• Title/Summary/Keyword: RAM parameter

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Parametric Sensitivity Analysis of Markov Process Based RAM Model (Markov Process 기반 RAM 모델에 대한 파라미터 민감도 분석)

  • Kim, Yeong Seok;Hur, Jang Wook
    • Journal of the Korean Society of Systems Engineering
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    • v.14 no.1
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    • pp.44-51
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    • 2018
  • The purpose of RAM analysis in weapon systems is to reduce life cycle costs, along with improving combat readiness by meeting RAM target value. We analyzed the sensitivity of the RAM analysis parameters to the use of the operating system by using the Markov Process based model (MPS, Markov Process Simulation) developed for RAM analysis. A Markov process-based RAM analysis model was developed to analyze the sensitivity of parameters (MTBF, MTTR and ALDT) to the utility of the 81mm mortar. The time required for the application to reach the steady state is about 15,000H, which is about 2 years, and the sensitivity of the parameter is highest for ALDT. In order to improve combat readiness, there is a need for continuous improvement in ALDT.

Development of Design Alternative Analysis Program Considering RAM Parameter and Cost (RAM 파라미터와 비용을 고려한 설계대안 분석 프로그램 개발)

  • Kim, Han-sol;Choi, Seong-Dae;Hur, Jang-wook
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.6
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    • pp.1-8
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    • 2019
  • Modern weapon systems are multifunctional, with capabilities for executing complex missions. However, they are required to be highly reliable, which increases their total cost of ownership. Because it is necessary to produce the best results within a limited budget, there is an increasing interest in development, acquisition, and maintenance costs. Consequently, there is a need for tools that calculate the lifecycle costs of weapons systems development to facilitate decision making. In this study, we propose a cost calculation function based on the Markov process simulator-a reliability, availability, and maintainability analysis tool developed by applying the Markov-Monte Carlo method-as an alternative to these requirements to facilitate decision-making in systems development.

Application of Reverse Engineering System for Improvement of Curl Distortion in Stereolithography Process (광조형 공정시 휨에 의한 변형을 개선하기 위한 역설계 시스템의 적용)

  • Che, Woo-Seong
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.4
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    • pp.7-13
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    • 2009
  • The slender device(long length and thin width) manufactured by stereolithography process suffers from large curl distortion. This paper adapts two control parameters such as a critical exposure and a penetration depth. The measurement of the test parts dimension are carried out by reverse engineering method with the optical 3-dimensional measurement equipment. We investigate how each parameter contributes to the part accuracy and estimates the optimal set of parameters which minimizes the dimensional error of the test parts. Finally, As being an the RAM slot as being an example of the slender device, the RAM slot is made with the optimal values of control parameter and the results are investigated

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Fabrication of Resistive Switching Memory based on Solution Processed AlOx - PMMA Blended Thin Film

