• Journal of Information Display
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• 제10권4호
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• pp.180-183
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• 2009

A stamping-assisted rubbing technique for generating bidirectional alignment in the fabrication of wide-viewing twistednematic (TN) liquid crystal displays (LCDs) was developed. A patterned layer of a fluorinated acrylate polymer was transferred onto the first rubbed alignment layer prepared on a substrate by stamping. The fluorinated acrylate polymer provides a protective layer that covers the first alignment layer during the second rubbing process to facilitate the bidirectional alignment of the LC molecules. The LC cell in the twisted geometry with two bidirectional-alignment layers showed stable electro-optic properties and wide-viewing characteristics. The stamping-assisted rubbing technique serves as a mask-free alignment method of producing multidomains for wide-viewing LCDs.

• 한국세라믹학회지
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• 제37권9호
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• pp.887-893
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• 2000

중온형 고체산화물 연료전지용 금속접속자로서의 적용가능성을 알아보기 위하여 내산화막을 코팅한 Ferritic 스틸의 산화특성을 연구하였다. Ferritic 스틸은 고온산화로 형성된 산화크롬, 산화철막에 의해 시간에 따라 저항이 크게 증가함을 보였다. 반면, LMO 코팅한 Ferritic 스틸은 Ducrolloy와 같이 고온저항이 주기적인 증감을 보이면서 증가하지만 내산화막의 형성에 의해 80시간 이후에는 저항증가가 없어 정기 산화안정성을 보였다.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2009년도 9th International Meeting on Information Display
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• pp.262-264
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• 2009

Ternary oxides with controlled band gap energy and reduced reactivity against moisture and carbon dioxide gas were designed and studied as a potential material for protective layer of ac-PDPs. The results showed a significant reduction in firing voltage and improved environmental stability.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.434-437
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• 2005

Chemical Mechanical Polishing (CMP) has become an essential step in the overall semiconductor wafer fabrication technology. In general, CMP is a surface planarization method in which a silicon wafer is rotated against a polishing pad in the presence of slurry under pressure. The polishing pad, generally a polyurethane-based material, consists of polymeric foam cell walls, which aid in removal of the reaction products at the wafer interface. It has been found that the material removal rate of any polishing pad decreases due to the so-called 'pad glazing' after several wafer lots have been processed. Therefore, the pad restoration and conditioning has become essential in CMP processes to keep the urethane polishing pad at the proper friction coefficient and to allow effective slurry transport to the wafer surface. Diamond pad conditioner employs a single layer of brazed bonded diamond crystals. Due to the corrosive nature of the polishing slurry required in low pH metal CMP such as copper, it is essential to minimize the possibility of chemical interaction between very low pH slurry (pH <2) and the bond alloy. In this paper, we report an exceptional protective coated conditioner for in-situ pad conditioning in low pH Cu CMP process. The protective Cr-coated conditioner has been tested in slurry with pH levels as low as 1.5 without bond degradation.

• Tribology and Lubricants
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• 제33권6호
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• pp.275-281
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• 2017

In this work, we have fabricated anodic aluminum oxide (AAO) with ordered nanoscale porosity through an anodization process. We deposited gold and nano-organic thin films on the porous AAO surface to protect its structure and reduce friction. We investigated the tribological characteristics of the porous AAO with respect to the protective surface coatings using tribometers. While investigating the frictional characteristics of the samples by applying normal forces of the order of micro-Newton, we observed that AAO without a protective coating exhibits the highest friction coefficient. In the presence of protective surface coatings, the friction coefficient decreases significantly. We applied normal forces of the order of milli-Newton during the tribotests to investigate the wear characteristics of AAO, and observed that AAO without protective surface coatings experiences severe damage due to the brittle nature of the oxide layer. We observed the presence of several pieces of fractured particles in the wear track; these fractured particles lead to an increase in the friction. However, by using surface coatings such as gold thin films and nano-organic thin films, we confirmed that the thin films with nanoscale thickness protect the AAO surface without exhibiting significant wear tracks and maintain a stable friction coefficient for the duration of the tribotests.

• 한국진공학회지
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• 제15권4호
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• pp.395-403
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• 2006

[ $MgAl_2O_4$ ] 막은 MgO 보호막 보다 단단하며 수분 흡착 오염 문제에 상당히 강한 특성을 가진다. 본 연구에서 AC-PDP 의 유전체보호막으로 사용되는 MgO 보호막의 특성을 개선하기 위해 $MgAl_2O_4/MgO$ 이중층 보호막을 제작하여 특성을 조사하였다. 전자빔 증착기를 사용하여 Cu 기판에 MgO 와 $MgAl_2O_4$을 각각 $1000\AA$ 두께로 증착, $MgAl_2O_4/MgO$ 을 $200/800\AA$ 두께로 적층 증착 후, 이온빔에 의한 충전현상을 제거하기 위해 Al 을 $1000\AA$ 두께로 증착하였다. 집속 이온빔 (focused ion beam: FIB) 장치를 이용하여 10 kV 에서 14 kV 까지 이온빔 에너지에 따라 MgO는 $0.364{\sim}0.449$ 값의 스퍼터링 수율에서 $MgAl_2O_4/MgO$ 을 적층함으로 $24{\sim}30 %$ 낮아진 $0.244{\sim}0.357$ 값의 스퍼터링 수율이 측정되었으며, $MgAl_2O_4$는 가장 낮은 $0.088{\sim}0.109$ 값의 스퍼터링 수율이 측정되었다. g-집속이온빔 (g-FIB) 장치를 이용하여 $Ne^+$ 이온 에너지를 50 V 에서 200 V 까지 변화시켜 $MgAl_2O_4/MgO$ 와 MgO 는 $0.09{\sim}0.12$의 비슷한 이차 전자방출 계수를 측정하였다. AC- PDP 셀의 72 시간 열화실험 후 SEM 및 AFM으로 열화된 보호막의 표면을 관찰하여 기존의 단일 MgO 보호막과 $MgAl_2O_4/MgO$의 적층보호막의 열화특성을 살펴보았다.

