• 한국전기전자재료학회논문지
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• 제35권5호
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• pp.480-487
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• 2022

As a process to improve the insulation performance of VIs (Vacuum Interrupters), AC voltage conditioning is generally adopted by many manufacturers. Although the insulation performance is enhanced easily with AC Voltage conditioning, it has limitations when high recovery voltage is required due to high voltage rate or capacitive current switching. In particular, impurities such as oxides segregated on the electrode surface can be removed not by the energy level of the voltage conditioning but by the higher energy level achieved by the current conditioning process In this article, the current conditioning was carried out in various conditions and its validity was examined. The current conditioning was processed by changing the amplitude of applied current, arc time, the number of tests, and frequency. The insulation performance and the status of contact surface were checked as well. We concluded that as the applied charge quantity and the conditioning coverage area increase, the conditioning effect is much higher.

• 한국CDE학회논문집
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• 제19권4호
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• pp.434-442
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• 2014

Most manufacturing enterprises create CAD data as a result of the product/part design process; however, the CAD data is being utilized only for production activities. Besides the processes directly related to manufacturing such as design and production, the CAD data is an important resource that can be used in variety of services (e.g., catalog production and production manuals) for manufacturing enterprises. This study proposes a software platform that can support a wide range of services for manufacturing companies in an efficient and productive way. The software platform was designed based on the functions identified by requirement analysis. The platform consists of four layers: data model layer to manage relevant data; library layer and common function layer to configure services; and application layer to install and run the software. Finally, this study evaluates the validity of the proposed platform architecture by applying it to the digital catalog system.

• 대한산업공학회지
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• 제43권1호
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• pp.49-61
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• 2017

This paper proposes an R&D project selection methodology for green technology centered on developing country-oriented technology commercialization. Eight selection criteria are derived from the R&BD logic model : technology needs of developing countries, effectiveness of green technology, technological potentials, domestic technological capability, commercialization feasibility, economic benefits, business feasibility, and spillover effects of developing countries. 21 qualitative and quantitative indicators are then defined for each criterion. The analytic hierarchy process is conducted to produce relative importance of evaluation indicators and to set final priority scores of R&D project candidates. The working of the proposed methodology is provided with the help of a case study example of Green Technology Center. The proposed methodology is expected to be effectively utilized for policy practices of R&D project selection in the field of green technology.

• 한국분말재료학회지
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• 제27권3호
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• pp.256-267
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• 2020

Metal additive manufacturing (AM) technologies are classified into two groups according to the consolidation mechanisms and densification degrees of the as-built parts. Densified parts are obtained via a single-step process such as powder bed fusion, directed energy deposition, and sheet lamination AM technologies. Conversely, green bodies are consolidated with the aid of binder phases in multi-step processes such as binder jetting and material extrusion AM. Green-body part shapes are sustained by binder phases, which are removed for the debinding process. Chemical and/or thermal debinding processes are usually devised to enhance debinding kinetics. The pathways to final densification of the green parts are sintering and/or molten metal infiltration. With respect to innovation types, the multi-step metal AM process allows conventional powder metallurgy manufacturing to be innovated continuously. Eliminating cost/time-consuming molds, enlarged 3D design freedom, and wide material selectivity create opportunities for the industrial adoption of multi-step AM technologies. In addition, knowledge of powders and powder metallurgy fuel advances of multi-step AM technologies. In the present study, multi-step AM technologies are briefly introduced from the viewpoint of the entire manufacturing lifecycle.

