• Title/Summary/Keyword: R%26D Process

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The Cold Welding Properties for Al Wire of Aged Overhead Conductor (폐가공송전선 Al선재 냉간접합 특성)

  • Kim, Shang-Shu;Ku, Jae-Kwan;Lee, Young-Ho;Kim, Byung-Geol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.5
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    • pp.415-420
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    • 2013
  • The new recycling technology for aged Aluminum wires in overhead conductor have been carried out. We are attempting to develop remanufacturing method for them for more effective way of recycling in stead of its conventional remelting process. The weld of aged aluminum wires play a vital role in remanufacture process. The paper investigates the mechanical properties during cold welding process of aged Aluminum wire. The tensile tests and microscopic analysis results are discussed to underscore the hardening features of welded aluminum wire. Various graphs are presented accompanied by discussion about their relevance on the process.

Manufacturing Process Improvement of Electrode for PEMFC (공정 효율 향상을 위한 연료전지전극 개발)

  • PARK, SEOK JUNG;LEE, JAE SEUNG;LEE, KI SUB;ROH, BUM WOOK
    • Transactions of the Korean hydrogen and new energy society
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    • v.26 no.6
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    • pp.547-553
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    • 2015
  • For commercialization of fuel cell electric vehicles, one of the key objectives is to reduce cost of full stack assembly. Regarding Membrane Electrode Assembly, the major issue is to improve fuel cell activation process in the initial Hydrogen Oxidation Reaction and Oxygen Reduction Reaction. In this research, the VD (Vacuum Drying) process has been developed for improvement of activation process. The VD condition is developed by controlling the temperature and degree of vacuum to remove the remaining solvent of electrode. Consequently, the electrode applied to VD process showed the low characteristics such as 3.5% of remaining solvent content and the improved efficiency such as 15% of activation process speed.

Electrical Property Evaluation of Printed Copper Nano-Ink Annealed with Infrared-Lamp Rapid Thermal Process (적외선 램프를 이용하여 소결한 구리 나노잉크의 전기적 특성 평가에 관한 연구)

  • Han, Hyun-Suk;Kim, Changkyu;Yang, Seung-Jin;Kim, Yoon-Hyun
    • Korean Journal of Materials Research
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    • v.26 no.4
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    • pp.216-221
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    • 2016
  • A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

The Recycling Technology for Aged Aluminum Wire in Overhead Conductor (폐가공송전선 Al선재 재활용 기술개발)

  • Kim, Shang-Shu;Ku, Jae-Kwan;Lee, Young-Ho;Kim, Byung-Geol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.7
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    • pp.555-562
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    • 2013
  • The new recycling technology for aged aluminum wires in overhead conductor has been carried out. The authors are attempting to develop remanufacturing method for them for more effective way of recycling in stead of its conventional remelting process. The new recycling technology for aged aluminum wire in overhead conductor was composed of four steps in different develop process, destranding process for conductor, surface cleaning process, welding process and drawing process for aluminum wire. This paper investigates the properties during recycle process of aged aluminum wire. The results of microscopic analysis and mechanical properties were discussed to underscore recycling aluminum wire. Various graphs are presented accompanied by discussion about their relevance on the process. In conclusion, we confirmed the possibility of remanufacturing technique by using new process.

The Drawing Properties of Aluminum Wire in Aged Overhead Conductor (폐가공송전선용 Al선재의 신선가공 특성)

  • Kim, Shang-Shu;Ku, Jae-Kwan;Lee, Young-Ho;Kim, Byung-Geol
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.6
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    • pp.482-487
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    • 2013
  • The new recycling technology for aged aluminum wires in overhead conductor have been carried out. We are attempting to develop remanufacturing method for them for more effective way of recycling in stead of its conventional remelting process. The drawing process of aged aluminum wires play a role in remanufacture process. Drawing process was performed under lubricant. The speed of drawing was between 500 m/min and 1,000 m/min. These machines have 11 or 12 dies house for breakdown of the feedstock. Material of the die is tungsten carbide and they have generally 25% reduction ratio. The paper investigates the mechanical properties during drawing process of aged aluminum wire. The results of tensile tests and microscopic analysis were discussed to underscore the hardening features of drawing aluminum wire. Various graphs are presented accompanied by discussion about their relevance on the process.

Effects of Foreign Investor Ownership on a Firm's Innovation Process: A Focus on Business-Group Affiliation in Korea

  • Il-Hang Shin;Han-Sol Lee
    • Journal of Korea Trade
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    • v.26 no.7
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    • pp.19-42
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    • 2022
  • Purpose - This study investigates the effects of foreign investor ownership on firm innovation and the different stages of the firm innovation process for business group affiliation (affiliated firms) and nonaffiliated firms. Design/methodology - Research and development (R&D) intensity is used as a proxy for firm innovation. We use a sample of 7,655 firm-year observations of Korean listed firms from 2001 to 2015. To identify the distinct features of business group affiliation and how foreign investor ownership affects firm innovation, we divide the sample into affiliated and non-affiliated firms. Moreover, we classify total R&D expenditures as research and development expenditures. Findings - This study finds a positive relationship between foreign investor ownership and innovation in non-affiliated firms. However, the foreign investor ownership's role in facilitating firm innovation does not influence business group affiliation. Moreover, the results show that foreign investor ownership encourages firms to increase research expenditures, which is the amount spent in the early stages of a firm's R&D process. Originality/value - Existing studies have overlooked the distinct features of business group affiliation and the different characteristics of research and development expenditures. Thus, this study considers the distinct features of business group affiliation and investigates how foreign investor ownership affects different stages of R&D activities.

