감소시킨다. 블리스터를 억제하기 위해 수소의 양을 조절할 필요가 있다. 이 실험에서는 plasma-assisted atomic layer deposition (PAALD)으로 $Al_2O_3$를 증착하였다. PAALD의 RF power를 200 W부터 800 W까지 조절하여 $Al_2O_3$ 막에 포함되는 OH의 농도를 조절하였다. $Al_2O_3$ 박막에 포함되는 OH 농도는 X-ray Photoelectron Spectroscopy (XPS)를 이용하여 분석하였다. 열처리공정 후, 화학적 패시베이션에 의한 유효 반송자 수명 (${\tau}_{eff}$) 향상이 나타났다 소성공정 후 블리스터가 형성되지 않는 조건에서 화학적 패시베이션과 전계 효과 패시베이션에 의해 ${\tau}_{eff}$가 증가하였다. 블리스터가 형성되었을 때 기존 논문들과 같이 패시베이션 특성이 감소하였다. 패시베이션 특성의 감소는 블리스터에 의한 화학적 패시베이션의 감소 때문이며 전계 효과 패시베이션은 오히려 증가하였다. 이를 통해 고온에서 열안정성을 갖는 $Al_2O_3$ 박막을 만들었으며 블리스터가 형성되지 않았고 패시베이션 특성이 증가하였다.

• 한국신재생에너지학회:학술대회논문집
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• 2005.06a
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• pp.192-195
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• 2005

The silicon thin film solar cells were fabricated by 13.56 MHz PECVD (Plasma-Enhanced Chemical-Vapor Deposition) and 60 MHz VHF PECVD (Very High-Frequency Plasma-Enhanced Chemical-Vapor Deposition). We focus on textured ZnO:Al films prepared by RF sputtering and post deposition wet chemical etching and studied the surface morphology and optical properties. These films were optimized the light scattering properties of the textured ZnO:Al after wet chemical etching. Finally, the textured ZnO:Al films were successfully applied as substrates for silicon thin films solar cells. The efficiency of tandem solar cells with $0.25 cm^2$ area was $11.8\%$ under $100mW/cm^2$ light intensity. The electrical properties of tandem solar cells were measured with solar simulator (AM 1.5, $100 mW/cm^2)$ and spectral response measurements.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.7
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• pp.595-601
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• 2009

For the silicon oxide $(SiO_x)$ films prepared by using the facing target sputtering (FTS) apparatus that was manufactured to enhance the preciseness of the fabricated thin-film and sputtering yield rate by forming a higher-density plasma in the electrical discharge space for using it as a thin-film passivation system for flexible organic light emitting devices (FOLEDs). The deposition characteristics were investigated under various process conditions, such as array of the cathode magnets, oxygen concentration$(O_2/Ar+O_2)$ introduced during deposition, and variations of distance between two targets and working pressure. We report that the optimum conditions for our FTS apparatus for the deposition of the $SiO_x$ films are as follows: $d_{TS}\;and\;d_{TT}$ are 90mm and 120mm, respectively and the maximum deposition rate is obtained under a gas pressure of 2 mTorr with an oxygen concentration of 3.3%. Under this optimum conditions, it was found that the $SiO_x$ film was grown with a very high deposition rate of $250{\AA}$/min by rf-power of $4.4W/cm^2$, which was significantly enhanced as compared with a deposition rate (${\sim}55{\AA})$/min) of the conventional sputtering system. We also reported that the FTS system is a suitable method for the high speed and the low temperature deposition, the plasma free deposition, and the mass-production.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.14 no.2
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• pp.93-98
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• 2001

YMnO$_3$ films are excellent gate dielectric materials of ferroelectric random access memories (FRAMs) with MFSFET (metal -ferroelectric-semiconductor field effect transistor) structure because YMnO$_3$ films can be deposited directly on Si substrate and have a relatively low permittivity. Although the patterning of YMnO$_3$ thin films is the requisite for the fabrication of FRAMs, the etch mechanism of YMnO$_3$ thin films has not been reported. In this study, YMnO$_3$thin films were etched with Cl$_2$/Ar gas chemistries in inductively coupled plasma (ICP). The maximum etch rate of YMnO$_3$ film is 285$\AA$/min under Cl$_2$/(Cl$_2$+Ar) of 1.0, RF power of 600 W, dc-bias voltage of -200V, chamber pressure of 15 mTorr and substrate temperature of $25^{\circ}C$. The selectivities of YMnO$_3$ over CeO$_2$ and $Y_2$O$_3$ are 2.85, 1.72, respectively. The selectivities of YMnO$_3$ over PR and Pt are quite low. Chemical reaction in surface of the etched YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS) surface of the selected YMnO$_3$ thin films was investigated with X-ray photoelectron spectroscopy(XPS) and secondary ion mass spectrometry (SIMS). The etch profile was also investigated by scaning electron microscopy(SEM)