  • Sin, Jung-Won;Baek, Il-Jin;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.181.1-181.1
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    • 2015
  • 용액 공정을 이용한 Resistive random access memory (ReRAM)은 간단한 공정 과정, 대면적화, 저렴한 가격 등의 장점으로 인해 큰 관심을 받고 있으며, HfOx, TiOx, AlOx 등의 산화물이 ReRAM 절연 막으로 주로 연구되고 있다. 더 나아가 최근에는 organic 물질을 메모리 소자로 사용한 연구가 보고되고 있다. 이는 경제적이며, wearable 또는 flexible system에 적용이 용이하다. 그럼에도 불구하고, organic 물질을 갖는 메모리 소자는 기존의 산화물 소자에 비해 열에 취약하며 전기적인 특성과 신뢰성이 우수하지 못하다는 단점을 가지고 있다. 이를 위한 방안으로 본 연구에서는 AlOx - polymethylmethacrylate (PMMA) blended thin film ReRAM을 제안하였다. 이는 organic물질의 전기적 특성을 개선시킬 뿐 아니라, inorganic 물질을 wearable 소자에 적용했을 때 발생하는 crack과 같은 기계적 물리적 결함을 해결할 수 있는 새로운 방법이다. 먼저, P-type Si 위에 습식산화를 통하여 SiO2 300 nm 성장시킨 기판을 사용하여 electron beam evaporation으로 10 nm의 Ti, 100 nm의 Pt 층을 차례로 증착하였다. 그리고 PMMA 용액과 AlOx 용액을 초음파를 이용하여 혼합한 뒤, 이 용액을 Pt 하부 전극 상에서 spin coating방법으로 1000 rpm 10초, 5000 rpm 30초의 조건으로 증착하였다. Solvent 및 불순물 제거를 위하여 150, 180, $210^{\circ}C$의 온도로 30 분 동안 열처리를 진행하였고, shadow mask를 이용하여 상부 전극인 Ti를 sputtering 방식으로 100 nm 증착하였다. 150, 180, $210^{\circ}C$로 각각 열처리한 AlOx - PMMA blended ReRAM의 전기적 특성은 HP 4156B semiconductor parameter analyzer를 이용하여 측정하였다. 측정 결과 제작된 소자 전부에서 2 V이하의 낮은 동작전압, 안정된 DC endurance (>150cycles), 102 이상의 높은 on/off ratio를 확인하였고, 그 중 $180^{\circ}C$에서 열처리한 ReRAM은 더 높은 on/off ratio를 갖는 것을 확인하였다. 결론적으로 baking 온도를 최적화하였으며 AlOx - PMMA blended film ReRAM의 우수한 메모리 특성을 확인하였다. AlOx-PMMA blended film ReRAM은 organic과 inorganic의 장점을 갖는 wearable 및 system용 비휘발성 메모리소자에 적용이 가능한 경제적인 기술로 판단된다.

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Convergence Study on Fabrication and Plasma Module Process Technology of ReRAM Device for Neuromorphic Based (뉴로모픽 기반의 저항 변화 메모리 소자 제작 및 플라즈마 모듈 적용 공정기술에 관한 융합 연구)

  • Kim, Geunho;Shin, Dongkyun;Lee, Dong-Ju;Kim, Eundo
    • Journal of the Korea Convergence Society
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    • v.11 no.10
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    • pp.1-7
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    • 2020
  • The manufacturing process of the resistive variable memory device, which is the based of neuromorphic device, maintained the continuity of vacuum process and applied plasma module suitable for the production of the ReRAM(resistive random access memory) and process technology for the neuromorphic computing, which ensures high integrated and high reliability. The ReRAM device of the oxide thin-film applied to the plasma module was fabricated, and research to improve the properties of the device was conducted through various experiments through changes in materials and process methods. ReRAM device based on TiO2/TiOx of oxide thin-film using plasma module was completed. Crystallinity measured by XRD rutile, HRS:LRS current value is 2.99 × 103 ratio or higher, driving voltage was measured using a semiconductor parameter, and it was confirmed that it can be driven at low voltage of 0.3 V or less. It was possible to fabricate a neuromorphic ReRAM device using oxygen gas in a previously developed plasma module, and TiOx thin-films were deposited to confirm performance.

Improved Uniformity in Resistive Switching Characteristics of GeSe Thin Film by Ag Nanocrystals