• Journal of Information Technology Applications and Management
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• 제19권4호
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• pp.1-18
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• 2012

This paper identifies technology trends of national research and development (national R&D) by exploiting Korean national R&D patents, ranging from 2007 to 2010. In this paper, co-word analysis (CWA), which is a method to identify the relationship among technology terms by using their co-occurrences, is incorporated into network analysis to visualize the relationships among technology keywords of national R&D patents and calculate network indexes concerning inter-relationship diversity and strength of technology keywords. As a result, this research found that inter-relationship among technology keywords in national R&D are getting increasingly strengthening in an overall sense. In addition, the keyword inter-relationship diversity-strength map proposed in this paper revealed some significant technological keywords of national R&D : core technology keywords including "sensor", "film" and "fuel" and emerging keywords including "biosensor" and "thermoelectric". Because the proposed approach helps identify interdisciplinary trends of technology keywords from a massive volume of national R&D patents in a visual and quantitative way, we expect that the approach can be incorporated as a preliminary into the R&D planning process to assist R&D policy makers to understand technology convergence of national R&D and develop relevant R&D policies.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2004년도 하계학술발표 논문집
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• pp.96-96
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• 2004

• 한국진공학회:학술대회논문집
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• 한국진공학회 2011년도 제41회 하계 정기 학술대회 초록집
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• pp.361-361
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• 2011

Cu(InGa)(SeS2) (CIGS) thin film solar cells have recently reached an efficiency of 20%. Recent studies suggest a double graded band gap structure of the CIGS absorber layer to be a key issue in the production of high efficiency thin film solar cell using by sputtering process method. In this study, Cu(InGa)(SeS2) absorbers were manufactured by selenization and surfulization, we have deposited CIG precusor by sputtering and Se layer by evaporation before selenization. The objective of this study is to find out surfulization effects to improve Voc and to compare with non-surfulization Cu(InGa)Se2 absorbers. Even if we didn't analysis Ga depth profile of Cu(InGa)(SeS2) absorbers, we confirmed increasing of Eg and Voc through surlization process. In non-surfulization Cu(InGa)Se2 absorbers, Eg and Voc are 0.96eV and 0.48V. Whereas Eg and Voc of Cu(InGa)(SeS2) absorbers are 1.16eV and 0.57V. And the efficiency of 9.58% was achieved on 0.57cm2 sized SLG substrate. In this study, we will be discussed to improve Eg and Voc through surfulization and the other method without H2S. gas.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2007년도 하계학술대회 논문집 Vol.8
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• pp.502-502
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• 2007

Current thin film process using memory device fabrication process use expensive processes such as manufacturing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as PCB, FCPB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line for the electronic circuit board using metal ink contains Ag nano-particles. Metal lines are fabricated by two types of printing methods. One is a conventional printing method which is able to quick fabrication of fine pattern line, but has various difficulties about thick and high resolution DPI(Dot per Inch) pattern lines because of bulge and piling up phenomenon. Another(Second) methods is sequential printing method which has a various merits of fabrication for fine, thick and high resolution pattern lines without bulge. In this work, conductivities of metal pattern line are investigated with respect to printing methods and pattern thickness. As a result, conductivity of thick pattern is about several un.

• 한국전기전자재료학회논문지
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• 제26권7호
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• pp.555-562
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• 2013

The new recycling technology for aged aluminum wires in overhead conductor has been carried out. The authors are attempting to develop remanufacturing method for them for more effective way of recycling in stead of its conventional remelting process. The new recycling technology for aged aluminum wire in overhead conductor was composed of four steps in different develop process, destranding process for conductor, surface cleaning process, welding process and drawing process for aluminum wire. This paper investigates the properties during recycle process of aged aluminum wire. The results of microscopic analysis and mechanical properties were discussed to underscore recycling aluminum wire. Various graphs are presented accompanied by discussion about their relevance on the process. In conclusion, we confirmed the possibility of remanufacturing technique by using new process.

• 전자통신동향분석
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• 제35권7호
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• pp.36-45
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• 2020

The method and process of research and development (R&D) is changing when we develop artificial intelligence (AI), and the way R&D results are dispersed is also changing. For the R&D process, using and participating in open-source ecosystems has become more important, so we need to be prepared for open source. For product and service development, a combination of AI algorithm, data, and computing power is needed. In this paper, we introduce ETRI AI Strategy #4, "Expanding AI Open Platform." It consists of two key tasks: one to build an AI open source platform (OSP) to create a cooperative AI R&D ecosystem, and another to systematize the "x+AI" open platform (XOP) to disperse AI technologies into the ecosystem.