• JSTS:Journal of Semiconductor Technology and Science
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• 제16권4호
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• pp.470-480
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• 2016

The reversal of a silicon chip to find out its security structure is common and possible at the present time. Thanks to reversing, it is possible to use a probing attack to obtain useful information such as personal information or a cryptographic key. For this reason, security-related blocks such as DES (Data Encryption Standard), AES (Advanced Encryption Standard), and RSA (Rivest Shamir Adleman) engines should be located in the lower layer of the chip to guard against a probing attack; in this regard, the addition of a silicon-surface-protection layer onto the chip surface is a crucial protective measure. But, for manufacturers, the implementation of an additional silicon layer is burdensome, because the addition of just one layer to a chip significantly increases the overall production cost; furthermore, the chip size is increased due to the bulk of the secure logic part and routing area of the silicon protection layer. To resolve this issue, this paper proposes a practical silicon-surface-protection method using a metal layer that increases the security level of the chip while minimizing its size and cost. The proposed method uses a shift register for the alternation and variation of the metal-layer data, and the inter-connection area is removed to minimize the size and cost of the chip in a more extensive manner than related methods.

• 한국세라믹학회지
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• 제37권3호
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• pp.263-270
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• 2000

The Pt/copper oxide/n-Si electrodes were fabricated by depositing copper oxide thin film of 500${\AA}$ and very thin Pt layer on the n-type (100) Si substrate. hotoelectrochemical properties and stability profiles of the electrodes were investigated as a function of deposition time of Pt layer. As the deposition time of Pt layer increased up to 10 seconds, the photocurrent and quantum efficiency were increased and then decreased with further depositing time. The better cell stability was observed for the electrode with longer deposition time. The improvements in above photoelectrochemical properties indicate that Pt layer acts as a catalyst layer at electrode/electrolyte interface as well as a protective layer. The decreasing tendency of the photocurrent and efficiency for the electrode with Pt layer deposited above 20 seconds was explained as an increases in probbility of electron-hole pair recombination and also the absorbing photon loss at electrode surface due to the excessive thickness of Pt layer. The results were confirmed by impedance spectroscopy, mutiple cycle voltammograms and microstructural analyses.

• Corrosion Science and Technology
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• 제6권6호
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• pp.291-296
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• 2007

The corrosion of metals and alloys in flowing liquids can be classified into uniform corrosion and localized corrosion which may be categorized as follows. (1) Localized corrosion of the erosion-corrosion type: the protective oxide layer is assumed to be removed from the metal surface by shear stress or turbulence of the fluid flow. A macro-cell may be defined as a situation in which the bare surface is the macro-anode and the other surface covered with the oxide layer is the macro-cathode. (2) Localized corrosion of the differential flow-velocity corrosion type: at a location of lower fluid velocity, a thin and coarse oxide layer with poor protective qualities may be produced because of an insufficient supply of oxygen. A macro-cell may be defined as a situation in which this surface is the macro-anode and the other surface covered with a dense and stable oxide layer is the macro-cathode. (3) Localized corrosion of the active/passive-cell type: on a metal surface a macro-cell may be defined as a situation in which a part of it is in a passivation state and another in an active dissolution state. This situation may arise from differences in temperature as well as in the supply of the dissolved oxygen. Compared to uniform corrosion, localized corrosion tends to involve a higher wall thinning rate (corrosion rate) due to the macro-cell current as well as to the ratio of the surface area of the macro-anode to that of the macro-cathode, which may be rationalized using potential vs. current density diagrams. The three types of localized corrosion described above can be reproduced in a Jet-in-slit test by changing the flow direction of the test liquid and arranging environmental conditions in an appropriate manner.

• Corrosion Science and Technology
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• 제16권5호
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• pp.257-264
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• 2017

Film of new Ti-15Zr-5Nb alloy formed during galvanic anodizing in orthophosphoric acid solution was characterized by optical microscope, scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), and Raman micro-spectroscopy. Its anticorrosive properties were determined by electrochemical techniques. The film had a layer with nanotube-like porosity with diameters in 500-1000 nm range. The nano layer contained significant amounts of P and O as well as alloying element. Additionally, Raman micro-spectroscopy identified oxygen as oxygen ion in $TiO_2$ anatase and phosphorous as $P_2O_7{^{4-}}$ ion in phosphotitanate compound. All potentiodynamic polarization curves in artificial Carter-Brugirard saliva with pH values (pH= 3.96, 7.84, and 9.11) depending on the addition of 0.05M NaF revealed nobler behavior of anodized alloy and higher polarization resistance indicating the film is thicker and more compact nanolayer. Lower corrosion rates of the anodized alloy reduced toxicity due to less released ions into saliva. Bigger curvature radii in Nyquist plot and higher phase angle in Bode plot for the anodized alloy ascertain a thicker, more protective, insulating nanolayer existing on the anodized alloy. Additionally, ESI results indicate anodized film consists of an inner, compact, barrier, layer and an outer, less protective, porous layer.