• Title/Summary/Keyword: RF ICs

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A Comparison Study of Input ESD Protection schemes Utilizing Thyristor and Diode Devices (싸이리스터와 다이오드 소자를 이용하는 입력 ESD 보호방식의 비교 연구)

  • Choi, Jin-Young
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.47 no.4
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    • pp.75-87
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    • 2010
  • For two input-protection schemes suitable for RF ICs utilizing the thyristor and diode protection devices, which can be fabricated in standard CMOS processes, we attempt an in-depth comparison on HBM ESD robustness in terms of lattice heating inside protection devices and peak voltages developed across gate oxides in input buffers, based on DC, mixed-mode transient, and AC analyses utilizing a 2-dimensional device simulator. For this purpose, we construct an equivalent circuit for an input HBM test environment of a CMOS chip equipped with the input ESD protection circuits, which allows mixed-mode transient simulations for various HBM test modes. By executing mixed-mode simulations including up to six active protection devices in a circuit, we attempt a detailed analysis on the problems, which can occur in real tests. In the procedure, we suggest to a recipe to ease the bipolar trigger in the protection devices and figure out that oxide failure in internal circuits is determined by the junction breakdown voltage of the NMOS structure residing in the protection devices. We explain the characteristic differences of two protection schemes as an input ESD protection circuit for RF ICs, and suggest valuable guidelines relating design of the protection devices and circuits.

Development of RF IC, Signal Processing IC and Software for Portable GPS Receiver (휴대 GPS 수신기용 RF IC, 신호처리 IC 및 소프트웨어 개발)

  • Ryum, Byung R.;Koo, Kyung Heon;Song, Ho Jun;Jee, Gyu In
    • Journal of Advanced Navigation Technology
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    • v.1 no.1
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    • pp.23-34
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    • 1997
  • A multi-channel digital GPS receiver has been developed including a RF-to-IF engine (engine 1), a digital signal processing engine (engine 2) with a microprocessor interfacing, and a navigation software. A high speed SiGe heterojunction bipolar transistor (HBT) as a active device has been mounted on chip-on-board (COB) type hybrid ICs such as LNA, mixer, and VCO in RF front-end of the engine 1 board. A 6-channel digital correlator together with a real-time clock and a microprocessor interface has been realized using an Altera Flex 10K FPGA as well as ASIC technology. Navigation software controlling the correlator for GPS signal tracking, retrieval and storing a message retrieval, and position calculation has been implemented. The GPS receiver was tested using a single channel STR2770 simulator. Successful navigation message retrieval and position determination was confirmed.

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Interference Cancellation System in Repeater Using Signed-Signed LMF Algorithm (Signed-Signed LMF 알고리즘을 이용한 간섭제거 중계기)

  • Han, Yong-Sik
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.5
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    • pp.805-810
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    • 2019
  • Recently, a majority of 4G mobile telecommunication manufacturers prefer repeaters with good adaptability. In this paper, we propose a new LMF(: Least Means Fourth) algorithm for LTE(: Long Term Evolution) RF(: Radio Frequency) Repeater. The proposed algorithm is a modification of the LMF, which appropriately adjusts the step size and improves performance according to the Sign function. The steady state MSE(: Mean Square Error) performance of the proposed LMF algorithm with step size of 0.009 is low level at about -25dB, and the proposed LMF algorithm requires 500 less iterations than the conventional algorithms at MSE of -25dB.

Adaptive Interference Cancellation Using CMA-Correlation Normalized LMS for WCDMA System

  • Han, Yong-Sik;Yang, Woon-Geun
    • Journal of information and communication convergence engineering
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    • v.8 no.2
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    • pp.155-158
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    • 2010
  • In this article, we proposed a new interference canceller using the adaptive algorithm. We designed constant modulus algorithm-correlation normailized least mean square (CMA-CNLMS) for wireless system. This structure is normalized LMS algorithm using correlation between the desired and input signal for cancelling the interference signals in the wideband code division multiple access (WCDMA) system. We showed that the proposed algorithm could improve the Mean Square Error (MSE) performance of LMS algorithm. MATLAB (Matrix Laboratory) is employed to analyze the proposed algorithm and to compare it with the experimental results. The MSE value of the LMS with mu=0.0001 was measured as - 12.5 dB, and that of the proposed algorithm was -19.5 dB which showed an improvement of 7dB.

