• Title/Summary/Keyword: Pure lead

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Structural, Dielectric and Field-Induced Strain Properties of La-Modified Bi1/2Na1/2TiO3-BaTiO3-SrZrO3 Ceramics

  • Hussain, Ali;Maqbool, Adnan;Malik, Rizwan Ahmed;Zaman, Arif;Lee, Jae Hong;Song, Tae Kwon;Lee, Jae Hyun;Kim, Won Jeong;Kim, Myong Ho
    • Korean Journal of Materials Research
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    • v.25 no.10
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    • pp.566-570
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    • 2015
  • $Bi_{0.5}Na_{0.5}TiO_3$ (BNT) based ceramics are considered potential lead-free alternatives for $Pb(Zr,Ti)O_3$(PZT) based ceramics in various applications such as sensors, actuators and transducers. However, BNT-based ceramics have lower electromechanical performance as compared with PZT based ceramics. Therefore, in this work, lead-free bulk $0.99[(Bi_{0.5}Na_{0.5})_{0.935}Ba_{0.065}]_{(1-x)}La_xTiO_3-0.01SrZO_3$ (BNBTLax-SZ, with x = 0, 0.01, 0.02) ceramics were synthesized by a conventional solid state reaction The crystal structure, dielectric response, degree of diffuseness and electric-field-induced strain properties were investigated as a function of different La concentrations. All samples were crystallized into a single phase perovskite structure. The temperature dependent dielectric response of La-modified BNBT-SZ ceramics showed lower dielectric response and improved field-induced strain response. The field induced strain increased from 0.17%_for pure BNBT-SZ to 0.38 % for 1 mol.% La-modified BNBT-SZ ceramics at an applied electric field of 6 kV/mm. These results show that La-modified BNBT-SZ ceramic system is expected to be a new candidate material for lead-free electronic devices.

Design of Guidance Law for Docking of Unmanned Surface Vehicle (무인선의 도킹을 위한 유도법칙 설계)

  • Woo, Joohyun;Kim, Nakwan
    • Journal of Ocean Engineering and Technology
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    • v.30 no.3
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    • pp.208-213
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    • 2016
  • This paper proposes a potential field-based guidance law for docking a USV (unmanned surface vehicle). In most cases, a USV without side thrusters is an under-actuated system. Thus, there are undockable regions near docking stations where a USV cannot dock to a docking station without causing a collision or backward motion. This paper suggest a guidance law that prevents a USV from enter such a region by decreasing the lateral error to the docking station at the initial stage of the docking process. A Monte-carlo simulation was performed to validate the performance of the proposed method. The proposed method was compared to conventional guidance laws such as pure pursuit guidance and pure/lead pursuit guidance. As a result, the collision angle and lateral distance error of proposed method tended to have lower values compared to conventional methods.

Chemical Properties and Dissolution Technology of Platinum Group Metals in Solutions (용액(溶液)에서 백금족(白金族) 금속(金屬)의 화학적(化學的) 특성(特性) 및 용해기술(溶解技術))

  • Lee, Man-Seung
    • Resources Recycling
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    • v.19 no.5
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    • pp.3-12
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    • 2010
  • Platinum group metals with high purity are important raw materials for high technology industry. Since there are no domestic ores containing PGMs, it is of importance to develop a separation process by which ultra pure PGMs can be recovered from diverse spent resources. Data on the chemical properties and dissolution behavior of PGMs were obtained from the literature. A method for the thermodynamic analysis of the HCl solution with chlorine gas was introduced. Utilizing the difference in the chemical properties and dissolution behavior of PGMs would lead to an efficient separation process to recover ultra pure PGMs.

The Change of Dielectric Constant and Leakage Current of PVA (polyvinyl alchol) by Increasing Temperature and Concentration