Characterization and Formation Mechanism of Zr-Cu and Zr-Cu-Al Metallic Glass Thin Film by Sputtering Process

  • Lee, Chang-Hun;Sun, Ju-Hyun;Moon, Kyoung-Il;Shin, Seung-Yong
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.271-272
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    • 2012
  • Bulk Metallic Glasses (BMGs or amorphous alloy) exhibit high strength and good corrosion resistance. Applications of thin films and micro parts of BMGs have been used a lot since its inception in the research of BMGs. However, Application and fabrication of BMGs are limited to make structural materials. Thin films of BMGs which is sputtered on the surface of structural materials by sputtering process is used to improve limits about application of BMGs. In order to investigate the difference of properties between designed alloys and thin films, we identified that thin films deposited on the surface that have the characteristic of the amorphous films and the composition of designed alloys. Zr-Cu (Cu=30, 35, 38, 40, 50 at.%) and Zr-Cu-Al (Al=10 at.% fixed, Cu=26, 30, 34, 38 at.%) alloys were fabricated with Zr (99.7% purity), Cu (99.997% purity), and Al (99.99% purity) as melting 5 times by arc melting method before rods 2mm in diameter was manufactured. In order to analyze GFA (Glass Forming Ability), rods were observed by Optical Microscopy and SEM and $T_g$, $T_x$, ($T_x$ is crystallization temperature and $T_g$ is the glass transition temperature) and Tm were measured by DTA and DSC. Powder was manufactured by Gas Atomizer and target was sintered using powder in large supercooled liquid region ($=T_x-T_g$) by SPS(Spark Plasma Sintering). Amorphous foil was prepared by RSP process with 5 gram alloy button. The composition of the foil and sputtered thin film was analyzed by EDS and EPMA. In the result of DSC curve, binary alloys ($Zr_{62}Cu_{38}$, $Zr_{60}Cu_{40}$, $Zr_{50}Cu_{50}$) and ternary alloys ($Zr_{64}Al_{10}Cu_{26}$, $Zr_{56}Al_{10}Cu_{34}$, $Zr_{52}Al_{10}Cu_{38}$) have $T_g$ except for $Zr_{70}Cu_{30}$ and $Zr_{60}Al_{10}Cu_{30}$. The compositions with $T_g$ made into powders. Figure shows XRD data of thin film showed similar hollow peak.

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Gap-Fill Characteristics and Film Properties of DMDMOS Fabricated by an F-CVD System

  • Lee, Woojin;Fukazawa, Atsuki;Choa, Yong-Ho
    • Korean Journal of Materials Research
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    • v.26 no.9
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    • pp.455-459
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    • 2016
  • The deposition process for the gap-filling of sub-micrometer trenches using DMDMOS, $(CH_3)_2Si(OCH_3)_2$, and $C_xH_yO_z$ by flowable chemical vapor deposition (F-CVD) is presented. We obtained low-k films that possess superior gap-filling properties on trench patterns without voids or delamination. The newly developed technique for the gap-filling of submicrometer features will have a great impact on IMD and STI for the next generation of microelectronic devices. Moreover, this bottom up gap-fill mode is expected to be universal in other chemical vapor deposition systems.

Research and Development Methodology for Practical Use of Accident Tolerant Fuel in Light Water Reactors

  • Kurata, Masaki
    • Nuclear Engineering and Technology
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    • v.48 no.1
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    • pp.26-32
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    • 2016
  • Research and development (R&D) methodology for the practical use of accident tolerant fuel (ATF) in commercial light water reactors is discussed in the present review. The identification and quantification of the R&D-metrics and the attribute of candidate ATF-concepts, recognition of the gap between the present R&D status and the targeted practical use, prioritization of the R&D, and technology screening schemes are important for achieving a common understanding on technology screening process among stakeholders in the near term and in developing an efficient R&D track toward practical use. Technology readiness levels and attribute guides are considered to be proper indices for these evaluations. In the midterm, the selected ATF-concepts will be developed toward the technology readiness level-5, at which stage the performance of the prototype fuel rods and the practicality of industrial scale fuel manufacturing will be verified and validated. Regarding the screened-out concepts, which are recognized to have attractive potentials, the fundamental R&D should be continued in the midterm to find ways of addressing showstoppers.

A Study on the Investment Strategy of the IT R&D using Portfolio Analysis and AHP Method (포트폴리오 분석과 계층화분석기법(AHP)을 활용한 정부 IT분야 연구개발 투자 전략 연구)

  • Kim, Yun-Jong;Jung, Uk;Yim, Seong-Min;Jeong, Sang-Ki
    • Korean Management Science Review
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    • v.26 no.1
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    • pp.37-51
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    • 2009
  • Korean IT industry has been given much weight in national R&D management. A negative side of this fact is that Korean economy is likely to become vulnerable to a condition of the export business in certain items of IT industry which has a serious influence on the national economy. A customized investment strategy through the analysis of technology competitiveness and R&D status in each technology of IT field is required in order to rectify the structural vulnerability and pursue a continuous growth. In this research, a strategic direction to set up an efficient investment strategy is presented. In this process, it draws a portfolio analysis with two axes of technology level and technology life cycle. It also derives a priority order of the national investment considering the degree of technological impact, marketability, and adequacy of public support from AHP (Analytic Hierarchy Process) method by a survey of IT experts. A portfolio analysis in the prior stage helps the respondents in AHP become more familiar with the alternatives' characteristics so that their decision making process more corresponds with national R&D strategies.