Design of 24 GHz Radar with Subspace-Based Digital Beam Forming for ACC Stop-and-Go System

  • Jeong, Seong-Hee;Oh, Jun-Nam;Lee, Kwae-Hi
    • ETRI Journal
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    • v.32 no.5
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    • pp.827-830
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    • 2010
  • For an adaptive cruise control (ACC) stop-and-go system in automotive applications, three radar sensors are needed because two 24 GHz short range radars are used for object detection in an adjacent lane, and one 77 GHz long-range radar is used for object detection in the center lane. In this letter, we propose a single sensor-based 24 GHz radar with a detection capability of up to 150 m and ${\pm}30^{\circ}$ for an ACC stop-and-go system. The developed radar is highly integrated with a high gain patch antenna, four channel receivers with GaAs RF ICs, and back-end processing board with subspace based digital beam forming algorithm.

properties of Metal/$ZrTiO_4$/Metal Capacitors for Microwave Applications (고주파 적용을 위한 금속/$ZrTiO_4$/금속 캐피시터 특성)

  • Park, Chang-Sun;Seon, Ho-Jeong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2008.11a
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    • pp.197-197
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    • 2008
  • There are fast growing demands for new dielectric materials for passive capacitors of RF-ICs and other wireless applications. One of the bulk microwave dielectric materials which have superior properties is $ZrTiO_4$ due to its large dielectric constant and high quality factor. Therefore, $ZrTiO_4$ is worth studying as a form of thin film to be applied for passive capacitors of integrated circuits. In this study, we fabricated metal-insulator-metal type capacitors with $ZrTiO_4$ dielectric thin film, and evaluated their capacitor properties.

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A Method of Combining Scrambling Technology with Error Control Coding to Realize Both Confidentiality and Reliability in Wireless M2M Communication

  • Zhang, Meng;Wang, Zhe;Guo, Menghan
    • KSII Transactions on Internet and Information Systems (TIIS)
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    • v.6 no.1
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    • pp.162-177
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    • 2012
  • In this paper we present a novel method of applying image scrambling technology which belongs to the information hiding field in the error control coding to introduce confidentiality in wireless machine to machine communication. The interleaver in serial concatenated convolutional codes, which is the key module in overcoming burst errors, is deliberately designed with the scrambling function to provide a low error rate for those authorized transceivers. By contrast, the unauthorized transceivers without keys would get so high an error rate that decoding bits could bring little value, thus realizing both the confidentiality and reliability in wireless machine to machine communication.

77-GHz mmWave antenna array on liquid crystal polymer for automotive radar and RF front-end module

  • Kim, Sangkil;Rida, Amin;Lakafosis, Vasileios;Nikolaou, Symeon;Tentzeris, Manos M.
    • ETRI Journal
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    • v.41 no.2
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    • pp.262-269
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    • 2019
  • This paper introduces a low-cost, high-performance mmWave antenna array module at 77 GHz. Conventional waveguide transitions have been replaced by 3D CPW-microstrip transitions which are much simpler to realize. They are compatible with low-cost substrate fabrication processes, allowing easy integration of ICs in 3D multi-chip modules. An antenna array is designed and implemented using multilayer coupled-fed patch antenna technology. The proposed $16{\times}16$ array antenna has a fractional bandwidth of 8.4% (6.5 GHz) and a 23.6-dBi realized gain at 77 GHz.

