• Korean Journal of Materials Research
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• v.15 no.4
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• pp.233-239
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• 2005

In this study, the effects of Pd buffer layer on the oxidation resistance of Pt modified-pack aluminized Inconel 738LC, used for gas turbine, were investigated. Pd was electroplated on Inconel 738LC, and Pt was electroplated on the electroplated Pd surface. Thus, the thickness of electroplated Pt/Pd was $10\;{\mu}m$ and the atomic ratio of Pt : Pd was about 6 : 4. After Pt/Pd electroplating, Inconel 738LC was pack aluminized to form the oxidation resistant layer. To investigate the oxidation resistance of Pt/Pd modified-pack aluminized Inconel 738LC, iso-thermal oxidation and cyclic oxidation were performed. The iso-thermal oxdation and the cyclic oxidation data indicated that the Pt/Pd modified-pack aluminized Inconel 738LC was more oxidation resistant than the Pt modified-pack aluminized Inconel 738LC. It was thought that the difference of thermal expansion coefficient between Inconel 738LC and Pt was lowered by the Pd buffer layer.

• Korean Journal of Materials Research
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• v.17 no.5
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• pp.283-288
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• 2007

This study aimed to investigate the effects of the seed layer with copper electroplating on the surface morphology of copper foil. Three kinds of seed metal such as platinum, palladium, Pt-Pd alloy were used in this study. Electrodeposition was carried out with the constant current density of 200 $mA/cm^2$ for 68 seconds. Electrochemical experiments, in conjunction with SEM, XRD, AFM and four-point probe, were performed to characterize the morphology and mechanical characteristics of copper foil. Large particles were observed on the surface of the copper deposition layer when a copper foil was electroplated on the 130 nm thickness of Pd, Pt-Pd seed layer. However, a homogeneous surface, low resistivity was obtained when the 260 nm thickness of Pt, Pt-Pd alloy seed layer was used. The minimum value of resistivity was 2.216 ${\mu}{\Omega}-cm$ at the 260 nm thickness of Pt-Pd seed layer.

• Proceedings of the Membrane Society of Korea Conference
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• 1994.10a
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• pp.8-11
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• 1994

Disposal of hazardous ions in the aqueous streams is a significant industrial waste problem.. Waste streams from electronics, electroplating, and photographic industries contain metal ions such as copper, nickel, zinc, chromium(IV), cadmium, aluminum, silver, and gold, amongst others in various aqueous solutions such as sulfates, chlorides, fluorocarbons, and cyanides. Typical plating solutions having similar compositions are listed in Table 1. Spent process streams in catalyst manufacturing facilities also contain precious metals such as Ag, Pt, and Pd. Developing an effective recovery process of these metal ions for reuse is important.