In this paper, the creep characteristics of lead and lead-free solder joint were investigated using the QFP(Quad Flat Package) creep test. Two kind of solder pastes(Sn-3Ag-0.5Cu, Sn-0.2Sb-0.4Ag-37.4Pb) were applied to the QFP solder joints and each specimen was checked the external and internal failures(i.e., wetting failure, void, pin hole, poor-heel fillet) by digital microscope and X-ray inspection. The creep test was conducted at the temperatures of
The purpose of this study is to computerize the design of single source for a duct work system which is essential for the improvement of working places. There are different types of hood, such as general hood, push pull hood and canopy hood. And out of these three types, general hood and canopy hood were used as subjects of this study. The software used here was Quattro Pro 123 programm, and the hardware was IBM PS/SX(type 5510-SK4 S/N 83-05164). And the results are tabulated in