DC/RF Magnetron Sputtering deposition법에 의한 $TiSi_2$ 박막의 특성연구

  • Lee, Se-Jun;Kim, Du-Soo;Sung, Gyu-Seok;Jung, Woong;Kim, Deuk-Young;Hong, Jong-Sung
    • Proceedings of the Korean Vacuum Society Conference
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    • 1999.07a
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    • pp.163-163
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    • 1999
  • MOSFET, MESFET 그리고 MODFET는 Logic ULSIs, high speed ICs, RF MMICs 등에서 중요한 역할을 하고 있으며, 그것의 gate electrode, contact, interconnect 등의 물질로는 refractory metal을 이용한 CoSi2, MoSi2, TaSi2, PtSi2, TiSi2 등의 효과를 얻어내고 있다. 그중 TiSi2는 비저항이 가장 낮고, 열적 안정도가 좋으며 SAG process가 가능하므로 simpler alignment process, higher transconductance, lower source resistance 등의 장점을 동시에 만족시키고 있다. 최근 소자차원이 scale down 됨에 따라 TiSi2의 silicidation 과정에서 C49 TiSi2 phase(high resistivity, thermally unstable phase, larger grain size, base centered orthorhombic structure)의 출현과 그것을 제거하기 위한 노력이 큰 issue로 떠오르고 있다. 여러 연구 결과에 따르면 PAI(Pre-amorphization zimplantation), HTS(High Temperature Sputtering) process, Mo(Molybedenum) implasntation 등이 C49를 bypass시키고 C54 TiSi2 phase(lowest resistivity, thermally stable phase, smaller grain size, face centered orthorhombic structure)로의 transformation temperature를 줄일 수 있는 가장 효과적인 방법으로 제안되고 있지만, 아직 그 문제가 완전히 해결되지 않은 상태이며 C54 nucleation에 대한 physical mechanism을 밝히진 못하고 있다. 본 연구에서는 증착 시 기판온도의 변화(400~75$0^{\circ}C$)에 따라 silicon 위에 DC/RF magnetron sputtering 방식으로 Ti/Si film을 각각 제작하였다. 제작된 시료는 N2 분위기에서 30~120초 동안 500~85$0^{\circ}C$의 온도변화에 따라 RTA법으로 각각 one step annealing 하였다. 또한 Al을 cosputtering함으로써 Al impurity의 존재에 따른 영향을 동시에 고려해 보았다. 제작된 시료의 분석을 위해 phase transformation을 XRD로, microstructure를 TEM으로, surface topography는 SEM으로, surface microroughness는 AFM으로 측정하였으며 sheet resistance는 4-point probe로 측정하였다. 분석된 결과를 보면, 고온에서 제작된 박막에서의 C54 phase transformation temperature가 감소하는 것이 관측되었으며, Al impuritydmlwhswork 낮은온도에서의 C54 TiSi2 형성을 돕는다는 것을 알 수 있었다. 본 연구에서는 결론적으로, 고온에서 증착된 박막으로부터 열적으로 안정된 phase의 낮은 resistivity를 갖는 C54 TiSi2 형성을 보다 낮은 온도에서 one-step RTA를 통해 얻을 수 있다는 결과와 Al impurity가 존재함으로써 얻어지는 thermal budget의 효과, 그리고 그로부터 기대할 수 있는 여러 장점들을 보고하고자 한다.

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RF Capacitive Coupling Link for 3-D ICs (3-D 집적회로용 RF 커패시티브 결합 링크)

  • Choi, Chan-Ki;Cui, Chenglin;Kim, Seong-Kyun;Kim, Byung-Sung
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.24 no.10
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    • pp.964-970
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    • 2013
  • This paper presents a bandpass wireless 3-D chip to chip interface technique. The proposed technique uses direct amplitude modulation of the free running oscillator which especially utilizes the coupling capacitance between two stacked chips as a part of the resonator. Therefore, the oscillator is three dimensionally configured and a simple envelope detector can be used as a receiver without any additional matching circuitry. The proposed link was designed and fabricated using 110 nm CMOS technology and experimental results successfully showed the data transmission at a data rate of 2 Gb/s for the stacked chips with a thickness of 50 ${\mu}m$ consuming 4.32 mW. The sizes of the Tx and Rx chips are 0.045 $mm^2$ and 0.029 $mm^2$, respectively.