• Applied Chemistry for Engineering
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• v.19 no.4
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• pp.382-387
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• 2008

$Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ oxide was synthesized by polymerized complex method. Dense membrane of perovskite oxide was prepared using as-prepared powder by pressing and sintering at $1080^{\circ}C$. Leakage test was conducted on the membrane sealed by gold ring, Pyrex ring or Pyrex powder as a sealing material. The oxygen permeation flux of $Ba_{0.5}Sr_{0.5}Co_{0.8}Fe_{0.2}O_{3-{\delta}}$ membrane increased with increasing temperature and was $0.74mL/min{\cdot}cm^2$ at $900^{\circ}C$. In the case of the membrane applied by sealing material, oxygen permeation flux of the membrane using gold ring at $950^{\circ}C$ was higher than that using Pyrex materials because the undesired spreading of Pyrex glass materials in the membrane led to the reduction of effective permeation area. Microphotograph analysis results for the membrane after permeation test confirmedthe diffusion of Pyrex glass seal into the membrane.

• Korean Journal of Optics and Photonics
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• v.9 no.3
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• pp.156-161
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• 1998

We developed aerosol flame deposition method and made stress-free Pyrex-based optical waveguide on silicon substrate using this method. Zr is doped to control the refractive index of Pyrex waveguide layers. The refractive index of the film changes from 1.460 to 1.475 as the content of Zr changes from 0 to 3 wt%. Er is doped to see the possibility of applying this Pyrex waveguide as PLC-type (Planar Lightwave Circuit) optical amplifier. The refractive index of the film changes from 1.460 to 1.465 as the content of Zr changes from 0 to 1 wt%. Light launching using a prism coupler to the fabricated waveguide showed good quality for application to PLC. The polarization dependence of refractive-index of the Pyrex film is measured to be less than $2{\times}10^{-4}$.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2002.10a
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• pp.268-273
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• 2002

The mechanical etching technique has recently been developed to a powder blasting technique for various materials, capable of producing micro structures larger than 100$\mu\textrm{m}$. This paper describes the performance of powder blasting technique in micromachining of pyrex for the accelerometer sensor and the effect of the number of nozzle scanning and the stand-off distance on the erosion depth.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.11 no.5
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• pp.99-103
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• 2012

Presently, A glass is widely used in telecommunication system, optoelectronic devices and micro electro mechanical systems. Micro drilling of glass using the laser can save processing cost and improve the accuracy. This paper experiments micro drilling using KrF excimer laser on the pyrex glass of $500{\mu}m$ thickness. We have experiment to find out optimum laser machining conditions of micro drilling of glass and ablation depth and influence by processing parameter suc'h pulse repetition rate, energy density and number of pulses. Pulse repetition rate don't influence ablation depth at the micro drilling of pyrex glass. Energy density influence micro drilling of parallelism and maximum thickness that can be drilled. Ablation depth is most influenced by number of pulses.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2012.05a
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• pp.471-472
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• 2012

• Journal of the Korean Society for Precision Engineering
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• v.23 no.2 s.179
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• pp.146-153
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• 2006

Acceleration sensors have widely been used in the various fields of industry. In recent years, micromachining accelerometers have been developed and commercialized by the micromachining technique or MEMS technique. Typical structure of such sensors consist of a cantilever beam and a vibrating mass fabricated on Si wafers using etching. This study investigates the feasibility of powder blasting technique for microfabrication of sensor structures made of the pyrex glass alternating the existing Si based acceleration sensor. First, as preliminary experiment, effect of blasting pressure, mass flow rate of abrasive and no. of nozzle scanning on erosion depth of pyrex and soda lime glass is studied. Then the optimal blasting conditions are chosen for pyrex sensor. Structure dimensions of designed glass sensor are 2.9mm and 0.7mm for the cantilever beam length and width and 1.7mm for the side of square mass. Mask material is from aluminium sheet of 0.5mm in thickness. Machining results showed that tolerance errors of basic dimensions of glass sensor ranged from 3um in minimum to 20um in maximum. This results imply the powder blasting can be applied for micromachining of glass acceleration sensors alternating the exiting Si based sensors.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.374-375
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• 2006

This paper describes anodic bonding characteristics of MCA to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with the same properties were deposited on MCA under optimum RF sputter conditions (Ar 100 %, input power $1\;W/cm^2$). After annealing at $450^{\circ}C$ for 1 hr, the anodic bonding of MCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in $110^{-6}$ Torr vacuum condition. Then, the MCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation and simulation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity being 0.05-0.08 %FS. Moreover, any damages or separation of MCNSi bonded interfaces did not occur during actuation test. Therefore, it is expected that anodic bonding technology of MCNSi-wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Proceedings of the KIEE Conference
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• 1995.07c
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• pp.1422-1424
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• 1995

In this paper, a pyrex glass is machined using Electric Discharge Machining. In order to fabricate the desired shape, the process conditions are optimized appropriatley. This paper shows that the applied voltage and the concentration of electrolytic solution significantly affect the size and shape of the hole in the pyrex glass. As the applied voltage grows, the size of the hole increases but the shape is little affected.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.628-631
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• 2003

This study describes a new mastless nano-fabrication technique of Pyrex 7740 glass using the combination of nanomachining by nano-indenter XP and HF wet etching. First, the surface of a Pyrex 7740 glass specimen was machined by using the nano-machining system, which utilizes the mechanism of the nano-indenter XP. Next, the specimen was etched by HF solution. After the etching process, the convex structure or deeper hole is made because of masking or promotion effect of the affected layer generated by nano-machining. On the basis of this interesting fact. some sample structures were fabricated.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.182-185
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• 2005

Indentation pattern and line pattern were machined on borosilicate(Pyrex 7740 glass) surface using the combination of mechanical machining by $Nanoi-indenter\circledR$ XP and HF wet etching, and a etch-mask effect of the affected layer of the nano-scratched and indented Pyrex 7740 glass surface was investigated. In this study, effects of indentation and scratch process with etching time on the morphologies of the indented and scratched surfaces after isotropic etching were investigated from an angle of deformation energies.