  • Park, Ye-Na;Shin, Tae-Jun;Lee, Hyun-Jin;Lee, Ji-Soo;Jeong, Yong-Ki;Ahn, So-Hyun;Lee, On-You;Kim, Jang-Han;Nam, Ki-Hyun;Chung, Hong-Bay
    • Proceedings of the Korean Vacuum Society Conference
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    • 2013.08a
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    • pp.237.2-237.2
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    • 2013
  • ReRAM cell, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of conductive filament in a solid electrolyte [1,2]. Especially, Chalcogenide-based ReRAM have become a promising candidate due to the simple structure, high density and low power operation than other types of ReRAM but the uniformity of switching parameter is undesirable. It is because diffusion of ions from anode to cathode in solid electrolyte layer is random [3]. That is to say, the formation of conductive filament is not go through the same paths in each switching cycle which is one of the major obstacles for performance improvement of ReRAM devices. Therefore, to control of nonuniform conductive filament formation is a key point to achieve a high performance ReRAM. In this paper, we demonstrated the enhanced repeatable bipolar resistive switching memory characteristics by spreading the Ag nanocrystals (Ag NCs) on amorphous GeSe layer compared to the conventional Ag/GeSe/Pt structure without Ag NCs. The Ag NCs and Ag top electrode act as a metal supply source of our devices. Excellent resistive switching memory characteristics were obtained and improvement of voltage distribution was achieved from the Al/Ag NCs/GeSe/Pt structure. At the same time, a stable DC endurance (>100 cycles) and an excellent data retention (>104 sec) properties was found from the Al/Ag NCs/GeSe/ Pt structured ReRAMs.

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The impact of ram pressure on the multi-phase ISM probed by the TIGRESS simulation

  • Choi, Woorak;Kim, Chang-Goo;Chung, Aeree
    • The Bulletin of The Korean Astronomical Society
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    • v.43 no.1
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    • pp.62.1-62.1
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    • 2018
  • Galaxies in the cluster environment interact with the intracluster medium (ICM), losing the interstellar medium (ISM) and alternating their evolution. Observational evidences of the extraplanar ISM stripped by the ICM's ram pressure are prevalent in HI imaging studies of cluster galaxies. However, current theoretical understanding of the ram pressure stripping (or ICM-ISM interaction in general) is still limited mainly due to the lack of numerical resolution at ISM scales in large-scale simulations. Especially, self-consistent modeling of the turbulent, multiphase ISM is critical to understand star formation in galaxies interacting with the ICM. To achieve this goal, we utilize the TIGRESS simulation suite, simulating a local patch of galactic disks with high resolution to resolve key physical processes in the ISM, including cooling/heating, self-gravity, MHD, star formation, and supernova feedback. We then expose the ISM disk to ICM flows and investigate the evolution of star formation rate and the properties of the ISM. By exploring ICM parameter space, we discuss an implication of the simple ram pressure stripping condition (so called the Gunn-Gott condition) to the realistic ISM.

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Investigation on Resistive Switching Characteristics of Solution Processed Al doped Zn-Tin Oxide film

  • Hwang, Do-Yeon;Park, Dong-Cheol;Jo, Won-Ju
    • Proceedings of the Korean Vacuum Society Conference
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    • 2015.08a
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    • pp.180-180
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    • 2015
  • Solution processed Resistive random access memory (ReRAM)은 간단한 공정 과정, 고집적도, 저렴한 가격, 대면적화 플라즈마 데미지 최소화 등의 장점으로 차세대 비휘발성 메모리로 써 많은 관심을 받고 있으며, 주로 high-k 물질인 HfOx, TiOx, ZnO 가 이용 된다. IGZO와 ZTO와 같은 산화물 반도체는 높은 이동도, 대면적화, 넓은 밴드갭으로 인하여 투명한 장점으로 LCDs (Liquid crystal displays)에 이용 가능하며, 최근에는 IGZO와 ZTO에서 Resistive Switching (RS) 특성을 확인한 논문이 보고되면서 IGZO와 ZTO를 ReRAM의 switching medium와 TFT의 active material로써 동시에 활용하는 것에 많은 관심을 받고 있다. 이와 같은 산화물 반도체는 flat panel display 회로에 TFT와 ReRAM의 active layer로써 집적가능 하며 systems-on-panels (SOP)에 적용 가능하다. 하지만 IGZO 보다는 ZTO가 In과 Ga을 포함하지 않기 때문에 저렴하다. 그러므로 IGZO를 대신하는 물질로 ZTO가 각광 받고 있다. 본 실험에서는 ZTO film에 Al을 doping하여 메모리 특성을 평가하였다. 실험 방법으로는 p-type Si에 습식산화를 통하여 SiO2를 300 nm 성장시킨 기판을 사용하였다. 그리고 Electron beam evaporator를 이용하여 Ti를 10 nm, Pt를 100 nm 증착 한다. 용액은 Zn와 Tin의 비율을 1:1로 고정한 후 Al의 비율을 0, 0.1, 0.2의 비율로 용액을 각각 제작하였다. 이 용액을 이용하여 Pt 위에 spin coating방법을 이용하여 1000 rpm 10초, 6000 rpm 30초의 조건으로 AZTO (Al-ZnO-Tin-Oxide) 박막을 증착한 뒤, solvent 및 불순물 제거를 위하여 $250^{\circ}C$의 온도로 30분 동안 열처리를 진행하였다. 이후 Electron beam evaporator를 이용하여 top electrode인 Ti를 100 nm 증착하였다. 제작된 메모리의 전기적 특성은 HP 4156B semiconductor parameter analyzer를 이용하여 측정하였다. 측정 결과, AZTO (0:1:1, 0.1:1:1, 0.2:1:1)를 이용하여 제작한 ReRAM에서 RS특성을 얻었으며 104 s이상의 신뢰성 있는 data retention특성을 확인하였다. 그리고 Al의 비율이 증가할수록 on/off ratio가 증가하고 endurance 특성이 향상되는 것을 확인하였다. 결론적으로 Al을 doping함으로써 ZTO film의 메모리 특성을 향상 시켰으며 AZTO film을 메모리와 트랜지스터의 active layer로써 활용 가능할 것으로 기대된다.