• JSTS:Journal of Semiconductor Technology and Science
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• v.5 no.2
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• pp.131-135
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• 2005

The effect of different surface passivation films on blue or green (465-505 nm) InGaN/GaN multi-quantum well light-emitting diodes (LEDs) die were examined. $SiO_2$ or $SiN_x$ deposited by plasma enhanced chemical vapor deposition, or $Sc_2O_3$ or MgO deposited by rf plasma enhanced molecular beam epitaxy all show excellent passivation qualities. The forward current-voltage (I-V) characteristics were all independent of the passivation film used, even though the MBE-deposited films have lower interface state densities ($3-5{\times}10^{12}\;eV^{-1}\;cm^{-2}$) compared to the PECVD films (${\sim}10^{12}\;eV^{-1}\;cm^{-2}$), The reverse I-V characteristics showed more variation, hut there was no systematic difference for any of the passivation films, The results suggest that simple PECVD processes are effective for providing robust surface protection for InGaN/GaN LEDs.

• Proceedings of the Korean Vacuum Society Conference
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• 1999.07a
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• pp.111-111
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• 1999

반도체 소자의 고집적화 및 고속화에 따라 다층 금속배선에서의 RC 지연이 전체 지연의 주된 요소로 되고 있다. 이런 RC 진연을 줄이기 위해서 현재 다층 금속배선의 층간 절연막으로 사용하고 있는 SiO2 박막(k~3.9)을 보다 낮은 유전상수(low-k)를 가지는 물질로 대체할 것이 요구된다. 층간 절연막으로서 가져야 할 가장 중요한 것은 낮은 유전상수와 높은 열적안정성($\geq$45$0^{\circ}C$)이다. 본 연구에서는 Toluene을 precursor로 사용한 PECVD방법으로 low-k 유사중합체 유기박막을 성장시켰으며 부동한 온도에서 성장된 박막의 특성을 비교하여 증착온도가 박막의 특성에 미치는 영향에 대하여 조사하였다. 유사중합체 유기박막은 platinum(Pt)기판과 silicon 기판위에 같이 증착되었다. Precursor는 4$0^{\circ}C$로 유지된 bubbler에 담겨지고 증발된 precursor molecules는 Argon(Ar:99.999%) carrier 가스에 의해 process reactor 내부로 유입된다. Plasma는 RF(13.56MHz generator로 연결된 susceptor 주위에 발생시켰다. Silicon 기판위에 증착한 시편으로 Fourier transform infrared (FTIR) spectra 및 열적 안정성을 측정하였고, Pt 기판위에 증착한 시편으로 Al/유기박막/Pt 구조의 capacitor를 만들어 열적안정성을 측정하였고, Pt 기판위에 증착한 시편으로는 Al/유기박막/Pt 구조의 capacitor를 만들어 K값 및 절연성을 측정하였다. Capacitance는 1MHz 주파수에서 측정하였다. 열적안정성은 30분동안 Ar 분위기에서 annealing하기 전후의 증착막의 두께의 변화를 측정함으로써 조사하였으며 유기박막의 두께는 surface profilometer로 측정하였다. 증착온도가 45$^{\circ}C$에서 15$0^{\circ}C$, 25$0^{\circ}C$로 높아짐에 따라 k값은 높아졌지만 대신 열적안정성은 좋아졌다. plasma power 30W인 경우 45$^{\circ}C$에서 증착했을 때 유전상수는 2.80으로 낮았지만 40$0^{\circ}C$에서 30분 동안 열처리한 후 두께가 49% 감소하였다. 그러나 25$0^{\circ}C$에서 증착했을 때 유전상수는 3.10으로 좀 높아졌지만 열적으로는 40$0^{\circ}C$까지 안정하였으며 45$0^{\circ}C$에서도 두께의 감소는 8%에 불과했다.