• 공업화학
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• 제19권4호
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• pp.382-387
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• 2008

착체중합법을 이용하여 $Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ 조성의 산화물을 합성하였으며, 합성된 분말은 압축 성형 후 $1080^{\circ}C$에서 소결하여 치밀한 페롭스카이트 분리막을 제조하였다. 밀봉 재료로 gold ring, Pyrex ring 및 Pyrex 분말을 사용하여 가스누출 실험을 수행하였다. $Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ 분리막의 산소투과량 분석결과 온도가 증가함에 따라 산소투과량은 증가하였고, $900^{\circ}C$에서 $0.74mL/min{\cdot}cm^2$의 값을 나타내었다. $950^{\circ}C$에서 밀봉 재료에 따른 투과 특성 분석 결과, gold ring을 이용할 경우 높은 산소투과량을 보인 반면, Pyrex를 밀봉재로 사용할 경우 낮은 투과량을 보였다. 이는 Pyrex를 밀봉재로 이용할 경우 분리막 표면으로 유리가 침투하여 유효 산소투과면적을 감소시켰기 때문이며, 광화학 현미경 분석으로 Pyrex 유리의 확산 침투를 확인하였다.

• 한국광학회지
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• 제9권3호
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• pp.156-161
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• 1998

에어로졸 화염증착법을 개발하고 이 방법을 써 실리콘 기판 위에 Pyrex 무응력 도피박막으로 제작하였다. 파이렉스 도파 박막계의 굴절률은 조절하기 위하여 지르코늄을 첨가하였으며, 지르코늄 함량이 0wt%부터 3wt5까지 변하는 경우 굴절률이 1.460부터 1.475까지 변화하였다. 파이렉스 도파로의 평판도파로형 광증폭기에 응용 가능성을 보기 위하여 어븀을 첨가하여보았으며 어븀 함량이 0wt%부터 1wt% 까지 변하는 경우 박막의 굴절률이 1.460부터 1.465 까지 변화함을 확인하였다. 프리즘 커플러를 써서 제작된 도피피막에 과을 여기시킨 결과 광집적회로에 응용이 가능한 수준의 투과성이 우수한 박막임을 확인하였다. 파이렉스 도피피막의 편광 변화에 따른 박막굴절률의 변화는 2$\times$104이하로 측정되었다.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 2002년도 추계학술대회 논문집
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• pp.268-273
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• 2002

The mechanical etching technique has recently been developed to a powder blasting technique for various materials, capable of producing micro structures larger than 100$\mu\textrm{m}$. This paper describes the performance of powder blasting technique in micromachining of pyrex for the accelerometer sensor and the effect of the number of nozzle scanning and the stand-off distance on the erosion depth.

• 한국기계가공학회지
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• 제11권5호
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.471-472
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• 2012

• 한국정밀공학회지
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• 제23권2호
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• pp.146-153
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• 2006

Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 하계학술대회 논문집 Vol.7
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1995년도 하계학술대회 논문집 C
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• pp.1422-1424
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• 1995

In this paper, a pyrex glass is machined using Electric Discharge Machining. In order to fabricate the desired shape, the process conditions are optimized appropriatley. This paper shows that the applied voltage and the concentration of electrolytic solution significantly affect the size and shape of the hole in the pyrex glass. As the applied voltage grows, the size of the hole increases but the shape is little affected.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.628-631
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• 2003

This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2005년도 추계학술대회 논문집
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• pp.182-185
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• 2005

Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.