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High Security FeRAM-Based EPC C1G2 UHF (860 MHz-960 MHz) Passive RFID Tag Chip

  • Kang, Hee-Bok;Hong, Suk-Kyoung;Song, Yong-Wook;Sung, Man-Young;Choi, Bok-Gil;Chung, Jin-Yong;Lee, Jong-Wook
    • ETRI Journal
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    • v.30 no.6
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    • pp.826-832
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    • 2008
  • The metal-ferroelectric-metal (MFM) capacitor in the ferroelectric random access memory (FeRAM) embedded RFID chip is used in both the memory cell region and the peripheral analog and digital circuit area for capacitance parameter control. The capacitance value of the MFM capacitor is about 30 times larger than that of conventional capacitors, such as the poly-insulator-poly (PIP) capacitor and the metal-insulator-metal (MIM) capacitor. An MFM capacitor directly stacked over the analog and memory circuit region can share the layout area with the circuit region; thus, the chip size can be reduced by about 60%. The energy transformation efficiency using the MFM scheme is higher than that of the PIP scheme in RFID chips. The radio frequency operational signal properties using circuits with MFM capacitors are almost the same as or better than with PIP, MIM, and MOS capacitors. For the default value specification requirement, the default set cell is designed with an additional dummy cell.

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A HIGHER ORDER NUMERICAL SCHEME FOR SINGULARLY PERTURBED BURGER-HUXLEY EQUATION

  • Jiwrai, Ram;Mittal, R.C.
    • Journal of applied mathematics & informatics
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    • v.29 no.3_4
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    • pp.813-829
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    • 2011
  • In this article, we present a numerical scheme for solving singularly perturbed (i.e. highest -order derivative term multiplied by small parameter) Burgers-Huxley equation with appropriate initial and boundary conditions. Most of the traditional methods fail to capture the effect of layer behavior when small parameter tends to zero. The presence of perturbation parameter and nonlinearity in the problem leads to severe difficulties in the solution approximation. To overcome such difficulties the present numerical scheme is constructed. In construction of the numerical scheme, the first step is the dicretization of the time variable using forward difference formula with constant step length. Then, the resulting non linear singularly perturbed semidiscrete problem is linearized using quasi-linearization process. Finally, differential quadrature method is used for space discretization. The error estimate and convergence of the numerical scheme is discussed. A set of numerical experiment is carried out in support of the developed scheme.