  • Lee, Tae-Ho;Jang, Jae-Ho;Nam, Ho-Seong;Jo, Han-Na;No, Yong-Han
    • Proceedings of the Korean Vacuum Society Conference
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    • 2014.02a
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    • pp.388.1-388.1
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    • 2014
  • The performance of PVA(polyvinyl alchol) is better than another organic dielectric material. Therefore, PVA has been researched for organic and in-organic dielectric material. But research of changing PVA's dielectric constant and leakage current by increasing temperature and concentration was insigificant. We try to find pure PVA and cross-linked PVA's characteristic of dielectric by changing temperature and concentration. 5/10/15wt% PVA concentration (5% interval) was in progress, PVA at $100/150/200/250^{\circ}C$ ($50^{\circ}C$ interval) of experiments was conducted in relation to temperature. The higher the concentration, leakage currents decrease, and dielectric constant is increased. With regard to temperature, we could not see a big change of leakage current and dielectric constant of pure PVA until $200^{\circ}C$. However, we could see a tendency to increase significantly at $250^{\circ}C$. Also, leakage current and dielectric constant of cross-linked PVA gradually increased from at $100^{\circ}C$ to $200^{\circ}C$ and then sharply increased from at $250^{\circ}C$. We tried to find that PVA's inner bonds(hydroxyl group (OH-) lead to the results.

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Characteristics of Electroplated Sn-2.5Cu Alloy Layers for Surface Finishing (표면마무리를 위한 Sn-2.5Cu 합금 도금막의 특성)

  • Kim, Ju-Youn;Bae, Kyoo-Sik
    • Korean Journal of Materials Research
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    • v.13 no.2
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    • pp.133-136
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    • 2003
  • Sn-2.5Cu alloy layers were deposited on the Alloy 42 lead-frame substrates by the electroplating method, and their microstructures, adhesion strength, and electrical resistivity were measured to evaluate the applicability of Sn-Cu alloy as a surface finishing material of electronic parts. The Sn-2.5Cu layers were electroplated in the granular form, and composed of pure Sn and Cu$_{6}$Sn$_{5}$ intermetallic compound. Surfaces of the electroplated Sn-2.5Cu layers were rather rough and also the thickness variance was large. The adhesion strength of the Sn-2.5Cu electroplated layers was highly comparable to that of the electroplated Cu alloy layer and the electrical conductivity was about 10 times higher than the pure Sn. After the 20$0^{\circ}C$ 30 min. annealing of the electroplated Sn-2.5Cu layers, the surface roughness was reduced, and adhesion strength and conductivity were improved. These results showed the Sn-Cu alloys can be used as an excellent surface finishing material.ial.

Thermal conductivity and properties of sheath alloy for High-$T_c$ superconductor tape (고온초전도 선재용 피복합금의 열전도도 측정 및 특성평가)

  • 박형상;지봉기;김중석;임준형;오승진;오승진;주진호;나완수;유재무
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.13 no.8
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    • pp.711-717
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    • 2000
  • Effect of alloying element additions to Ag on thermal conductivity electrical conductivity and mechanical properties of sheath materials for BSCCO tapes has been characterized. The thermal conductivity at low temperature range(10~300K) of Ag alloys were evaluated by both direct and indirect measurement techniques and compared with each other. It was observed that thermal conductivity decreased with increasing the content of alloying elements such as Au, Pd and Mg. Thermal conductivity of pure Ag at 30 K was measured to be 994.0 W/m.K on the other hand the corresponding values of A $g_{0.9995}$/M $g_{0.0005}$, A $g_{0.974}$/A $u_{0.025}$/M $g_{0.001}$, A $g_{0.973}$/Au.0.025//M $g_{0.002}$, and A $g_{0.92}$/P $d_{0.06}$/M $g_{0.02}$ were 342.6, 62.1, 59.2, 28.9 W/m.K respectively indicating 3 to 30 times lower than that of pure Ag. In addition alloying element additions to Ag improved mechanical strength while reduced elongation probably due to the strengthening mechanisms by the presence of additive atoms.s.

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A Study of $SrTiO_3$ Synthesis by Direct Wet Process ($SrTiO_3$의 습식 직접 합성법)

  • 이종근;이경희;이병하
    • Journal of the Korean Ceramic Society
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    • v.21 no.2
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    • pp.165-173
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    • 1984
  • It is desirable to establish reliable synthetic methods for electro-ceramic materials. To synthesize $SrTiO_3$ in this study direct solid state reactions and wet chemical processes were used. Previous study of $SrTiO_3$ synthesis included oxalated-method($SrTiO(C_2O_4)_2$.$4H_2O$) co-precipitation$(SrCO_3+TiO(OH)_2)$ and direct solid state reaction$(SrCO_3+TiO(OH)_2)$ The methods in question lead to intermediate inclusion during the reactions and less controllable in particle sizes of $SrTiO_3$. To obtain highly pure $SrTiO_3$ so-called "direct wet process method" was added in this investigation. In the study the "direct wet process" was for the first time applied to synthesize chemically pure and fine particle $SrTiO_3$. $SrCl_2$ and $TiCl_4$<\ulcornerTEX> at KOH solution at room temperature to 10$0^{\circ}C$ precipitated $SrTiO_3$ The particle size increased as temperature increased.mperature increased.

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Electroconductive Graphene-Combined Polycaprolactone Electrospun Films for Biological Applications (생체적 적용을 위한 전기전도성을 갖는 그래핀과 폴리카프로락톤 복합물질 전기방사 섬유형 필름)

  • Oh, Jun-Sung;Lee, Eun-Jung
    • Korean Journal of Materials Research
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    • v.31 no.5
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    • pp.278-285
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    • 2021
  • This study produces electroconductive polycaprolactone (PCL)-based film with different amounts of graphene (G) through electrospinning, and the characteristics of the produced G/PCL composites are investigated. The G/PCL results are analyzed by comparing them with those obtained using pure PCL electrospun film as a control. The morphology of electrospun material is analyzed through scanning electron microscopy and transmission electron microscopy. Mechanical and electrical properties are also evaluated. Composites containing 1 % graphene have the highest elongation rate, and 5 % samples have the highest strength and elasticity. Graphene contents > 25 % show electro-conductivity, which level improves with increase of graphene content. Biological characteristics of G/PCL composites are assessed through behavioral analysis of neural cell attachment and proliferation. Cell experiments reveal that compositions < 50 % show slightly reduced cell viability. Moreover, graphene combinations facilitated cell proliferation compared to pure PCL. These results confirm that a 25 % G/PCL composition is best for application to systems that introduce external stimuli such as electric fields and electrodes to lead to synergistic efficiency of tissue regeneration.

The Pathway and Characteristics for Decomposition of Fenitrothion by Zerovalent Iron (ZVI) (영가철에 의한 Fenitrothion의 분해 경로 및 특성)

  • Lee, Dong-Yoon;Moon, Byung-Hyun
    • Journal of Korean Society of Environmental Engineers
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    • v.33 no.3
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    • pp.157-161
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    • 2011
  • This study investigated decomposition the pathway and characteristics of fenitrothion, which is applied on the golf course for pesticide, by ZVI in batch reactor. The removal efficiencies of the pure fenitrothion and the commercial fenitrothion in Smithion by ZVI were compared. The fenitrothion was converted to 3-Methyl-4-nitrophenol and 4-Amino-m-cresol by ZVI. The fenitrothion decomposition rate by ZVI could be expressed by the first order reaction. As increasing the ZVI dosages, the first order rate constants and removal efficiencies increased. The surface area normalized rate constants for the pure fenitrothion and the commercial fenitrothion were 0.0398 and 0.1312 ($L/m^2{\cdot}hr$), respectively. The decomposition of the commercial fenitrothion in Smithion was faster than that of the pure fenitrothion by ZVI, the surfactant in Smithion lead to enhances solubility of fenitrothion and disperse ZVI.

Electrodeposited Tin Properties & Their Effect on Component Finish Reliability

  • Fusco Phil;Schetty Rob
    • Proceedings of the International Microelectronics And Packaging Society Conference
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    • 2004.09a
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    • pp.201-209
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    • 2004
  • As the European Community's Directive on the Restriction of Hazardous Substances in Electrical and Electronic Equipment banning lead (Pb) in electronics products will take effect on July 1, 2006, most electronics manufacturers will be commencing with volume production of Pb-free components by the middle of 2004. Electrodeposited pure tin finishes on electronic components are a leading contender to replace the industry standard tin-lead. Commensurate with this shift will be a somewhat steep learning curve as manufacturers adapt a variety of equipment and processes to contend with the issues surrounding this critical, industry-wide material conversion. Since the electrodeposited finish directly influences the critical reliability characteristics of the component itself, the nature of the Pb-free component finish must be well characterized and understood. Only through a thorough examination of the attributes of the electroplated tin deposit can critical decisions be made regarding component finish reliability. This paper investigates the properties of electrodeposited tin that may have an effect on component reliability, namely, grain structure (size and shape), oxide formation, tin whisker formation, and solderability. Data will be presented from laboratory and production settings, with the objective being to enable manufacturers to draw their own conclusions regarding previously established perceptions and misconceptions about electrodeposited tin properties.

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